Intermediate transfer member and image forming apparatus
US-2015078791-A1 · Mar 19, 2015 · US
US9891558B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9891558-B2 |
| Application number | US-201514974269-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 18, 2015 |
| Priority date | Jan 9, 2015 |
| Publication date | Feb 13, 2018 |
| Grant date | Feb 13, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A semiconductive resin composition includes a plurality of thermoplastic resins forming a sea-island structure including a sea portion and an island portion; and a plurality of conductive fillers. The sea portion includes at least two of the thermoplastic resins, at least one of the at least two of the thermoplastic resins is a copolymer, and the content of the copolymer is from 20% to 60% by weight per 100% by weight of the thermoplastic resins in the sea portion, and the following relation is satisfied: 1.5≦ B/A ≦10 wherein A represents an average primary particle diameter of one of the conductive fillers having the smallest average primary particle diameter and B represents an average primary particle diameter of one of the conductive fillers having the largest average primary particle diameter.
Opening claim text (preview).
What is claimed is: 1. A semiconductive resin composition, comprising: a plurality of thermoplastic resins forming a sea-island structure including a sea portion and an island portion; and a plurality of conductive fillers, wherein the sea portion includes at least two of the thermoplastic resins, at least one of the at least two of the thermoplastic resins is a copolymer, and the content of the copolymer is from 20% to 60% by weight per 100% by weight of the thermoplastic resins in the sea portion, and wherein one conductive filler amongst the plurality of conductive fillers is constituted by particles and has average primary particle diameter A that is smallest amongst those of the plurality of conductive fillers, and another conductive filler amongst the plurality of conductive fillers is constituted by particles and has average primary particle diameter B that is largest amongst those of the plurality of conductive fillers, and wherein the average primary particle diameter A of said one conductive filler that is constituted by particles and the average primary particle diameter B of said another conductive filler that is constituted by particles satisfy the following relation: 1.5≦ B/A≦ 10. 2. The semiconductive resin composition of claim 1 , wherein the plurality of conductive fillers are disbursed in both the sea portion and the island portion of the sea-island structure of the thermoplastic resin, and the conductive fillers present in the sea portion accounts for 25% to 60% of all the conductive fillers in terms of cross-sectional areal ratio, said cross-section areal ratio being a ratio of an area occupied by the conductive filler in the island portion to an area occupied by the conductive filler in both of the sea portion and the island portion. 3. The semiconductive resin composition of claim 1 , wherein one of the thermoplastic resins in the sea portion is a polyvinylidene fluoride, and wherein the copolymer comprises: vinylidene fluoride structural units; and hexafluoropropylene structural units in an amount of from 5% to 10% by mol per 100% by mol of the copolymer. 4. The semiconductive resin composition of claim 3 , wherein the copolymer has a melting point of from 140° C. to 160° C. 5. The semiconductive resin composition of claim 3 , wherein the polyvinylidene fluoride has a weight-average molecular weight of from 100,000 to 500,000. 6. The semiconductive resin composition of claim 1 , wherein the thermoplastic resin in the island portion is a block copolymer having a polyalkylene unit and has a saturated moisture absorption quantity not greater than 3%. 7. The semiconductive resin composition of claim 6 , wherein the polyalkylene unit comprises a polypropylene. 8. A seamless belt for use in electrophotography, comprising: the semiconductive resin composition according to claim 1 . 9. An image forming apparatus, comprising: an electrostatic latent image bearer; an electrostatic latent image former to form an electrostatic latent image on the electrostatic latent image bearer; an image developer to develop the electrostatic latent image with a toner to form a visible image; a transferer to transfer the visible image onto a recording medium; and the seamless belt according to claim 8 .
the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title
details of the the intermediate support, e.g. chemical composition · CPC title
Structure, details of the transfer member, e.g. chemical composition · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.