Physical quantity sensor

US9890037B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9890037-B2
Application numberUS-201515502554-A
CountryUS
Kind codeB2
Filing dateJun 29, 2015
Priority dateSep 9, 2014
Publication dateFeb 13, 2018
Grant dateFeb 13, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.

First claim

Opening claim text (preview).

The invention claimed is: 1. A physical quantity sensor, comprising: a lamination structure in which a first substrate and a second substrate are laminated; an electrode pad and a wiring formed on a surface of the first substrate; a sensing portion formed on the second substrate; and a conductive film formed on a surface of the first substrate, electrically insulated with respect to the electrode and the wiring, and held at a constant potential, wherein the conductive film includes a peep portion to observe the sensing portion, the sensing portion comprises movable comb teeth and fixed comb teeth, a fixed electrode is formed in the second substrate and is electrically connected to a through hole surface electrode that is formed on an electrode substrate via a first electrode, a movable electrode is formed in the second substrate and is electrically connected to a through hole surface electrode that is formed in the electrode substrate via a second electrode, a fixed electrode is electrically connected to the fixed comb teeth, a movable electrode is electrically connected to the movable comb teeth, a sensing space is defined in the second substrate as a sealed space by the first substrate and the electrode substrate, and in the sensing space, a pressure ranges from 10000 Pa to 50000 Pa. 2. The physical quantity sensor according to claim 1 , wherein a shield layer comprises the peep portion in an area where the fixed comb teeth and the movable comb teeth are projected with respect to the shield layer in a lamination direction. 3. The physical quantity sensor according to claim 1 , wherein the peep portion is a thin wall portion in which a thickness of the shield layer is thinner than other portions or a portion in which the shield layer is not provided. 4. The physical quantity sensor according to claim 3 , wherein all of a substrate material include a silicon material. 5. The physical quantity sensor according to claim 3 , wherein the first substrate and the peep portion transmit infrared rays. 6. The physical quantity sensor according to claim 3 , wherein the peep portion is polygonal.

Assignees

Inventors

Classifications

  • the devices having two sensing masses in anti-phase motion · CPC title

  • Gyroscopes · CPC title

  • B81B7/0064Primary

    for protecting against electromagnetic or electrostatic interferences · CPC title

  • Testing or calibrating of apparatus or devices covered by the preceding groups · CPC title

  • End test of the packaged device · CPC title

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Frequently asked questions

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What does patent US9890037B2 cover?
For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode hav…
Who is the assignee on this patent?
Hitachi Automotive Systems Ltd
What technology area does this patent fall under?
Primary CPC classification B81B7/0064. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).