Semi-aromatic polyamide resin composition and molded article containing same
US-2016168381-A1 · Jun 16, 2016 · US
US9890247B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9890247-B2 |
| Application number | US-201113695345-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 28, 2011 |
| Priority date | Apr 29, 2010 |
| Publication date | Feb 13, 2018 |
| Grant date | Feb 13, 2018 |
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The invention relates to a semi-aromatic polyamide, and a polyamide composition comprising the semi-aromatic polyamide, comprising a diamine component (a) comprising, based on the total number of moles of the diamine component (a): between 5 and 30 mole % of at least one C2-C5 diamine, between 5 and 30 mole % of at least one C7+ diamine, and between 45 and 90 mole % of a C6 diamine; and a dicaboxylic acid component (b) comprising, based on the total number of moles of the dicaboxylic acid component (b): at least 50 mole % of terephthalic acid and at most 50 mole % of another dicarboxylic acid.
Opening claim text (preview).
The invention claimed is: 1. A semi-aromatic polyamide comprising a diamine component (a) and a dicarboxylic acid component (b), wherein the diamine component (a) comprises, based on the total molar amount of the diamine component (a): (a1) 5-30 mole % of at least one C2-C5 diamine, (a2) 5-30 mole % of 1,10-decanediamine, and (a3) 50-90 mole % of a C6 diamine which consists of at least 75 mole %, relative to the total molar amount of C6 diamine, of 1,6-hexanediamine; and wherein the dicarboxylic acid component (b) comprises, based on the total molar amount of the dicaboxylic acid component (b): (b1) at least 60 mole % of terephthalic acid, and (b2) at most 40 mole % of another dicarboxylic acid, and wherein the semi-aromatic polyamide has a melting temperature (Tm) in a range of 310-340° C. as measured according to ASTM D3418-97 by differential scanning calorimetry (DSC) with a heating rate of 20° C./minute. 2. The semi-aromatic polyamide according to claim 1 , wherein a molar amount of the 1,10-decanediamine is larger than a molar amount of the C2-C5 diamine. 3. The semi-aromatic polyamide according to claim 1 , wherein the C2-C5 diamine is present in an amount of 5-15 mole %, and/or the 1,10-decanediamine is present in an amount of 10-25 mole %, relative to the total molar amount of the diamine component (a). 4. The semi-aromatic polyamide according to claim 1 , wherein the C2-C5 diamine is 1,4-butane diamine. 5. The semi-aromatic polyamide according to claim 1 , which comprises terephthalic acid in an amount of 60-90 mole %, relative to the molar amount of the dicaboxylic acid component (b). 6. The semi-aromatic polyamide according to claim 1 , having a melting temperature (Tm) in the range of 310-330° C. 7. The semi-aromatic polyamide according to claim 1 , having a glass transition temperature (Tg) in the range of 105-130° C. 8. A process for preparing the semi-aromatic polyamide according to claim 1 , which comprises: a first step of preparing a prepolymer from a mixture of the dicarboxylic acid components (b1) and (b2), and the diamine components (a1) and (a3) while omitting from the mixture an amount of the 1,10-decanediamine component (a2) thereby resulting in a prepolymer comprising predominantly carboxylic acid end groups, and a second step of adding the amount of the 1,10-decanediamine component (a2) withheld from the mixture in the first step to a melt of the prepolymer formed by the first step and further polymerizing the prepolymer to thereby obtain the semi-aromatic polyamide polymer. 9. A polyamide composition, consisting of: (A) 30-100 wt. % of the semi-aromatic polyamide as in claim 1 , (B) 0-70 wt. % of reinforcing agents and/or fillers, and (C) 0-50 wt % of other additives and/or other polymers. 10. A molded part consisting of a semi-aromatic polyamide according to claim 1 .
from at least two different diamines or at least two different dicarboxylic acids · CPC title
Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title
Preparatory processes · CPC title
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