Anisotropic conductive member and multilayer wiring substrate

Patent metadata

Field	Value
Publication number	US-9899306-B2
Application number	US-201715401778-A
Country	US
Kind code	B2
Filing date	Jan 9, 2017
Priority date	Jul 11, 2014
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.

First claim

What is claimed is:

1. An anisotropic conductive member comprising:
an insulating base which is made of an inorganic material;
a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state; and
a pressure sensitive adhesive layer which is provided on a surface of the insulating base,
wherein each of the conductive paths has a protrusion which protrudes from the surface of the insulating base,
wherein an end of the protrusion of each of the conductive paths protrudes from the surface of the pressure sensitive adhesive layer, and
wherein an absolute value of a difference between the height of the protrusion of each of the conductive paths and the thickness of the pressure sensitive adhesive layer is 0 nm to 50 nm.

2. The anisotropic conductive member according to claim 1 ,
wherein an aspect ratio of the protrusion of each of the conductive paths is 0.01 or more and less than 20, and
wherein the aspect ratio is a ratio of height to diameter of the protrusion.

3. The anisotropic conductive member according to claim 2 ,
wherein the height of the protrusion of each of the conductive paths is 50 nm to 1,500 nm.

4. The anisotropic conductive member according to claim 3 ,
wherein a thickness of the pressure sensitive adhesive layer is 50 nm to 1,500 nm.

5. The anisotropic conductive member according to claim 2 ,
wherein a thickness of the pressure sensitive adhesive layer is 50 nm to 1,500 nm.

6. The anisotropic conductive member according to claim 1 ,
wherein the height of the protrusion of each of the conductive paths is 50 nm to 1,500 nm.

7. The anisotropic conductive member according to claim 6 ,
wherein a thickness of the pressure sensitive adhesive layer is 50 nm to 1,500 nm.

8. The anisotropic conductive member according to claim 1 ,
wherein a thickness of the pressure sensitive adhesive layer is 50 nm to 1,500 nm.

9. The anisotropic conductive member according to claim 1 ,
wherein the pressure sensitive adhesive layer is a layer which contains a polymer material having a thermal expansion coefficient of less than 50×10 −6 K −1 .

10. The anisotropic conductive member according to claim 9 ,
wherein the polymer material is at least one resin material selected from the group consisting of polyimide resins and epoxy resins.

11. A multilayer wiring substrate in which the anisotropic conductive member according to claim 1 and a wiring substrate which is electrically connected to the conductive material of the anisotropic conductive member via an electrode are laminated.

12. The multilayer wiring substrate according to claim 11 which is used as an interposer for a semiconductor package.

13. . The anisotropic conductive member according to claim 1 , wherein the absolute value of the difference between the height of the protrusion of each of the conductive paths and the thickness of the pressure sensitive adhesive layer is greater than 0 nm such that a surface level of the conductive path is not in a same plane with a surface level of the pressure sensitive layer.

14. . The anisotropic conductive member according to claim 1 , wherein each of the conductive paths protrudes over a surface of the pressure sensitive adhesive layer by an amount over 0 nm but less than or equal to 50 nm.

Assignees

• Fujifilm Corp

Inventors

• Hotta Yoshinori
• Kurooka Shunji
• Yamashita Kosuke

Classifications

• H10W78/00

  Detachable holders for supporting packaged chips in operation · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/095

  of vias therein · CPC title

• H10W70/685 Primary

  comprising multiple insulating layers · CPC title

• H01L23/49822 Primary

  Electricity · mapped topic