Bendable glass stack assemblies, articles and methods of making the same

Patent metadata

Field	Value
Publication number	US-9898046-B2
Application number	US-201715398372-A
Country	US
Kind code	B2
Filing date	Jan 4, 2017
Priority date	Jan 29, 2014
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

A glass element having a thickness from 25 μm to 125 μm, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress σI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

First claim

What is claimed is:

1. A foldable electronic device article, comprising:
an electronic device having a foldable feature, the foldable feature comprising:
a substrate having a thickness from about 25 μm to about 125 μm, the substrate further comprising:
(a) a first primary surface; and
(b) a second primary surface,
wherein the substrate is characterized by:
(a) a pencil hardness of greater than or equal to 8H;
(b) a puncture resistance of greater than about 1.5 kgf when the first primary surface of the substrate is loaded with a tungsten carbide ball having a diameter of 1.5 mm; and one or more of:
(c1) an absence of failure when the substrate is held at a bend radius from about 3 mm to about 10 mm for at least 60 minutes at about 25° C. and about 50 % relative humidity; and
(c2) an absence of failure when the substrate is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 10 mm, by the parallel plate method.

2. The article of claim 1 , the substrate comprising a plurality of layers.

3. The article of claim 1 , wherein when the first primary surface of the substrate is subject to a 1 kgf load from a Vickers indenter, there is introduced a flaw of ≦100 microns in the first primary surface.

4. The article of claim 1 , wherein the substrate has a Vickers hardness of 550 to 650 kgf/mm 2 .

5. The article of claim 1 , wherein the substrate has a retained B10 bend strength of greater than 800 MPa after contact with a cube corner diamond indenter loaded with 10gf.

6. The article of claim 1 , comprising F/w≦0.076 N/mm, wherein F is the closing force to put the substrate at the target bend radius, and w is the dimension of the substrate in a direction parallel to the axis around which the substrate is bent.

7. The article of claim 1 , wherein the thickness of the substrate is from about 50 μm to about 100 μm.

8. The article of claim 1 , further comprising a coefficient-of-friction-reducing layer disposed on the first primary surface of the substrate.

9. A method of making a stack assembly, comprising the steps:
forming a substrate having a thickness from about 25 μm to about 125 μm, the substrate further comprising:
(a) a first primary surface; and
(b) a second primary surface,
wherein the substrate is characterized by:
(a) a pencil hardness of greater than or equal to 8H; and
(b) a puncture resistance of greater than about 1.5 kgf when the first primary surface of the substrate is loaded with a tungsten carbide ball having a diameter of 1.5 mm; and one or more of:
(c1) an absence of failure when the substrate is held at a bend radius from about 3 mm to about 10 mm for at least 60 minutes at about 25° C. and about 50% relative humidity; and
(c2) an absence of failure when the substrate is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 10 mm, by the parallel plate method.

10. The method of claim 9 , the substrate comprising a plurality of layers.

11. The method of claim 9 , wherein when the first primary surface of the substrate is subject to a 1 kgf load from a Vickers indenter, there is introduced a flaw of ≦100 microns in the first primary surface.

12. The method of claim 9 , wherein the substrate has a Vickers hardness of 550 to 650 kgf/mm 2 .

13. The method of claim 9 , wherein the substrate has a retained B10 bend strength of greater than 800 MPa after contact with a cube corner diamond indenter loaded with 10gf.

14. The method of claim 9 , comprising F/w≦0.076N/mm, wherein F is the closing force to put the substrate at the target bend radius, and w is the dimension of the substrate in a direction parallel to the axis around which the substrate is bent.

Assignees

• Corning Inc

Inventors

• Chang Theresa
• Chu Polly Wanda
• Cimo Patrick Joseph
• Ellison Adam James
• Gross Timothy Michael
• Hu Guangli
• Smith Nicholas James
• Vaddi Butchi Reddy
• Venkataraman Natesan

Classifications

• H04M1/0268

  including a flexible display panel · CPC title

• C03C21/002

  to perform ion-exchange between alkali ions (C03C21/005 takes precedence) · CPC title

• Y10T428/266

  of base or substrate · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• B32B2255/00

  Coating on the layer surface · CPC title