Housing of electronic device and electronic device

Patent metadata

Field	Value
Publication number	US-9900413-B2
Application number	US-201414223080-A
Country	US
Kind code	B2
Filing date	Mar 24, 2014
Priority date	Mar 27, 2013
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

An housing of electronic device, includes a resin molded housing with an opening there through, a sheet metal positioned within the opening and a water proofing tape positioned on a side of the sheet metal, wherein a periphery of the sheet metal and an entirety of the water proofing tape are encased within the resin molded housing so as to seal the opening in a water tight manner, and, a front central portion of the sheet metal and a rear central portion of the sheet metal are exposed.

First claim

What is claimed is:

1. An housing of electronic device, comprising:
a sheet metal on which a heat activated tape, with a first opening, is stuck; and
a resin molded housing, with a second opening, formed so that at least one of a first side of the heat activated tape and a second side of the heat activated tape is covered with and contacting with the resin molded housing in thickness direction of the heat activated tape and that at least part of the sheet metal is exposed through the first opening of the heat activated tape and the second opening of the resin modeled housing, the first side of the heat activated tape being a side along an outer circumference of the heat activated tape, the second side of the heat activated tape being a side along an inner circumference of the first opening of the heat activated tape.

2. The housing according to claim 1 , wherein the part of the sheet metal which is exposed is facing an exterior of the electronic device.

3. The housing according to claim 1 , wherein the sheet metal includes tabs extending from the periphery, each of the tabs having a mold mounting opening therein.

4. The housing according to claim 1 , wherein a second heat activated tape is, independently of the heat activated tape, stuck on a second sheet metal, and the second heat activated tape is provided with an opening that exposes the second sheet metal.

5. The housing according to claim 4 , wherein the sheet metal and second sheet metal are each provided with a mold mounting hole,
wherein at least one of the heat activated tape and second heat activated tape comprise a waterproofing tape, and the waterproofing tape is stuck across at least one of the sheet metal and the second sheet metal so that the sheet metal and the second sheet metal are arranged at a predetermined distance from each other, and
wherein openings that expose the sheet metal and the second sheet metal are provided in parts of the waterproofing tape stuck to the sheet metal and the second sheet metal.

6. The housing according to claim 4 , wherein the sheet metal and second sheet metal are embedded in the housing by insert molding.

7. An electronic device, comprising:
a sheet metal on which a heat activated tape, with a first opening, is stuck and a second part on which the heat activated tape is not stuck; and
a resin molded housing, with a second opening, formed so that at least one of a first side of the heat activated tape and a second side of the heat activated tape is covered with contacting with the resin molded housing in thickness direction of the heat activated tape and that at least part of the sheet metal is exposed through the first opening of the heat activated tape and the second opening of the resin modeled housing, the first side of the heat activated tape being a side along an outer circumference of the heat activated tape, the second side of the heat activated tape being a side along an inner circumference of the first opening of the heat activated tape.

8. The electronic device according to claim 7 , further comprising:
a circuit board within the housing having a spring contact mounted thereon;
the spring contact directly contacting the rear central portion of the sheet metal to provide electrical contact between the sheet metal and the circuit board.

9. The housing according to claim 1 , wherein the heat activated tape is covered with and contacting with the resin molded housing entirely except for a surface sticking on the sheet metal.

10. The housing according to claim 1 , wherein a heat of a resin, forming the resin molded housing, in molding process causes activation of the heat activated tape so that at least one of the first side and the second side of the heat activated tape is covered with and contacting with the resin molded housing.

Assignees

• Fujitsu Ltd

Inventors

• Iijima Takashi

Classifications

• H04M1/0277

  for a printed circuit board assembly · CPC title

• H04M1/18 Primary

  Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment (H04M1/19 takes precedence) · CPC title