Laser machining device and laser machining method

Patent metadata

Field	Value
Publication number	US-9902016-B2
Application number	US-201414778619-A
Country	US
Kind code	B2
Filing date	Mar 13, 2014
Priority date	Mar 27, 2013
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A laser processing device converges laser light at an object to be processed having a silicon part containing silicon mounted on a glass part containing glass with a resin part interposed therebetween so as to form a modified region within the object along a line to cut. The laser processing device comprises a laser light source emitting the laser light, a spatial light modulator modulating the laser light emitted from the laser light source, and a converging optical system converging the laser light modulated by the spatial light modulator at the object. When forming the modified region in the glass part, the spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction.

First claim

The invention claimed is:

1. A laser processing device for converging laser light at an object to be processed having a silicon part containing silicon mounted on a glass part containing glass with a resin part interposed therebetween so as to form a modified region within the object along a line to cut, the laser processing device comprising:
a laser light source emitting the laser light;
a spatial light modulator modulating the laser light emitted from the laser light source; and
a converging optical system converging the laser light modulated by the spatial light modulator at the object;
wherein, when forming the modified region in the glass part, the spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction.

2. A laser processing device according to claim 1 , wherein the laser processing device forms a plurality of modified spots within the object along the line and lets a plurality of the modified regions form the modified region;
wherein, when forming the modified region in the glass part, the spatial light modulator forms modified dots respectively at the plurality of positions juxtaposed close to each other along the laser light irradiation direction; and
wherein a plurality of the modified dots constitute the modified spot elongated in the laser light irradiation direction.

3. A laser processing device according to claim 1 , wherein, in a display part of the spatial light modulator, the axicon lens pattern has a circular region located at a center of the laser light incident thereon and a plurality of circular ring regions demarcated about the center region concentrically with the circular region; and
wherein each of the circular region and the plurality of circular ring regions is set such as to increase brightness gradually from radially outer side to inner side.

4. A laser processing device according to claim 1 , further comprising a controller controlling the laser light;
wherein the controller controls a position of a converging point of the laser light so as to form the modified region within the glass part, only in a part on the silicon part side from a center of the glass part, in the laser light irradiation direction.

5. A laser processing device according to claim 1 , wherein, when forming the modified region in the resin part, the spatial light modulator displays an axicon lens pattern as a modulation pattern, so as to converge the laser light such that converging points are formed respectively at a plurality of positions juxtaposed close to each other along the laser light irradiation direction.

6. A laser processing method for converging laser light at an object to be processed having a silicon part containing silicon mounted on a glass part containing glass with a resin part interposed therebetween so as to form a modified region within the object along a line to cut, the method comprising the step of:
forming the modified region in the glass part by modulating the laser light emitted from a laser light source with a spatial light modulator and converging the laser light modulated by the spatial light modulator within the glass part;
wherein the step of forming the modified region in the glass part causes the spatial light modulator to display an axicon lens pattern as a modulation pattern so as to form converging points within the glass part at a plurality of positions juxtaposed close to each other along a laser light irradiation direction.

7. A laser processing device according to claim 2 , wherein, in a display part of the spatial light modulator, the axicon lens pattern has a circular region located at a center of the laser light incident thereon and a plurality of circular ring regions demarcated about the center region concentrically with the circular region; and
wherein each of the circular region and the plurality of circular ring regions is set such as to increase brightness gradually from radially outer side to inner side.

8. A laser processing device according to claim 2 , further comprising a controller controlling the laser light;
wherein the controller controls a position of a converging point of the laser light so as to form the modified region within the glass part, only in a part on the silicon part side from a center of the glass part, in the laser light irradiation direction.

9. A laser processing device according to claim 3 , further comprising a controller controlling the laser light;
wherein the controller controls a position of a converging point of the laser light so as to form the modified region within the glass part, only in a part on the silicon part side from a center of the glass part, in the laser light irradiation direction.

10. A laser processing device according to claim 2 , wherein, when forming the modified region in the resin part, the spatial light modulator displays an axicon lens pattern as a modulation pattern, so as to converge the laser light such that converging points are formed respectively at a plurality of positions juxtaposed close to each other along the laser light irradiation direction.

11. A laser processing device according to claim 3 , wherein, when forming the modified region in the resin part, the spatial light modulator displays an axicon lens pattern as a modulation pattern, so as to converge the laser light such that converging points are formed respectively at a plurality of positions juxtaposed close to each other along the laser light irradiation direction.

12. A laser processing device according to claim 4 , wherein, when forming the modified region in the resin part, the spatial light modulator displays an axicon lens pattern as a modulation pattern, so as to converge the laser light such that converging points are formed respectively at a plurality of positions juxtaposed close to each other along the laser light irradiation direction.

Assignees

• Hamamatsu Photonics Kk

Inventors

• Kawaguchi Daisuke
• HIROSE Tsubasa
• Araki Keisuke

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• C03B33/0222

  Scoring using a focussed radiation beam, e.g. laser · CPC title

• B23K2203/50

  Operations & Transport · mapped topic

• B23K26/0736

  into an oval shape, e.g. elliptic shape · CPC title

• B23K26/0057 Primary

  Operations & Transport · mapped topic