Vehicle vision system with forward viewing camera

US9896039B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9896039-B2
Application numberUS-201514705076-A
CountryUS
Kind codeB2
Filing dateMay 6, 2015
Priority dateMay 9, 2014
Publication dateFeb 20, 2018
Grant dateFeb 20, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.

First claim

Opening claim text (preview).

The invention claimed is: 1. A vehicle vision system comprising: a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with said vision system; wherein said camera module comprises a housing and an imager assembly; wherein said imager assembly comprises a structure and an imager and a lens, and wherein said imager is disposed at an imager circuit board of said imager assembly; a thermal element configured to attach at said structure of said imager assembly, wherein said thermal element comprises a support element and a thermal pad disposed at least partially along said support element; wherein, with said thermal element attached at said structure of said imager assembly, a first portion of said thermal pad is engaged with and in thermal conductivity with said imager circuit board, and wherein, with said imager assembly disposed at said housing of said camera module, a second portion of said thermal pad is engaged with and in thermal conductivity with said housing; wherein said thermal element comprises a clip portion that clips onto said structure of said imager assembly to engage said first portion of said thermal pad with said imager circuit board; and wherein said clip portion is configured so that said second portion of said thermal pad is angled relative to said first portion of said thermal pad, and wherein, with said clip portion clipped onto said structure of said imager assembly and with said imager assembly disposed at said housing of said camera module, said first portion of said thermal pad extends partially along and is pressed into engagement with said imager circuit board and said second portion of said thermal pad extends partially along and is pressed into engagement with said housing. 2. The vehicle vision system of claim 1 , wherein, with said clip portion clipped onto said structure of said imager assembly, said first portion of said thermal pad is parallel to said imager circuit board. 3. The vehicle vision system of claim 2 , wherein, with said imager assembly disposed at said housing of said camera module, said second portion of said thermal pad is parallel to said housing. 4. The vehicle vision system of claim 1 , wherein said thermal pad comprises a resilient material and is compressed when engaged with said imager circuit board and said housing. 5. The vehicle vision system of claim 1 , wherein said thermal pad comprises a thermally conductive material to enhance heat transfer from said imager circuit board to said housing. 6. The vehicle vision system of claim 1 , wherein said structure supports said lens and said imager circuit board and is configured to mount said imager assembly at said housing. 7. A vehicle vision system comprising: a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with said vision system; wherein said camera module comprises a housing and an imager assembly; wherein said imager assembly comprises a structure and an imager and a lens, and wherein said imager is disposed at an imager circuit board of said imager assembly; a thermal element configured to attach at said structure of said imager assembly, wherein said thermal element comprises a support element and a thermal pad disposed at least partially along said support element; wherein, with said thermal element attached at said structure of said imager assembly, a first portion of said thermal pad is engaged with and in thermal conductivity with said imager circuit board, and wherein, with said imager assembly disposed at said housing of said camera module, a second portion of said thermal pad is engaged with and in thermal conductivity with said housing; wherein said structure supports said lens and said imager circuit board and is configured to mount said imager assembly at said housing; and wherein said structure is configured to angle said imager circuit board relative to an upper wall of said housing, and wherein said thermal pad is correspondingly angled such that said first portion of said thermal pad is parallel with said imager circuit board and said second portion of said thermal pad is parallel with said upper wall of said housing. 8. The vehicle vision system of claim 1 , comprising a bracket, wherein said bracket comprises an attachment portion configured to attach at an in-cabin surface of the windshield of the equipped vehicle, and wherein, with said bracket attached at the in-cabin surface of the windshield, said camera module is mountable to said bracket. 9. A vehicle vision system comprising: a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with said vision system; wherein said camera module comprises a housing and an imager assembly; wherein said imager assembly comprises a structure and an imager and a lens, and wherein said imager is disposed at an imager circuit board of said imager assembly; a thermal element configured to attach at said structure of said imager assembly, wherein said thermal element comprises a support element and a thermal pad disposed at least partially along said support element; wherein, with said thermal element attached at said structure of said imager assembly, a first portion of said thermal pad is engaged with and in thermal conductivity with said imager circuit board, and wherein, with said imager assembly disposed at said housing of said camera module, a second portion of said thermal pad is engaged with and in thermal conductivity with said housing; wherein said thermal pad comprises a resilient material and is compressed when engaged with said imager circuit board and said housing; wherein said thermal pad comprises a thermally conductive material to enhance heat transfer from said imager circuit board to said housing; wherein said thermal element comprises a clip portion that clips onto said structure of said imager assembly to engage said first portion of said thermal pad with said imager circuit board; and wherein said clip portion is configured so that said second portion of said thermal pad is angled relative to said first portion of said thermal pad, and wherein, with said clip portion clipped onto said structure of said imager assembly and with said imager assembly disposed at said housing of said camera module, said first portion of said thermal pad extends partially along and is pressed into engagement with said imager circuit board and said second portion of said thermal pad extends partially along and is pressed into engagement with said housing. 10. The vehicle vision system of claim 9 , wherein, with said clip portion clipped onto said structure of said imager assembly, said first portion of said thermal pad is parallel to said imager circuit board, and wherein, with said imager assembly disposed at said housing of said camera module, said second portion of said thermal pad is parallel to said housing. 11. The vehicle vision system of claim 9 , wherein said structure supports said lens and said imager circuit board and is configured to mount said imager assembly at said housing. 12. The vehicle vision system of claim 9 , comprising a bracket, wherein said bracket comprises an attachment portion configured to attach at an in-cabin surface of the windshield of the equipped vehicle, and wherein, with said bracket attached at the in-cabin surface of the windshield, said camera module is mountable to said bracket. 13. The vehicle vision system of claim 7 , wherein said thermal pad comprises a resilient material and is compressed when engaged with said imager circuit board and said housing. 14. The vehicle vision system of

Assignees

Inventors

Classifications

  • for receiving images from a plurality of remote sources · CPC title

  • B60R11/04Primary

    Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle · CPC title

  • characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

  • Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

  • Electricity · mapped topic

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What does patent US9896039B2 cover?
A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attac…
Who is the assignee on this patent?
Magna Electronics Inc
What technology area does this patent fall under?
Primary CPC classification B60R11/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).