Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same

Patent metadata

Field	Value
Publication number	US-9890307-B2
Application number	US-201615209871-A
Country	US
Kind code	B2
Filing date	Jul 14, 2016
Priority date	Jul 15, 2015
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:

First claim

What is claimed is:

1. A phosphonium compound represented by Formula 1:

wherein, in Formula 1,
R 1 , R 2 , R 3 , and R 4 are each independently a substituted or unsubstituted C 1 to C 30 aliphatic hydrocarbon group, a substituted or unsubstituted C 6 to C 30 aromatic hydrocarbon group, or a substituted or unsubstituted C 1 to C 30 hydrocarbon group having a hetero atom;
R 5 , R 6 , and R 7 are each independently hydrogen, a substituted or unsubstituted C 1 to C 30 aliphatic hydrocarbon group, a substituted or unsubstituted C 6 to C 30 aromatic hydrocarbon group, or a substituted or unsubstituted C 1 to C 30 hydrocarbon group having a hetero atom; and
M is an alkali metal.

2. The phosphonium compound as claimed in claim 1 , wherein R 1 , R 2 , R 3 , and R 4 are each independently a C 6 to C 30 aryl group.

3. The phosphonium compound as claimed in claim 2 , wherein at least one of R 1 , R 2 , R 3 , and R 4 is substituted with a hydroxyl group.

4. The phosphonium compound as claimed in claim 1 , wherein M is sodium or potassium.

5. The phosphonium compound as claimed in claim 1 , wherein the phosphonium compound represented by Formula 1 is represented by one of the following Formulae 1a to 1h:

6. An epoxy resin composition, comprising:
an epoxy resin;
a curing agent;
an inorganic filler; and
a curing catalyst, wherein the curing catalyst includes the phosphonium compound as claimed in claim 1 .

7. The epoxy resin composition as claimed in claim 6 , wherein the epoxy resin includes a bisphenol A epoxy resin, a bisphenol F epoxy resin, a phenol novolac epoxy resin, a tert-butyl catechol epoxy resin, a naphthalene epoxy resin, a glycidylamine epoxy resin, a cresol novolac epoxy resin, a biphenyl epoxy resin, a linear aliphatic epoxy resin, a cycloaliphatic epoxy resin, a heterocyclic epoxy resin, a spiro ring-containing epoxy resin, a cyclohexane dimethanol epoxy resin, a trimethylol epoxy resin, or a halogenated epoxy resin.

8. The epoxy resin composition as claimed in claim 6 , wherein the curing agent includes a phenol resin.

9. The epoxy resin composition as claimed in claim 6 , wherein the curing agent includes a phenol aralkyl phenol resin, a phenol novolac phenol resin, a xyloc phenol resin, a cresol novolac phenol resin, a naphthol phenol resin, a terpene phenol resin, a polyfunctional phenol resin, a dicyclopentadiene-based phenol resin, a novolac phenol resin synthesized from bisphenol A and resorcinol, a polyhydric phenolic compound, an acid anhydride, or an aromatic amine.

10. The epoxy resin composition as claimed in claim 6 , wherein the curing catalyst is present in the epoxy resin composition in an amount of about 0.01 wt % to about 5 wt %, in terms of solid content.

11. The epoxy resin composition as claimed in claim 6 , wherein the phosphonium compound is present in the curing catalyst in an amount of about 10 wt % to about 100 wt %, based on a total weight of the curing catalyst.

12. The epoxy resin composition as claimed in claim 6 , wherein the epoxy resin composition has a curing shrinkage rate of less than about 0.34%, as calculated according to Equation 1:
<Equation 1>
Curing shrinkage=(| C−D|/C )×100

wherein, in Equation 1, C is a length of a specimen obtained by transfer molding of the epoxy resin composition at 175° C. under a load of 70 kgf/cm 2 , and D is a length of the specimen after post-curing the specimen at 170° C. to 180° C. for 4 hours and cooling.

13. The epoxy resin composition as claimed in claim 6 , wherein the epoxy resin composition has a storage stability of about 85% or more, as calculated according to Equation 2:
<Equation 2>
Storage stability=( F 1/ F 0)×100

wherein, in Equation 2, F 1 is a flow length in inches of the epoxy resin composition measured after storing the composition at 25° C./50% RH for 72 hours using a transfer molding press at 175° C. and 70 kgf/cm 2 in accordance with EMMI-1-66, and F 0 is an initial flow length in inches of the epoxy resin composition.

14. A semiconductor device encapsulated with the epoxy resin composition as claimed in claim 6 .

15. A method of encapsulating a semiconductor device, the method comprising encapsulating the semiconductor device with the epoxy resin composition as claimed in claim 1 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Kwon Ki Hyeok
• Kim Min Gyum
• Chung Joo Young
• Cheon Jin Min
• Choi Jin Woo
• Han Seung
• Lee Dong Hwan

Classifications

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C08G59/688 Primary

  containing phosphorus · CPC title

• C08G59/62

  Alcohols or phenols · CPC title

• C07F9/5022

  Aromatic phosphines (P-C aromatic linkage) · CPC title

• C07F7/07 Primary

  Cyclic esters · CPC title