Antenna apparatus having first and second antenna elements fed by first and second feeder circuits connected to separate ground conductors
US-8976068-B2 · Mar 10, 2015 · US
US9893427B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9893427-B2 |
| Application number | US-201414213959-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 14, 2014 |
| Priority date | Mar 14, 2013 |
| Publication date | Feb 13, 2018 |
| Grant date | Feb 13, 2018 |
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An antenna-like matching component is provided, comprising one or more conductive portions formed on a substrate. Shapes and dimensions of the one or more conductive portions are determined to provide impedance matching for one or more antennas coupled to the matching component.
Opening claim text (preview).
What is claimed is: 1. A communication system, comprising: one or more antennas, said one or more antennas including at least two antenna feeds, each of the at least two antenna feeds being coupled to a feed path coupling section; an RF front end module coupled to the feed path coupling section via a plurality of RF paths extending therebetween, the plurality of RF paths comprising at least a first RF path and a second RF path; and a matching component coupled to each of the RF paths, respectively; further characterized in that: the matching component comprises: a first driving element coupled to a first solder pad; a first parasitic element coupled to a second solder pad and positioned adjacent to the first driving element; a second driving element coupled to a third solder pad; and a second parasitic element coupled to a fourth solder pad and positioned adjacent to the second driving element; each of the first driving element, first parasitic element, second driving element and second parasitic element being disposed on a substrate; wherein the first solder pad is electrically coupled to the first RF path in shunt; and wherein the third solder pad is electrically coupled to the second RF path in shunt. 2. The communication system of claim 1 , wherein the second solder pad is configured to be electrically coupled to ground, kept open, or coupled to another circuit. 3. The communication system of claim 1 , wherein the fourth solder pad is configured to be electrically coupled to ground, kept open, or coupled to another circuit. 4. The communication system of claim 1 , wherein the substrate comprises a dielectric material. 5. The communication system of claim 1 , wherein the matching component is further coupled to a circuit block, wherein the circuit block comprises one or more electronic components selected from the group consisting of: capacitors, inductors, switches, varactors, and transmission lines. 6. The communication system of claim 5 , wherein the circuit block is configured to vary an impedance associated with the matching component. 7. The communication system of claim 1 , wherein said one or more antennas comprises a single antenna having a plurality of antenna feeds. 8. The communication system of claim 1 , wherein the matching component is further connected to one of the antennas via a transmission line extending therebetween.
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