High Vacuum Sealing for Sensor Platform Process
US-2016060103-A1 · Mar 3, 2016 · US
US9890037B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9890037-B2 |
| Application number | US-201515502554-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 29, 2015 |
| Priority date | Sep 9, 2014 |
| Publication date | Feb 13, 2018 |
| Grant date | Feb 13, 2018 |
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Official abstract text for this publication.
For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.
Opening claim text (preview).
The invention claimed is: 1. A physical quantity sensor, comprising: a lamination structure in which a first substrate and a second substrate are laminated; an electrode pad and a wiring formed on a surface of the first substrate; a sensing portion formed on the second substrate; and a conductive film formed on a surface of the first substrate, electrically insulated with respect to the electrode and the wiring, and held at a constant potential, wherein the conductive film includes a peep portion to observe the sensing portion, the sensing portion comprises movable comb teeth and fixed comb teeth, a fixed electrode is formed in the second substrate and is electrically connected to a through hole surface electrode that is formed on an electrode substrate via a first electrode, a movable electrode is formed in the second substrate and is electrically connected to a through hole surface electrode that is formed in the electrode substrate via a second electrode, a fixed electrode is electrically connected to the fixed comb teeth, a movable electrode is electrically connected to the movable comb teeth, a sensing space is defined in the second substrate as a sealed space by the first substrate and the electrode substrate, and in the sensing space, a pressure ranges from 10000 Pa to 50000 Pa. 2. The physical quantity sensor according to claim 1 , wherein a shield layer comprises the peep portion in an area where the fixed comb teeth and the movable comb teeth are projected with respect to the shield layer in a lamination direction. 3. The physical quantity sensor according to claim 1 , wherein the peep portion is a thin wall portion in which a thickness of the shield layer is thinner than other portions or a portion in which the shield layer is not provided. 4. The physical quantity sensor according to claim 3 , wherein all of a substrate material include a silicon material. 5. The physical quantity sensor according to claim 3 , wherein the first substrate and the peep portion transmit infrared rays. 6. The physical quantity sensor according to claim 3 , wherein the peep portion is polygonal.
the devices having two sensing masses in anti-phase motion · CPC title
Gyroscopes · CPC title
for protecting against electromagnetic or electrostatic interferences · CPC title
Testing or calibrating of apparatus or devices covered by the preceding groups · CPC title
End test of the packaged device · CPC title
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