Top-side cooling of RF products in air cavity composite packages

Patent metadata

Field	Value
Publication number	US-9899292-B2
Application number	US-201615231922-A
Country	US
Kind code	B2
Filing date	Aug 9, 2016
Priority date	Feb 5, 2016
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

Top-side cooling of Radio Frequency (RF) products in air cavity packages is provided. According to one aspect, an air cavity package comprises a substrate, a RF component mounted to the substrate, and a lid structure comprising a first material and being mounted to the substrate that covers the RF component such that a cavity is formed within the lid structure and about the RF component. At least one opening is provided in a top portion of the lid. The air cavity package also comprises a heat transfer structure comprising a second material and comprising a heat path extending from the top surface of the substrate through the opening(s) in the lid to the top outer surface of the air cavity package to provide a top-side thermal interface. In one embodiment, the lid is comprised of a molded material that absorbs RF signals and the heat transfer structure is metal.

First claim

What is claimed is:

1. An air cavity composite package, comprising:
a substrate;
a radio frequency (RF) component mounted to the substrate;
a lid structure comprising a first material and being mounted to the substrate and covering the RF component such that a cavity is formed within the lid structure and about the RF component, wherein at least one opening is provided in a top portion of the lid; and
a heat transfer structure, proximate to the RF component, comprising a heat path extending from a top surface of the substrate through the at least one opening in the lid to a top outer surface of the air cavity package to provide a top-side thermal interface, the heat transfer structure comprising a second material different from the first material.

2. The air cavity composite package of claim 1 wherein the substrate contains signal carrying components and the lid contains no signal carrying components.

3. The air cavity composite package of claim 1 wherein the substrate comprises a horizontal heat spreader and both of the lid structure and the RF component are mounted to the horizontal heat spreader.

4. The air cavity composite package of claim 1 wherein the substrate comprises a thermally insulating layer that prevents or reduces heat flow to a bottom side of the air cavity package.

5. The air cavity composite package of claim 1 wherein the substrate comprises heat transfer structures that provide or enhance heat flow to a bottom side of the air cavity package.

6. The air cavity composite package of claim 1 wherein the RF component comprises a chip die.

7. The air cavity composite package of claim 1 wherein the RF component operates as a radio frequency transmit or receive channel.

8. The air cavity composite package of claim 1 wherein the lid comprises a top structure that includes the at least one opening and at least one side wall that extends from the top structure to the substrate.

9. The air cavity composite package of claim 1 wherein the lid is comprised of a molded component.

10. The air cavity composite package of claim 1 wherein the first material is comprised of insulating or RF absorptive materials to control reflections and transmissions within the cavity.

11. The air cavity composite package of claim 1 wherein the heat transfer structure is comprised of metal.

12. The air cavity composite package of claim 1 wherein the heat path contacts the top surface of the substrate proximate to the RF component.

13. The air cavity composite package of claim 1 wherein the heat path forms an internal wall of the package.

14. The air cavity composite package of claim 1 wherein the heat path is a component of an external wall of the package.

15. The air cavity composite package of claim 1 wherein the top-side thermal interface comprises fins.

16. The air cavity composite package of claim 1 wherein the top-side thermal interface resides over the top portion of the lid structure.

17. The air cavity composite package of claim 16 wherein the heat transfer structure comprises a plurality of heat paths, each of the plurality of heat paths extending from the top-side thermal interface through a respective one of the at least one openings in the lid.

18. The air cavity composite package of claim 1 wherein the lid structure, heat transfer structure, and substrate form a plurality of cavities, each cavity having a respective RF component mounted to the substrate within the cavity.

19. The air cavity composite package of claim 18 wherein each RF component operates as a RF transmit or receive channel such that each channel is contained within its separate respective cavity.

20. A method for top-side cooling of Radio Frequency (RF) products in air cavity packages, the method comprising:
providing a substrate;
mounting a RF component to the substrate;
mounting to the substrate a lid structure comprising a first material and covering the RF component such that a cavity is formed within the lid structure and about the RF component, wherein at least one opening is provided in a top portion of the lid; and
providing a heat transfer structure comprising a heat path extending from a top surface of the substrate through the at least one opening in the lid to a top outer surface of the air cavity package to provide a top-side thermal interface, the heat transfer structure comprising a second material different from the first material.

Assignees

• Qorvo Us Inc

Inventors

• Chiu Anthony
• Steinbeiser Craig
• Krutko Oleh
• Beall John

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W44/251

  for monolithic microwave integrated circuits [MMIC] · CPC title

• H10W44/209

  Vertical interconnections, e.g. vias · CPC title

• H10W76/153

  having interconnections in passages through the insulating or insulated base · CPC title