Probe tip for air data probe

Patent metadata

Field	Value
Publication number	US-9891083-B2
Application number	US-201614991251-A
Country	US
Kind code	B2
Filing date	Jan 8, 2016
Priority date	Jan 8, 2016
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A probe assembly includes a heat source; and a probe tip configured to enhance conduction of heat provided by the heat source into a front end tip of the probe. The probe tip includes: a first region having high thermal conductivity in at least a z-direction, wherein the z-direction is parallel to an axis along which the probe tip is extended; and at least one additional region having thermal characteristics different from the first region.

First claim

What is claimed is:

1. A probe assembly comprises:
a heat source; and
a probe tip configured to enhance conduction of heat provided by the heat source into a front end tip of the probe, the probe tip including:
a first region having higher thermal conductivity in a z-direction than thermal conductivity in other directions, wherein the z-direction is parallel to an axis along which the probe tip is extended; and
a second region configured to function as a thermal reservoir with uniform thermal conductivity in all directions.

2. The probe assembly of claim 1 , further comprising a third region that is configured to function as an insulator in all directions.

3. The probe assembly of claim 1 , further comprising a fourth region configured to function as a weak insulator having thermal conductivity in the z-direction and approximately no conductivity in other directions.

4. The probe tip of claim 3 , wherein the thermal conductivity of the fourth region in z-direction is less than the thermal conductivity of the second region.

5. The probe assembly of claim 1 , further comprising an outer skin region having uniform thermal conductivity in all directions, and wherein the outer skin region is a protective outer skin of the probe tip composed of a dense abrasion resistant material.

6. The probe assembly of claim 1 , wherein the probe tip includes a single conductive material having uniform thermal characteristics.

7. The probe assembly of claim 6 , further comprising voids in the conductive material to direct the heat provided by the heat source in a desired direction.

8. The probe assembly of claim 1 , wherein the probe tip is replaceable.

9. The probe assembly of claim 1 , wherein the first region is configured to have thermal conductivity in other directions lower than thermal conductivity in the z-direction.

10. The probe tip of claim 1 , wherein the probe tip includes a copper alloy or nickel alloy.

11. The probe tip of claim 1 , wherein the probe tip includes a layered collection of sparsely connected and nested tubes along an axis in the z-direction such that the heat is directed in the z-direction.

12. The probe tip of claim 11 , wherein the sparsely connected and nested tubes are composed of a material having uniform thermal conductivity in all directions.

Assignees

• Honeywell Int Inc

Inventors

• Gordon Grant A
• Wong Yates

Classifications

• G01F15/10

  Preventing damage by freezing or excess pressure or insufficient pressure · CPC title

• G01P5/165 Primary

  Arrangements or constructions of Pitot tubes · CPC title

• B23K1/0008

  specially adapted for particular articles or work · CPC title

• G01P5/16

  using Pitot tubes {, e.g. Machmeter} · CPC title

• G01F1/46 Primary

  Pitot tubes · CPC title