Tailored blank for hot stamping, hot stamped member, and methods for manufacturing same

US9901969B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9901969-B2
Application numberUS-201314385559-A
CountryUS
Kind codeB2
Filing dateMar 28, 2013
Priority dateMar 28, 2012
Publication dateFeb 27, 2018
Grant dateFeb 27, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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A tailored blank for hot stamping includes a welded portion formed by butt-welding a first aluminum-plated steel sheet and a second aluminum-plated steel sheet, an Average Al concentration of a weld metal in the welded portion is in a range of 0.3 mass % to 1.5 mass %, an Ac 3 point of the weld metal is 1250° C. or lower, and furthermore, an aluminum layer formed during the butt-welding is present on a surface of the welded portion.

First claim

Opening claim text (preview).

The invention claimed is: 1. A tailored blank for hot stamping comprising: a welded portion formed by butt-welding a first aluminum-plated steel sheet and a second aluminum-plated steel sheet, wherein an average Al concentration of a weld metal in the welded portion is 0.3 mass % to 1.5 mass %, in the following formula (1), an Ac 3 point of the weld metal defined in unit ° C. is 1250° C. or lower, and an aluminum layer formed during the butt-welding is present on a surface of the welded portion, Ac 3 =910−230×C 0.5 −15.2×Ni+44.7×Si+104×V+31.5×Mo+13.1×W−30×Mn−11×Cr−20×Cu+700×P+400×Al+120×As+400×Ti  Formula (1) where, C, Ni, Si, V, Mo, W, Mn, Cr, Cu, P, Al, As, and Ti in Formula (1) represent amounts of individual elements in the weld metal in mass %, and elements not contained are considered to have an amount of zero in computation. 2. The tailored blank for hot stamping according to claim 1 , wherein, in the following formula (2), Δt M defined in unit of second is 0.5 seconds or longer, Δ ⁢ ⁢ t M = exp ⁢ { 10.6 ⁢ ( C + Si + 5 × Al 24 + Mn 6 + Cu 15 + Ni 12 + Mo 6 + Cr × ( 1 - 0.16 × Cr ) 8 + Δ ⁢ ⁢ H ) - 4.8 } Formula ⁢ ⁢ ( 2 ) where, C, Si, Al, Mn, Cu, Ni, Mo, and Cr in Formula (2) represent amounts of individual elements in the weld metal in mass %, elements not contained are considered to have an amount of zero in computation, and ΔH represents a numeric value defined as described below in accordance with the amount of B in mass % and fN when the fN is set to (0.02−N)/0.02 using the amount of N in the weld metal in mass %, when B≦0.0001, ΔH=0, when 0.0001<B≦0.0002, ΔH=0.03×fN, when 0.0002<B≦0.0003, ΔH=0.06×fN, and when 0.0003<B, ΔH=0.09×fN. 3. The tailored blank for hot stamping according to claim 2 , wherein, an Ac 1 point of the weld metal defined in unit ° C. in the following formula (3) is 860° C. or lower, Ac 1 = exp ⁡ ( 6.5792 - 0.038058 × C + 0.052317 × Si + 0.011872 × Ni - 0.045575 × V + 0.18057 × Al + 0.011442 × W - 0.013403 × Cu + 5.5207 × B + 0.91209 × S

Assignees

Inventors

Classifications

  • Plasma welding · CPC title

  • Inorganic materials other than metals or composite materials · CPC title

  • Wires · CPC title

  • with boron · CPC title

  • one layer being formed of an iron alloy or steel, another layer being formed of aluminium or an aluminium alloy · CPC title

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What does patent US9901969B2 cover?
A tailored blank for hot stamping includes a welded portion formed by butt-welding a first aluminum-plated steel sheet and a second aluminum-plated steel sheet, an Average Al concentration of a weld metal in the welded portion is in a range of 0.3 mass % to 1.5 mass %, an Ac 3 point of the weld metal is 1250° C. or lower, and furthermore, an aluminum layer formed during the butt-welding is pre…
Who is the assignee on this patent?
Nippon Steel & Sumitomo Metal Corp
What technology area does this patent fall under?
Primary CPC classification C22C38/38. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).