System for depositing one or more layers on a substrate supported by a carrier and method using the same

US9899635B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9899635-B2
Application numberUS-201415113752-A
CountryUS
Kind codeB2
Filing dateFeb 4, 2014
Priority dateFeb 4, 2014
Publication dateFeb 20, 2018
Grant dateFeb 20, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.

First claim

Opening claim text (preview).

The invention claimed is: 1. A system for depositing one or more layers, on a substrate supported by a carrier, the system comprising: a first load lock chamber; a first transfer chamber; a first vacuum substrate orientation chamber between the first load lock chamber and the first transfer chamber; a first swing module fixedly disposed in the first vacuum substrate orientation chamber, wherein the first swing module is configured to load a substrate onto a carrier in an essentially horizontal orientation and to change the orientation of the substrate and the carrier from the essentially horizontal orientation to a vertical orientation or to an orientation deviating from the vertical orientation by 10° or less; at least one vacuum deposition chamber wherein the at least one vacuum deposition chamber is connected to the first transfer chamber; a second load lock chamber; a second transfer chamber; a second vacuum substrate orientation chamber between the second load lock chamber and the second transfer chamber; a substrate transportation system configured to transport the carrier, and a substrate thereon, between the first swing module in the first vacuum substrate orientation chamber and the second vacuum orientation chamber; a second swing module fixedly disposed in the second vacuum substrate orientation chamber, wherein the second swing module is configured to change the orientation of a substrate and a carrier from a vertical orientation or an orientation deviating from the vertical orientation by 10° or less to an essentially horizontal orientation and to unload the essentially horizontal substrate from the carrier; and a carrier return track extending from the second vacuum substrate orientation chamber to the first vacuum substrate orientation chamber. 2. The system according to claim 1 , wherein the first transfer chamber and the second transfer chamber are configured for essentially vertical substrate transportation therethrough. 3. The system according to claim 1 , wherein the first load lock chamber is configured for essentially horizontal substrate handling. 4. The system according to claim 1 , wherein the substrate transportation system further includes at least two linear substrate transportation paths, and wherein the at least one vacuum deposition chamber includes at least a first deposition chamber and a second deposition chamber each connected to a respective one of the first transfer chamber and the second transfer chamber. 5. The system according to claim 1 , further comprising one or more of the chambers selected from the group consisting of: a pre-treatment chamber, a layer inspection chamber, a mask shelf chamber, and a carrier buffer chamber. 6. The system according to claim 4 , wherein the carrier return track is provided between the at least two linear substrate transportation paths. 7. The system according to claim 1 , wherein the at least one vacuum deposition chamber is provided between the first transfer chamber and the second transfer chamber. 8. The system according to claim 1 , further comprising: a carrier return track provided in a chamber assembly connected to the first transfer chamber and the second transfer chamber and adapted to return the carriers under vacuum conditions or under a controlled inert atmosphere from the second vacuum substrate orientation chamber to the first vacuum substrate orientation chamber. 9. The system according to claim 1 , wherein the at least one vacuum deposition chamber comprises: an evaporation source, disposed in the vacuum deposition chamber, the evaporation source comprising: an evaporation crucible; and a distribution pipe with one or more outlets, wherein the distribution pipe is in fluid communication with the evaporation crucible and wherein the distribution pipe is rotatable around an axis during evaporation; and wherein a portion of the carrier transportation system disposed in the vacuum deposition chamber comprises at least two transportation tracks configured to transport a substrate in a vertical orientation or in an orientation deviating from the vertical orientation by 10° or less. 10. The system according to claim 9 , further comprising: a maintenance vacuum chamber connected to the at least one vacuum deposition chamber; and a vacuum valve disposed between the at least one vacuum deposition chamber and the maintenance vacuum chamber, wherein the evaporation source can be transferred between the at least one vacuum deposition chamber and the maintenance vacuum chamber. 11. The system according to claim 9 , wherein the evaporation source further comprises: a support coupled to the distribution pipe and a first drive configured to provide translational movement to the support and the distribution pipe. 12. The system according to claim 10 , wherein the evaporation source further comprises a second drive, wherein the second drive provides rotational movement to the distribution pipe about the longitudinal axis thereof. 13. A method of depositing one or more layers in a system for depositing one or more layers on a substrate supported by a carrier, comprising: loading the substrate into the system in an essentially horizontal orientation; loading the essentially horizontal substrate onto the carrier, wherein the carrier is disposed on a first swing module fixedly disposed in a first substrate orientation chamber; changing the orientation of the carrier, and the substrate loaded thereon, from the essentially horizontal orientation to a vertical orientation or to an orientation deviating from the vertical orientation by 10° or less using the first swing module; transferring the carrier, and the substrate loaded thereon, through the deposition system including transferring the carrier, and the substrate loaded thereon, into and out of at least one deposition chamber under vacuum conditions, wherein transferring the carrier, and the substrate loaded thereon, comprises maintaining the substrate in the vertical orientation or the orientation deviating from the vertical orientation by 10° or less, and wherein the substrate remains loaded on the carrier between transferring the carrier into and out of the at least one deposition chamber; transferring the carrier, and the substrate loaded thereon, into a second vacuum substrate orientation chamber; changing the orientation of the carrier, and the substrate loaded thereon, from the vertical orientation or to an orientation deviating from the vertical orientation by 10° or less to an essentially horizontal orientation using a second swing module fixedly disposed in the second vacuum substrate orientation chamber; unloading the essentially horizontal substrate from the carrier in the second vacuum substrate orientation chamber; and returning the empty carrier under at least one of vacuum conditions and under a controlled inert atmosphere, wherein returning the empty carrier comprises transferring the empty carrier from the second vacuum substrate orientation chamber to the first vacuum substrate orientation chamber. 14. The system according to claim 1 , wherein the second load lock chamber is configured for essentially horizontal substrate handling. 15. The system according to claim 1 , wherein the system is a system for depositing one or more layers comprising organic materials. 16. The system according to claim 12 , wherein the the second drive further provides the rotational movement to the evaporation crucible, and wherein the rotational movement is relative to the support. 17. The method of claim 13 , further comprising dep

Assignees

Inventors

Classifications

  • Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers · CPC title

  • Horizontal transfer of a single workpiece · CPC title

  • Mechanical parts of transfer devices · CPC title

  • using a general scheme of a conveying path within a factory · CPC title

  • Changing orientation of the substrate, e.g. from a horizontal position to a vertical position · CPC title

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What does patent US9899635B2 cover?
A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a …
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification C23C14/042. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).