Removable board with cooling system for chassis-based electronic equipment

Patent metadata

Field	Value
Publication number	US-9901007-B1
Application number	US-201514700220-A
Country	US
Kind code	B1
Filing date	Apr 30, 2015
Priority date	Apr 30, 2015
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

A system may include a removable board that is adapted for inserting into and removing from an enclosure, an electronic component that is attached to the removable board, and a cooling system that is attached to the removable board. The cooling system may include a first heat exchanger that is attached to the electronic component by a physical interface. The cooling system may include a coolant pipe that that is at least partially filled with a working fluid to receive heat, generated by the electronic component, via the first heat exchanger. The cooling system may include a second heat exchanger, attached to the coolant pipe and situated to be located outside of the enclosure when the removable board is inserted into the enclosure. The cooling system may be adapted to remain attached to the removable board when inserting and removing the removable board.

First claim

What is claimed is:

1. A system, comprising: an enclosure; and a plurality of removable boards inserted within the enclosure, the plurality of removable boards comprising: a set of vertical removable boards associated with a first set of external heat exchanges, and a set of horizontal removable boards associated with a second set of external heat exchangers, and a removable board of the plurality of removable boards comprising: a substrate; an electronic component attached to the substrate; an internal heat exchanger to receive heat from the electronic component, the internal heat exchanger being attached to at least one of the electronic component or the removable board; a coolant pipe that is at least partially filled with a working fluid and that is attached to the internal heat exchanger; an external heat exchanger that is located external to the enclosure and that is attached to the coolant pipe to dissipate the heat from the electronic component, the heat from the electronic component being dissipated by a fan device located external to the enclosure, the fan device including a cooling unit or an air conditioning unit to cool air before moving the air across the external heat exchanger, and the fan device being one of a set of fan devices, a first set of fan devices, of the set of fan devices, to move air to cool a set of fins of the first set of external heat exchangers, and a second set of fan devices, of the set of fan devices, to move air to cool a set of fins of the second set of external heat exchangers; and a pump device, attached to the coolant pipe, to impel the working fluid toward the external heat exchanger; and the removable board facilitating insertion into and removal from the enclosure without removing any component of the removable board.

2. The system of claim 1 , where the removable board is a first removable board; and
where the system further comprises:
a first electrical board connector that is attached to the first removable board;
a second removable board of the plurality of removable boards; and
a second electrical board connector that is attached to the second removable board,
the second removable board connecting to the first removable board via the first electrical board connector and the second electrical board connector.

3. The system of claim 2 , where the first removable board is oriented in a first orientation; and
where the second removable board is oriented in a second orientation that is different than the first orientation.

4. The system of claim 1 , where the external heat exchanger further comprises a plurality of fins that are oriented in a uniform orientation.

5. The system of claim 4 , where the fan device is oriented to move air in a direction that is parallel to the uniform orientation.

6. The system of claim 1 , where the internal heat exchanger includes an evaporator component to evaporate the working fluid from a liquid state to a gaseous state; and
where the external heat exchanger includes a condenser component to condense the working fluid from the gaseous state to the liquid state.

7. The system of claim 1 , where the internal heat exchanger is further to:
transfer the heat from the electronic component to the working fluid.

8. The system of claim 1 , where one or more fan devices are situated to cool multiple heat exchangers.

9. The system of claim 1 , where the working fluid is moved to the internal heat exchanger to dissipate heat from the electronic component.

10. A removable board, that is adapted to be inserted into and to be removed from an enclosure, comprising: a substrate; an electronic component attached to the substrate; an internal heat exchanger that shares a physical interface with the electronic component to dissipate heat generated by the electronic component; a coolant pipe attached to the internal heat exchanger, the coolant pipe being at least partially filled with a working fluid; an external heat exchanger that is attached to the coolant pipe to dissipate heat from the working fluid, the external heat exchanger being situated externally to the enclosure when the removable board is inserted into the enclosure, and the heat from the working fluid being dissipated by a fan device located external to the enclosure, the fan device including a cooling unit or an air conditioning unit to cool air before moving the air across the external heat exchanger, and the fan device being one of a set of fan devices, a first set of fan devices, of the set of fan devices, to move air to cool a set of fins of a first set of external heat exchangers associated with a set of vertical removable boards, and a second set of fan devices, of the set of fan devices, to move air to cool a set of fins of a second set of external heat exchangers associated with a set of horizontal removable boards; and a pump device, attached to the coolant pipe, to impel the working fluid toward the external heat exchanger.

11. The removable board of claim 10 , where the external heat exchanger further comprises: a plurality of fins that are oriented in a uniform orientation.

12. The removable board of claim 10 , where the internal heat exchanger includes an evaporator component to evaporate the working fluid from a liquid state to a gaseous state; and where the external heat exchanger includes a condenser component to condense the working fluid from the gaseous state to the liquid state.

13. The removable board of claim 10 , where the removable board is oriented in a first orientation; and
where the removable board further comprises:
one or more electrical board connectors to connect the removable board to one or more other removable boards,
the one or more other removable boards being oriented in a second orientation that is different than the first orientation.

14. The removable board of claim 10 , where the working fluid remains in a particular state.

15. A system comprising: a plurality of removable boards comprising: a set of vertical removable boards associated with a first set of external heat exchangers; and a set of horizontal removable boards associated with a second set of external heat exchangers, a removable board, of the plurality of removable boards being, adapted for inserting into and removing from an enclosure; an electronic component that is attached to the removable board; and a cooling system that is attached to the removable board, the cooling system comprising: an internal heat exchanger that is attached to the electronic component by a physical interface; a coolant pipe that is at least partially filled with a working fluid to receive heat, generated by the electronic component, via the internal heat exchanger; an external heat exchanger, attached to the coolant pipe and situated to be located outside of the enclosure when the removable board is inserted into the enclosure, the heat being dissipated by a fan device located external to the enclosure, the fan device including a cooling unit or an air conditioning unit to cool air before moving the air across the external heat exchanger, and the fan device being one of a set of fan devices, a first set of fan devices, of the set of fan devices, to move air to cool a set of fins of the first set of external heat exchangers, and a second set of fan devices, of the set of fan devices, to move air to cool a set of fins of the second set of external heat exchangers; and a pump device, attached to the coolant pipe, to impel the working fluid toward the external heat exchanger; and the cooling system being adapted to remain attached to the removable board when inserting and removing the removable board.

Assignees

• Juniper Networks Inc

Inventors

• Reynov Boris
• Siddhaye Shreeram
• Penmetsa Venkata S Raju

Classifications

• H05K7/20309 Primary

  Evaporators · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20318

  Condensers · CPC title

• H05K7/20136

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title

• H05K7/1427

  Housings · CPC title