Buttoned soldering pad for use with fine-pitch hot bar soldering

Patent metadata

Field	Value
Publication number	US-9900982-B2
Application number	US-201414539545-A
Country	US
Kind code	B2
Filing date	Nov 12, 2014
Priority date	Nov 12, 2013
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.

First claim

The invention claimed is:

1. A buttoned soldering pad system comprising:
a first soldering pad having a first surface and a second surface; and
a plurality of first button heads protruding from a first surface of the soldering pad, the plurality of first button heads each being spaced apart from each other;
a center substrate having a first side and a second side;
the soldering pad having the second surface of the soldering pad located on the first side of the center substrate;
a second soldering pad having a plurality of second button heads protruding from a first surface of the second soldering pad, the plurality of second button heads each being spaced apart from each other and aligned with a corresponding first button head, a second surface of the second soldering pad being located on the second side of the center substrate, the first side of the center substrate being opposite of the second side of the center substrate such that the first buttons protrude in a direction opposite from the second buttons; and
a button core member extending between the aligned first button head and second button head, the button core being thermally and electronically conductive.

2. The buttoned soldering pad system of claim 1 , wherein each first button head has a width dimension that is larger than a width dimension of the first soldering pad.

3. The buttoned soldering pad system of claim 1 , wherein each first button head, button core and second button head combination is an integrated member.

4. The buttoned soldering pad system of claim 1 , wherein each first button head, button core and second button head include separate members that are coupled together.

5. The buttoned soldering pad system of claim 1 , wherein:
the first soldering pad having a first soldering pad aperture extending therethrough for each first button head;
the second soldering pad having a second soldering pad aperture extending therethrough for each second button head;
the center substrate includes one or more substrate apertures extending therethrough; and
each first button head having a button core extending through a first soldering pad aperture, through a substrate aperture, and through a second soldering pad aperture to a corresponding second button head.

6. The buttoned soldering pad system of claim 1 , wherein the first soldering pad includes a plurality of first soldering pad apertures extending therethrough, each button core extending through one first soldering pad aperture to the corresponding second button head.

7. An electronic device comprising:
the buttoned soldering pad system of claim 1 ; and
electronic traces on a substrate that are electronically coupled with the first soldering pad.

8. An electronic device comprising:
the buttoned soldering pad system of claim 5 ; and
electronic traces on the center substrate that are electronically coupled with the first soldering pad and/or second soldering pad.

9. An electronic device comprising:
a first electronic component having a first buttoned soldering pad;
a second electronic component having a second buttoned soldering pad, the first and second buttoned soldering pads being configured according to buttoned soldering pad system of claim 1 ; and
a first solder located around a first button head of the first buttoned soldering pad and located around a second button head of the second buttoned soldering pad.

10. The electronic device of claim 9 , further comprising:
the first electronic component having a third buttoned soldering pad;
the second electronic component having a fourth buttoned soldering pad, the third and fourth buttoned soldering pads being configured according to the first and second buttoned soldering pads; and
a second solder located around a third button head of the third buttoned soldering pad and located around a fourth button head of the fourth buttoned soldering pad; and
a gap between the first and second solder.

11. The electronic device of claim 10 , wherein,
the first buttoned soldering pad and third buttoned soldering pad are electronically isolated from each other by the gap; and
the second buttoned soldering pad and fourth buttoned soldering pad are electronically isolated from each other by the gap.

12. The buttoned soldering pad system of claim 1 , wherein each first button head has a width dimension that is smaller than a width dimension of the first soldering pad.

13. The buttoned soldering pad system of claim 1 , wherein each first button head has a width dimension that is about the same size of a width dimension of the first soldering pad.

14. The buttoned soldering pad system of claim 1 , wherein the first soldering pad has an elongate rectangle shape, and the plurality of first button heads are linearly arranged along the first soldering pad.

15. The buttoned soldering pad system of claim 1 , wherein the first button heads each have a first button head top and the second button heads each have a second button head top, the distance from first button head top to second button head top is about 150 microns+/−20%.

16. The buttoned soldering pad system of claim 2 , wherein the first button heads each have a first button head top and the second button heads each have a second button head top, the distance from first button head top to second button head top is about 150 microns+/−20%.

17. The buttoned soldering pad system of claim 5 , wherein the first button heads each have a first button head top and the second button heads each have a second button head top, the distance from first button head top to second button head top is about 150 microns+/−20%.

18. The electronic device of claim 8 , wherein the first button heads each have a first button head top and the second button heads each have a second button head top, the distance from first button head top to second button head top is about 150 microns+/−20%.

19. The buttoned soldering pad system of claim 1 , wherein the first button heads each have a first button head top, the distance from first button head top to the first surface of the first soldering pad is about 5 microns to about 50 microns+/−20%.

20. The buttoned soldering pad system of claim 1 , wherein the first soldering pad and first button heads are electrically conductive.

21. The buttoned soldering pad system of claim 1 , wherein the first soldering pad and first button heads are copper.

22. The buttoned soldering pad system of claim 14 , wherein the first soldering pad and first button heads are electrically conductive.

23. The buttoned soldering pad system of claim 14 , wherein the first soldering pad and first button heads are copper.

24. The buttoned soldering pad system of claim 1 , wherein the plurality of first button heads are linearly arranged along the first soldering pad.

Assignees

• Finisar Corp

Inventors

• Nguyen Henry
• Zhou Yuxin
• Gek Teng Tay

Classifications

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title

• H01L2924/0002

  Electricity · mapped topic

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K2203/0465

  Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads · CPC title

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title