Metal-based microchannel heat exchangers made by molding replication and assembly

Patent metadata

Field	Value
Publication number	US-9891006-B2
Application number	US-201615010162-A
Country	US
Kind code	B2
Filing date	Jan 29, 2016
Priority date	Jan 14, 2008
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.

First claim

What is claimed:

1. A process for making a metal microchannel heat exchanger, the process comprising:
forming one or more open microchannels on a surface of a first homogeneous metal piece, wherein at least one of the one or more open microchannels has a width between about 30 μm and about 1000 μm, and a depth between about 30 μm and about 1000 μm;
providing a second homogeneous metal piece that, when bonded to the first homogeneous metal piece, will convert one or more open microchannels on the first homogeneous metal piece into one or more closed microchannels, wherein the one or more closed microchannels are adapted to transport liquid without substantial leakage;
providing a eutectic layer or a eutectic precursor layer at one or more of the following locations: a surface of the first homogeneous metal piece, a surface of the second homogeneous metal piece, or between the first and second homogeneous metal pieces;
simultaneously applying pressure to and heating the first and second homogeneous metal pieces, wherein:
the pressure pushes the first and second homogeneous metal pieces toward each other, with the eutectic layer or the eutectic precursor layer between the first and second homogeneous metal pieces;
the first and second homogeneous metal pieces are heated to a eutectic melting temperature at which the eutectic layer or the eutectic precursor layer melts, or at which the eutectic layer or the eutectic precursor layer interacts with the first and second homogeneous metal pieces to form a molten eutectic composition between the first and second homogeneous metal pieces; and
the eutectic melting temperature to which the first and second homogeneous metal pieces are heated is sufficiently below a melting temperature of the first and second homogeneous metal pieces that no substantial deformation of the one or more open microchannels occurs;

cooling the first and second homogeneous metal pieces to a cooling temperature substantially below the eutectic melting temperature, while maintaining the pressure during at least a portion of the cooling; such that the first and second homogeneous metal pieces fuse together;
such that the one or more open microchannels are converted into one or more closed microchannels, wherein the one or more closed microchannels are adapted to transport liquid without substantial leakage; and
wherein no substantial blockage of the one or more closed microchannels occurs as a result of the heating, applying pressure, and cooling;

and wherein:
the one or more closed microchannels are enclosed entirely by the fused first and second homogeneous metal pieces and the eutectic layer or the eutectic precursor layer; and whereby the fused first and second homogeneous pieces and the eutectic layer or the eutectic precursor layer, together with the enclosed one or more closed microchannels, form a microchannel heat exchanger; and
wherein at least one of the closed microchannels has a surface roughness between about 3 μm and about 15 μm.

2. The process of claim 1 , wherein the microchannel heat exchanger is capable of withstanding an internal pressure in the one or more closed microchannels of 100 atmospheres or greater.

3. The process of claim 1 , wherein forming the one or more open microchannels on the surface of the first homogeneous metal piece comprises compression molding of the first homogeneous metal piece with a refractory metal mold insert.

4. The of claim 1 , wherein the one or more closed microchannels discharge into a fluid drain plenum.

5. The process of claim 1 , wherein the eutectic layer or the eutectic precursor layer comprises a eutectic nanocomposite thin film.

6. The process of claim 5 , wherein a domain size of the eutectic nanocomposite thin film is in a range from about 100 nm to about 400 nm.

7. The process of claim 5 , wherein flux-free bonding of the first and second homogeneous metal pieces is achieved using the eutectic nanocomposite thin film.

8. The process of claim 1 , further comprising forming one or more open microchannels on a surface of the second homogeneous metal piece prior to simultaneously applying pressure to and heating the first homogeneous metal piece and the second homogeneous metal piece.

9. The process of claim 1 , wherein the first homogeneous metal piece and the second homogeneous metal piece are dissimilar metals.

10. A metal microchannel heat exchanger, wherein the metal microchannel heat exchanger is produced by a process comprising:
forming one or more open microchannels on a surface of a first homogeneous metal piece, wherein at least one of the one or more open microchannels has a width between about 30 μm and about 1000 μm, and a depth between about 30 μm and about 1000 μm;
providing a second homogeneous metal piece that, when bonded to the first homogeneous metal piece, will convert one or more open microchannels on the first homogeneous metal piece into one or more closed microchannels, wherein the one or more closed microchannels are adapted to transport liquid without substantial leakage;
providing a eutectic layer or a eutectic precursor layer at one or more of the following locations: a surface of the first homogeneous metal piece, a surface of the second homogeneous metal piece, or between the first and second homogeneous metal pieces;
simultaneously applying pressure to and heating the first and second homogeneous metal pieces, wherein: the pressure pushes the first and second homogeneous metal pieces toward each other, with the eutectic layer or eutectic precursor layer between the first and second homogeneous metal pieces; the first and second homogeneous metal pieces are heated to a eutectic melting temperature at which the eutectic layer or the eutectic precursor layer melts, or at which the eutectic layer or the eutectic precursor layer interacts with the first and second homogeneous metal pieces to form a molten eutectic composition between the first and second homogeneous metal pieces; and the eutectic melting temperature to which the first and second homogeneous metal pieces are heated is sufficiently below a melting temperature of the first and second homogeneous metal pieces that no substantial deformation of the one or more open microchannels occurs;
cooling the first and second homogeneous metal pieces to a cooling temperature substantially below the eutectic melting temperature, while maintaining the pressure during at least a portion of the cooling; such that the first and second homogeneous metal pieces fuse together; such that the one or more open microchannels are converted into one or more closed microchannels, wherein the one or more closed microchannels are adapted to transport liquid without substantial leakage; and wherein no substantial blockage of the one or more closed microchannels occurs as a result of the heating, applying pressure, and cooling;
and wherein:
the one or more closed microchannels are enclosed entirely by the fused first and second homogeneous metal pieces and the eutectic layer or the eutectic precursor layer; and whereby the fused first and second homogeneous pieces and the eutectic layer or the eutectic precursor layer, together with the enclosed one or more closed microchannels, form a microchannel heat exchanger;
wherein the one or more closed microchannels discharge into a fluid drain plenum; and
wherein the one or more closed microchannels comprise at least one microchannel that discharges into the fluid drain plenum via a fluidic transition that widens outward from an end of the at least one microchannel.

11. The metal microchannel heat exchanger of claim 10 , wherein the first and second homogeneous metal pieces are brazed to one another by the eut

Assignees

• Meng Wen Jin
• Mei Fanghua
• Univ Louisiana State

Inventors

• Meng Wen Jin
• Mei Fanghua

Classifications

• B81C2203/038

  Bonding techniques not provided for in B81C2203/031 - B81C2203/037 · CPC title

• B81B2201/058

  Microfluidics not provided for in B81B2201/051 - B81B2201/054 · CPC title

• F28F2260/02

  having microchannels · CPC title

• F28F21/08

  of metal · CPC title

• F28F1/00 Primary

  Tubular elements; Assemblies of tubular elements (specially adapted for movement F28F5/00) · CPC title