Power module

Patent metadata

Field	Value
Publication number	US-9893642-B2
Application number	US-201715601121-A
Country	US
Kind code	B2
Filing date	May 22, 2017
Priority date	Jun 2, 2016
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A power module includes a multilayer circuit board, and first and second three-phase inverters, which are mounted on the multilayer circuit board to be stacked each other. A positive-electrode-side power source conductive trace of the first three-phase inverter and a negative-electrode-side power source conductive trace of the second three-phase inverter are disposed to at least partially face each other in a stacking direction of the multilayer circuit board, such that currents respectively flow through the power source conductive traces in opposite directions in a facing section. A negative-electrode-side power source conductive trace of the first three-phase inverter and a positive-electrode-side power source conductive trace of the second three-phase inverter are disposed to at least partially face each other in the stacking direction of the multilayer circuit board), such that currents respectively flow through the power source conductive traces in opposite directions in a facing section.

First claim

What is claimed is:

1. A power module comprising:
a multilayer circuit board having a first principal surface and a second principal surface that is on an opposite side of the multilayer circuit board from the first principal surface;
a first three-phase inverter including first U-phase upper and lower arms, first V-phase upper and lower arms, and first W-phase upper and lower arms; and
a second three-phase inverter including second U-phase upper and lower arms, second V-phase upper and lower arms, and second W-phase upper and lower arms,
the first three-phase inverter and the second three-phase inverter being mounted on the multilayer circuit board so as to be stacked each other, wherein

where a positive-electrode-side power source conductive trace and a negative-electrode-side power source conductive trace of the first three-phase inverter are defined as a first positive-electrode-side power source conductive trace and a first negative-electrode-side power source conductive trace, respectively, and a positive-electrode-side power source conductive trace and a negative-electrode-side power source conductive trace of the second three-phase inverter are defined as a second positive-electrode-side power source conductive trace and a second negative-electrode-side power source conductive trace, respectively,
the first positive-electrode-side power source conductive trace and the second negative-electrode-side power source conductive trace are disposed so as to at least partially face each other in a stacking direction of the multilayer circuit board, such that a direction in which a current flows through the first positive-electrode-side power source conductive trace and a direction in which a current flows through the second negative-electrode-side power source conductive trace are opposite to each other, in a facing section in which the first positive-electrode-side power source conductive trace and the second negative-electrode-side power source conductive trace at least partially face each other, and
the first negative-electrode-side power source conductive trace and the second positive-electrode-side power source conductive trace are disposed so as to at least partially face each other in the stacking direction of the multilayer circuit board, such that a direction in which a current flows through the first negative-electrode-side power source conductive trace and a direction in which a current flows through the second positive-electrode-side power source conductive trace are opposite to each other, in a facing section in which the first negative-electrode-side power source conductive trace and the second positive-electrode-side power source conductive trace at least partially face each other.

2. The power module according to claim 1 , wherein
where a U-phase conductive trace connecting the first U-phase upper and lower arms to each other, a V-phase conductive trace connecting the first V-phase upper and lower arms to each other, and a W-phase conductive trace connecting the first W-phase upper and lower arms to each other are respectively defined as a first U-phase conductive trace, a first V-phase conductive trace, and a first W-phase conductive trace, and
where a U-phase conductive trace connecting the second U-phase upper and lower arms to each other, a V-phase conductive trace connecting the second V-phase upper and lower arms to each other, and a W-phase conductive trace connecting the second W-phase upper and lower arms to each other are respectively defined as a second U-phase conductive trace, a second V-phase conductive trace, and a second W-phase conductive trace,
the first U-phase conductive trace and the second U-phase conductive trace are disposed so as to thee each other in the stacking direction of the multilayer circuit board, the first V-phase conductive trace and the second V-phase conductive trace are disposed so as to face each other in the stacking direction of the multilayer circuit board, and the first W-phase conductive trace and the second W-phase conductive trace are disposed so as to face each other in the stacking direction of the multilayer circuit board.

3. The power module according to claim 2 , wherein
the first U-phase upper and lower arms, the first V-phase upper and lower arms, and the first W-phase upper and lower arms are mounted on the first principal surface of the multilayer circuit board,
the second U-phase upper and lower arms, the second V-phase upper and lower arms, and the second W-phase upper and lower arms are mounted on the second principal surface of the multilayer circuit board,
at least the first positive-electrode-side power source conductive trace and the first negative-electrode-side power source conductive trace among the first positive-electrode-side power source conductive trace, the first negative-electrode-side power source conductive trace, the first U-phase conductive trace, the first V-phase conductive trace, and the first W-phase conductive trace are provided in a first inner layer between the first principal surface and the second principal surface of the multilayer circuit board, and
at least the second positive-electrode-side power source conductive trace and the second negative-electrode-side power source conductive trace among the second positive-electrode-side power source conductive trace, the second negative-electrode-side power source conductive trace, the second U-phase conductive trace, the second V-phase conductive trace, and the second W-phase conductive trace are provided in a second inner layer between the second principal surface of the multilayer circuit board and the first inner layer.

4. The power module according to claim 3 , wherein
the first positive-electrode-side power source conductive trace, the first negative-electrode-side power source conductive trace, the first U-phase conductive trace, the first V-phase conductive trace, and the first W-phase conductive trace are provided in the first inner layer, and
the second positive-electrode-side power source conductive trace, the second negative-electrode-side power source conductive trace, the second U-phase conductive trace, the second V-phase conductive trace, and the second W-phase conductive trace are provided in the second inner layer.

5. A power module comprising:
a multilayer circuit board having a first principal surface and a second principal surface that is on an opposite side of the multilayer circuit board from the first principal surface;
a first three-phase inverter including first U-phase upper and lower arms, first V-phase upper and lower arms, and first W-phase upper and lower arms: and
a second three-phase inverter including second U-phase upper and lower arms, second V-phase upper and lower arms, and second W-phase upper and lower arms,
the first three-phase inverter and the second three-phase inverter being mounted on the multilayer circuit board so as to be stacked each other, wherein

where a positive-electrode-side power source conductive trace and a negative-electrode-side power source conductive trace of the first three-phase inverter are defined as a first positive-electrode-side power source conductive trace and a first negative-electrode-side power source conductive trace, respectively, and a positive-electrode-side power source conductive trace and a negative-electrode-side power source conductive trace of the second three-phase inverter are defined as a second positive-electrode-side power source conductive trace and a second negative-electrode-side power source conductive trace, respectively,
the first positive-electrode-side power source conductive trace and the second positive-electrode-side power source conductive trace are disposed so as to at least partially face each other in a stacking direction of the multilayer circuit board, suc

Assignees

• Jtekt Corp

Inventors

• Uchida Nobuhiro
• Nakai Motoo

Classifications

• H02M7/53871

  with automatic control of output voltage or current · CPC title

• H02M7/00 Primary

  Conversion of AC power input into DC power output; Conversion of DC power input into AC power output · CPC title

• H02M1/32

  Means for protecting converters other than automatic disconnection · CPC title

• H02M7/003 Primary

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H02M1/44

  Circuits or arrangements for compensating for electromagnetic interference in converters or inverters · CPC title