Cold plate

Patent metadata

Field	Value
Publication number	US-9894801-B1
Application number	US-201615339710-A
Country	US
Kind code	B1
Filing date	Oct 31, 2016
Priority date	Oct 31, 2016
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.

First claim

What is claimed is:

1. A cold plate for cooling electronics, comprising:
an interface plate configured for arrangement on an electronics assembly, wherein the interface plate comprises a plurality of active areas arranged for alignment over respective heat-generating portions of the electronics assembly and non-active areas between the active areas;
an opposing plate, wherein edges of the interface plate and the opposing plate are joined to form a plenum therebetween, wherein the plenum defines a cooling fluid flow axis from a first end of the plenum to the second end of the plenum, wherein the plenum includes active plenum volumes aligned with the active areas of the interface plate and non-active plenum volumes aligned with the non-active areas of the interface plate, wherein a first width of the active plenum volumes in a first transverse direction to the cooling fluid flow axis is larger than a second width of the non-active plenum volumes in the first transverse direction, and wherein a first thickness of the active plenum volumes in a second transverse direction to the cooling fluid flow axis and orthogonal to the first transverse direction is larger than a second thickness of the non-active plenum volumes; and
a plurality of cooling fins arranged in each of the plurality of active plenum volumes, wherein the surfaces of the cooling fins are arranged along the cooling fluid flow axis.

2. The cold plate of claim 1 , wherein the active plenum volumes are symmetrical in the second direction about a plane bisecting the active plenum, wherein the plane is aligned with the cooling fluid flow axis and the first direction.

3. The cold plate of claim 1 , wherein the active plenum volumes include transition regions, wherein widths of the transition regions change from the first width to the second width along the flow axis between the active plenum volumes and adjacent non-active plenum volumes.

4. The cold plate of claim 1 , further comprising a cooling fluid insertion port arranged at a first end of the opposing plate and a cooling fluid extraction port arranged at a second end of the opposing plate, wherein cooling fluid is flowable into the plenum through the cooling fluid insertion port and is flowable out of the plenum through the cooling fluid extraction port.

5. A cold plate for cooling electronics, comprising:
an interface plate configured for arrangement on an electronics assembly, wherein the interface plate comprises a plurality of active areas arranged for alignment over respective heat-generating portions of the electronics assembly and non-active areas between the active areas;
an opposing plate, wherein edges of the interface plate and the opposing plate are joined to form a plenum therebetween, wherein the plenum defines a cooling fluid flow axis from a first end of the plenum to the second end of the plenum, wherein the plenum includes active plenum volumes aligned with the active areas of the interface plate and non-active plenum volumes aligned with the non-active areas of the interface plate, wherein a first width of the active plenum volumes in a first transverse direction to the cooling fluid flow axis is larger than a second width of the non-active plenum volumes in the first transverse direction; and
a plurality of cooling fins arranged in each of the plurality of active plenum volumes, wherein the surfaces of the cooling fins are arranged along the cooling fluid flow axis, wherein the plurality of cooling fins in each of the active plenum volumes include a central region and side regions arranged on sides of the central direction in the first transverse direction, wherein the surfaces of cooling fins within the central region have a first length along the cooling fluid flow axis, and wherein the surfaces of cooling fins within the side regions have lengths that are shorter than the first length.

6. The cold plate of claim 5 , wherein lengths of the surfaces of the cooling fins of the side regions decrease at greater distances from the central region in the first transverse direction.

7. An electronic assembly, comprising:
a plurality of electrical components arranged in a row, each of the plurality of electrical components including a heat-generating portion; and
a cold plate arranged on the plurality of electrical components, the cold plate comprising:
an interface plate arranged on the plurality of electrical components, wherein the interface plate comprises a plurality of active areas arranged for alignment over respective heat-generating portions of the electrical components and non-active areas between the active areas;
an opposing plate, wherein edges of the interface plate and the opposing plate are joined to form a plenum therebetween, wherein the plenum defines a cooling fluid flow axis from a first end of the plenum to a second end of the plenum, wherein the plenum includes active plenum volumes aligned with the active areas of the interface plate and non-active plenum volumes aligned with the non-active areas of the interface plate, wherein a first width of the active plenum volumes in a first transverse direction to the cooling fluid flow axis is larger than a second width of the non-active plenum volumes in the first transverse direction, wherein a first thickness of the active plenum volumes in a second transverse direction to the cooling fluid flow axis and orthogonal to the first transverse direction is larger than a second thickness of the non-active plenum volumes; and
a plurality of cooling fins arranged in each of the plurality of active plenum volumes, wherein the surfaces of the cooling fins are arranged along the cooling fluid flow axis.

8. The electronics assembly of claim 7 , wherein the active plenum volumes are symmetrical in the second direction about a plane bisecting the active plenum, wherein the plane is aligned with the cooling fluid flow axis and the first direction.

9. The electronics assembly of claim 7 , wherein the active plenum volumes include transition regions, wherein widths of the transition regions change from the first width to the second width along the flow axis between the active plenum volumes and adjacent non-active plenum volumes.

10. The electronics assembly of claim 7 , wherein the plurality of cooling fins in each of the active plenum volumes include a central region and side regions arranged on sides of the central direction in the first transverse direction, wherein the surfaces of cooling fins within the central region have a first length along the cooling fluid flow axis, and wherein the surfaces of cooling fins within the side regions have lengths that are shorter than the first length.

11. The electronics assembly of claim 10 , wherein lengths of the surfaces of the cooling fins of the side regions decrease at greater distances from the central region in the first transverse direction.

12. The electronics assembly of claim 7 , further comprising a cooling fluid insertion port arranged at a first end of the opposing plate and a cooling fluid extraction port arranged at a second end of the opposing plate, wherein cooling fluid is flowable into the plenum through the cooling fluid insertion port and is flowable out of the plenum through the cooling fluid extraction port.

13. An electronic assembly, comprising:
a plurality of electrical components arranged in a row, each of the plurality of electrical components including a heat-generating portion; and
a cold plate arranged on the plurality of electrical components, the cold plate comprising:
an interface plate arranged on the plurality of electrical components, wherein the interface plate comprises a plurality of active areas arrange

Assignees

• IBM

Inventors

• Marroquin Christopher M
• Oconnell Kevin M
• Schultz Mark D
• Tian Shurong

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title