Passive system of powering and cooling with liquid metal and method thereof

Patent metadata

Field	Value
Publication number	US-9894802-B2
Application number	US-201414290267-A
Country	US
Kind code	B2
Filing date	May 29, 2014
Priority date	May 29, 2014
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

Example embodiments disclose a passive system of power and cooling with a liquid metal for a digital system. The passive system may include a digital device operatively coupled to a printed circuit board, a hollow conductive channel body attached to the printed circuit board to circulate the liquid metal to flow within the conductive channel so as to convey electrical power to the digital device during a power loss and transfer heat generated by the digital device, and a tube to deliver the liquid metal in and out of the hollow conductive channel body. A method of operating a liquid metal may involve the use of the passive system.

First claim

The invention claimed is:

1. A passive system of powering and cooling with a liquid metal for a digital system, comprising:
a digital device operatively coupled to a first printed circuit board;
a hollow conductive channel body attached to the first printed circuit board to circulate the liquid metal to flow within the conductive channel body so as to transfer heat generated by the digital device and electrically charging the liquid metal to deliver electrical power to the digital device;
a tube to deliver the liquid metal in and out of the hollow conductive channel body, the tube configured to passively deliver the liquid metal based on a flow that is induced by gravity and density changes in the liquid metal in the event of a loss of primary power; and
a pair of electrodes operatively coupled to the tube to transfer electrons to the liquid metal.

2. The passive system of claim 1 , further comprising a heat exchanger,
wherein the liquid metal enters the heat exchanger and transfers heat to a cooler gas flowing through the heat exchanger.

3. The passive system of claim 2 , wherein the tube including the heated liquid metal enters the heat exchanger to be cooled and then the cooled liquid metal is conveyed back to the digital device to be cooled.

4. The passive system of claim 2 , further comprising a fan in the heat exchanger to enhance transfer of heat.

5. The passive system of claim 2 , wherein the tube creates a closed-loop system, in which the liquid metal circulates between the digital device and the heat exchanger.

6. The passive system of claim 1 , further comprising an electromagnetic pump to increase a flow of the liquid metal.

7. The passive system of claim 1 , further comprising:
a second printed circuit board, the conductive channel body being located between the first and second printed circuit boards,
wherein the liquid metal passes through the conductive channel body to supply power and transfer heat.

8. The passive system of claim 7 , wherein a via tube extends through the conductive channel body and the first and second printed circuit boards.

9. The passive system of claim 8 , wherein the liquid metal is electrically charged such that the electrically charged liquid metal enters and progresses up through the via tube to deliver power to the digital device.

10. The passive system of claim 9 , further comprising an external wire pattern on a surface of a top printed circuit board to connect the via tube and the digital device to deliver power.

11. The passive system of claim 1 , wherein the liquid metal is at least one of pure sodium and a sodium potassium compound.

12. The passive system of claim 1 , wherein the electrodes are respective rods attached to an exterior surface of the tube.

13. A method of powering and cooling with a liquid metal for a digital system, the method comprising:
operatively coupling a digital device to a printed circuit board;
operatively coupling a pair of electrodes to a tube to transfer electrons to the liquid metal, the tube configured to passively deliver the liquid metal based on a flow that is induced by gravity and density changes in the liquid metal in the event of a loss of primary power;
attaching a hollow conductive channel body to the printed circuit board;
circulating the liquid metal to flow through the hollow conductive channel body;
conveying electrical power to the digital device via the liquid metal; and
transferring heat generated by the digital device via the liquid metal.

14. The method of claim 13 , further comprising:
connecting the tube to a heat exchanger.

15. The method of claim 14 , wherein the liquid metal enters the heat exchanger and transfers heat to a cooler gas flowing through the heat exchanger.

16. The method of claim 15 , wherein the cooled liquid metal exiting from the heat exchanger conveyed back to the conductive channel body to cool the digital device.

17. The method of claim 14 , further comprising increasing a flow of the liquid metal in the tube via an electromagnetic pump.

18. The method of claim 13 , further comprising electrically charging the liquid metal to deliver power to the digital device.

19. The method of claim 18 , further comprising a via tube, which extends through the conductive channel body and the printed circuit board.

20. The method of claim 19 , further comprising an external wire pattern on a surface of a top printed circuit board to connect the via tube and the digital device to deliver power.

Assignees

• Loewen Eric Paul
• Cundiff Weston Matthew
• Strege Seth
• Ge Hitachi Nuclear Energy Americas Llc

Inventors

• Loewen Eric Paul
• Cundiff Weston Matthew
• Strege Seth

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H05K1/0272

  Adaptations for fluid transport, e.g. channels, holes · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20272 Primary

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title