Semiconductive resin composition, member for electrophotography and image forming apparatus

US9891558B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9891558-B2
Application numberUS-201514974269-A
CountryUS
Kind codeB2
Filing dateDec 18, 2015
Priority dateJan 9, 2015
Publication dateFeb 13, 2018
Grant dateFeb 13, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A semiconductive resin composition includes a plurality of thermoplastic resins forming a sea-island structure including a sea portion and an island portion; and a plurality of conductive fillers. The sea portion includes at least two of the thermoplastic resins, at least one of the at least two of the thermoplastic resins is a copolymer, and the content of the copolymer is from 20% to 60% by weight per 100% by weight of the thermoplastic resins in the sea portion, and the following relation is satisfied: 1.5≦ B/A ≦10 wherein A represents an average primary particle diameter of one of the conductive fillers having the smallest average primary particle diameter and B represents an average primary particle diameter of one of the conductive fillers having the largest average primary particle diameter.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductive resin composition, comprising: a plurality of thermoplastic resins forming a sea-island structure including a sea portion and an island portion; and a plurality of conductive fillers, wherein the sea portion includes at least two of the thermoplastic resins, at least one of the at least two of the thermoplastic resins is a copolymer, and the content of the copolymer is from 20% to 60% by weight per 100% by weight of the thermoplastic resins in the sea portion, and wherein one conductive filler amongst the plurality of conductive fillers is constituted by particles and has average primary particle diameter A that is smallest amongst those of the plurality of conductive fillers, and another conductive filler amongst the plurality of conductive fillers is constituted by particles and has average primary particle diameter B that is largest amongst those of the plurality of conductive fillers, and wherein the average primary particle diameter A of said one conductive filler that is constituted by particles and the average primary particle diameter B of said another conductive filler that is constituted by particles satisfy the following relation: 1.5≦ B/A≦ 10. 2. The semiconductive resin composition of claim 1 , wherein the plurality of conductive fillers are disbursed in both the sea portion and the island portion of the sea-island structure of the thermoplastic resin, and the conductive fillers present in the sea portion accounts for 25% to 60% of all the conductive fillers in terms of cross-sectional areal ratio, said cross-section areal ratio being a ratio of an area occupied by the conductive filler in the island portion to an area occupied by the conductive filler in both of the sea portion and the island portion. 3. The semiconductive resin composition of claim 1 , wherein one of the thermoplastic resins in the sea portion is a polyvinylidene fluoride, and wherein the copolymer comprises: vinylidene fluoride structural units; and hexafluoropropylene structural units in an amount of from 5% to 10% by mol per 100% by mol of the copolymer. 4. The semiconductive resin composition of claim 3 , wherein the copolymer has a melting point of from 140° C. to 160° C. 5. The semiconductive resin composition of claim 3 , wherein the polyvinylidene fluoride has a weight-average molecular weight of from 100,000 to 500,000. 6. The semiconductive resin composition of claim 1 , wherein the thermoplastic resin in the island portion is a block copolymer having a polyalkylene unit and has a saturated moisture absorption quantity not greater than 3%. 7. The semiconductive resin composition of claim 6 , wherein the polyalkylene unit comprises a polypropylene. 8. A seamless belt for use in electrophotography, comprising: the semiconductive resin composition according to claim 1 . 9. An image forming apparatus, comprising: an electrostatic latent image bearer; an electrostatic latent image former to form an electrostatic latent image on the electrostatic latent image bearer; an image developer to develop the electrostatic latent image with a toner to form a visible image; a transferer to transfer the visible image onto a recording medium; and the seamless belt according to claim 8 .

Assignees

Inventors

Classifications

  • the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

  • G03G15/162Primary

    details of the the intermediate support, e.g. chemical composition · CPC title

  • Structure, details of the transfer member, e.g. chemical composition · CPC title

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What does patent US9891558B2 cover?
A semiconductive resin composition includes a plurality of thermoplastic resins forming a sea-island structure including a sea portion and an island portion; and a plurality of conductive fillers. The sea portion includes at least two of the thermoplastic resins, at least one of the at least two of the thermoplastic resins is a copolymer, and the content of the copolymer is from 20% to 60% by w…
Who is the assignee on this patent?
Matsushita Makoto, Izutani Akira, Takahashi Hiroaki, and 4 more
What technology area does this patent fall under?
Primary CPC classification G03G15/162. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).