Module testing utilizing wafer probe test equipment

Patent metadata

Field	Value
Publication number	US-9891272-B2
Application number	US-201514837140-A
Country	US
Kind code	B2
Filing date	Aug 27, 2015
Priority date	Jun 9, 2015
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A module plate is provided for use with a wafer handler and testing mechanism. The module plate has a diameter equivalent to an integrated circuit wafer and a height equivalent to or less than a height of a module lid associated with each module in a plurality of modules associated with the module plate. The module plate has a plurality of cutouts in the module plate that have a width equivalent to a width of the module lid and at least a length equivalent to a length of the module lid. The height of the module plate is such that, when a test head contacts a module base of each module in a plurality of modules, the module lid contacts a chuck on which the module plate resides during testing of the module thereby providing resistance in order to accurately test the module.

First claim

What is claimed is:

1. A method, in a data processing system, for testing a plurality of modules in a module plate, the method comprising:
receiving the module plate comprising the plurality of modules, wherein the module plate comprises:
a diameter equivalent to an integrated circuit wafer;
a height equivalent to or less than a height of a module lid associated with each module in the plurality of modules associated with the module plate; and
a plurality of cutouts in the module plate that have a width equivalent to a width of the module lid and at least a length equivalent to a length of the module lid; and

testing each module in the plurality of modules by contacting the module though a test head that contacts a module base of the module and in relation the module lid of the module contacts a chuck on which the module plate resides thereby providing resistance in order to accurately test the module.

2. The method of claim 1 , wherein the height of the module plate differs depending on the module that is to be tested.

3. The method of claim 1 , wherein the plurality of cutouts differs depending on the module that is to be tested.

4. The method of claim 1 , wherein each cutout in the plurality of cutouts has a length equivalent to the length of the module lid such that only one module in the plurality of modules may be inserted into the cutout.

5. The method of claim 4 , wherein when the module is inserted into the cutout, the module base associated with the module rests on four rails that surround the cutout.

6. The method of claim 1 , wherein each cutout in the plurality of cutouts has a length equivalent to a multiple of the length of the module lid such that more than one module in the plurality of modules may be inserted into the cutout.

7. The method of claim 6 , wherein when the module is inserted into the cutout, the module base associated with the module rests on two or three rails that surround the cutout.

8. The method of claim 1 , wherein the module base of each module in the plurality of modules that is larger than the cutout in which the module is to be placed and wherein the module base comprises a module ring that surrounds the module base.

9. The method of claim 8 , wherein the module ring is a natural part of the module base or an added component to the module base.

Assignees

• IBM

Inventors

• Eckert Martin
• Kunigkeit Eckhard
• Trianni Quintino L
• Zoellin Christian

Classifications

• G01R1/0491

  for testing integrated circuits on wafers, e.g. wafer-level test cartridge · CPC title

• G01R31/2886 Primary

  Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06) · CPC title

• G01R1/0433

  Sockets for IC's or transistors · CPC title

• G01R31/2867

  Handlers or transport devices, e.g. loaders, carriers, trays · CPC title