Display panel substrate assembly and an apparatus and method for forming a display panel substrate assembly

Patent metadata

Field	Value
Publication number	US-9889461-B2
Application number	US-201113821590-A
Country	US
Kind code	B2
Filing date	Sep 9, 2011
Priority date	Sep 13, 2010
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

The present invention discloses a display panel substrate assembly and an apparatus and method for forming a display panel substrate assembly, wherein the substrate assembly includes a first substrate and a second substrate. At least one of the first substrate and the second substrate is optically clear. The method includes the steps of screen printing a non-sag adhesive composition onto a surface of the first substrate, bringing the non-sag adhesive composition into contact with a surface of the second substrate in an environment having a pressure of less than or equal to about 5000 pascals, and curing the non-sag adhesive composition to yield an adhesive layer. The non-sag adhesive composition is of a type which is optically clear after curing.

First claim

The invention claimed is:

1. An apparatus for forming a display panel substrate assembly, the substrate assembly comprising a first substrate and a second substrate, at least one of the first substrate and the second substrate being optically clear, the apparatus comprising:
a printing device for applying a non-sag adhesive composition comprising a thixotropic material onto a surface of the first substrate, the non-sag adhesive composition being characterized in that it has a viscosity of between about 5 and about 20 Pa·s at 25° C. and at a shear rate of 1 to 10 sec −1 and a viscosity of at least 700 Pa·s at 25° C. and at a shear rate of 0.01 sec −1 , the non-sag adhesive composition further being of a type which is optically clear after curing, wherein the printing device comprises a stencil comprising one or more ribs extending in a printing area from a first side of the stencil to a second side of the stencil, wherein each rib comprises first end at the first side, a second end at the second side, an apex located between the first and second ends, and a side having a tapered portion and wherein each rib tapers from the first end at the first side or the second end at the second side of the stencil towards the apex of the rib between the first side and the second side such that a width of the rib is thinnest at the apex;
a chamber for the non-sag adhesive composition to be brought into contact with a surface of the second substrate therein at a pressure less than or equal to 5000 pascals; and
a curing device for curing the non-sag adhesive composition to yield an adhesive layer.

2. The apparatus of claim 1 , wherein the apparatus comprises a plurality of side guides movable towards the first substrate from opposite sides of the first substrate to push the first substrate into position facing the surface of the second substrate prior to bringing the non-sag adhesive composition into contact with the surface of the second substrate.

3. The apparatus of claim 1 , wherein the apparatus comprises adjustable holding mechanisms for holding the first substrate and the second substrate, the holding mechanism for the first substrate being adjustable to tilt the first substrate such that the first substrate and the second substrate are aligned prior to bringing the non-sag adhesive composition into contact with the surface of the second substrate.

4. The apparatus of claim 1 , wherein the curing device comprises a mirror for directing light from a curing source towards the non-sag adhesive composition exposed between the first substrate and the second substrate after the non-sag adhesive composition is placed into contact with the surface of the second substrate.

5. The apparatus of claim 1 , wherein the printing area has a corner area, the corner area having a cut-away portion.

Assignees

• Busman Stanley C
• Ong Chin Teong
• Sim Yi Lin
• Chan Wee Hock
• Chen Xinhe
• Toy Meng Sheng
• 3M Innovative Properties Co
• Trimech Tech Pte Ltd

Inventors

• Busman Stanley C
• Ong Chin Teong
• Sim Yi Lin
• Chan Wee Hock
• Chen Xinhe
• Toy Meng Sheng

Classifications

• G02F2202/28

  Adhesive materials or arrangements · CPC title

• G02F1/1339 Primary

  Gaskets; Spacers; Sealing of cells · CPC title

• H05K13/00

  Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components · CPC title

• Y10T428/24628

  Nonplanar uniform thickness material · CPC title

• Y10T428/24868

  Translucent outer layer · CPC title