Prepreg, metal-clad laminated plate and printed wiring board

Patent metadata

Field	Value
Publication number	US-9894761-B2
Application number	US-201615173697-A
Country	US
Kind code	B2
Filing date	Jun 5, 2016
Priority date	Jun 12, 2015
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler:

wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0≦x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH 2 Ph or —COO(CH 2 ) 2 Ph in formula (3).

First claim

What is claimed is:

1. A prepreg comprising a resin composition and a woven fabric base material, the resin composition comprising:
(A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton;
(B) a polymer having the structures of formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and
(C) an inorganic filler:

wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0<x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH 2 Ph or —COO(CH 2 ) 2 Ph in formula (3).

2. The prepreg according to claim 1 , wherein a ratio of a loss elastic modulus to a storage elastic modulus is 0.05 or more at a temperature of 60° C. or lower and at a temperature of 200° C. or higher in a cured state.

3. The prepreg according to claim 1 , wherein a tensile elongation in a direction inclined by 45° with respect to a warp yarn or a weft yarn in the woven fabric base material is 5% or more in a cured state.

4. A metal-clad laminate plate comprising:
an insulating layer that is a cured product of the prepreg according to claim 1 ; and
a metal foil provided on the insulating layer.

5. A printed wiring board comprising:
an insulating layer that is a cured product of the prepreg according to claim 1 ; and
a conductive pattern provided on the insulating layer.

6. The prepreg according to claim 1 , wherein an epoxy value of the polymer of component (B) is in the range of from 0.06 eq/kg to 0.8 eq/kg inclusive.

7. The prepreg according to claim 1 , wherein the inorganic filler of component (C) is surface-treated with a silane coupling agent represented by formula (4):
(R6)Si (R5) 3   (4)

wherein R5 represents a methoxy group or an ethoxy group, and R6 represents an aliphatic alkyl group with a carbon number of from 3 to 18 inclusive, the aliphatic alkyl group having a methacryl group, a glycidyl group or an isocyanate group at an end thereof in formula (4).

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Hoshi Takashi
• Kitamura Takeshi
• Kashihara Keiko
• Inoue Hiroharu

Classifications

• H05K1/0366 Primary

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• C08J2433/08

  Homopolymers or copolymers of acrylic acid esters · CPC title

• C08J5/24

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• H05K2201/0133

  Elastomeric or compliant polymer · CPC title