Method for working an apparatus having at least one electrical layer structure, and component arrangement for working an apparatus having at least one electrical layer structure

Patent metadata

Field	Value
Publication number	US-9888576-B2
Application number	US-201314431846-A
Country	US
Kind code	B2
Filing date	Sep 26, 2013
Priority date	Sep 28, 2012
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

Various embodiments may relate to a method for working an apparatus having at least one electrical layer structure. The electrical layer structure includes a dielectric layer in physical contact with an electrically conductive layer and the electrical layer structure has a first electrical conductivity. The method may include forming an electrical connection to the dielectric layer of the electrical layer structure, and forming an electrical voltage profile at the electrical connection in such a way that a second electrical conductivity is formed; wherein the second electrical conductivity is greater than the first electrical conductivity. The electrical layer structure has the second electrical conductivity after the reduction of the electrical voltage profile.

First claim

The invention claimed is:

1. A method for working an apparatus having at least one electrical layer structure, wherein the electrical layer structure comprises a dielectric layer in physical contact with an electrically conductive layer and the electrical layer structure has a first electrical conductivity, the method comprising:
forming an electrical connection to the dielectric layer of the electrical layer structure;
forming an electrical voltage profile at the electrical connection in such a way that a second electrical conductivity is formed; wherein the second electrical conductivity is greater than the first electrical conductivity; and
reducing the electrical voltage profile at the electrical connection, wherein the electrical layer structure has the second electrical conductivity after the reduction of the electrical voltage profile,
wherein in at least one region of the electrical layer structure a part of the dielectric layer of the electrical layer structure is removed before the electrical connection is formed.

2. The method as claimed in claim 1 ,
wherein the dielectric layer includes a substance or a substance mixture, wherein the applied electrical voltage profile has a maximum magnitude of the voltage which is greater than the breakdown voltage of the substance or of the substance mixture of the dielectric layer.

3. The method as claimed in claim 1 ,
wherein the apparatus comprises an electronic component unit, wherein the electrical layer structure is formed as a region of the electronic component unit or is electrically connected to a region of the electronic component unit.

4. The method as claimed in claim 3 ,
wherein the electrically conductive layer of the electrical layer structure is designed as an electrical bus which is electrically connected to the electronic component unit.

5. The method as claimed in claim 3 ,
wherein the electrically conductive layer of the electrical layer structure is designed as an electrode or a contact pad of the electronic component unit.

6. The method as claimed in claim 1 ,
wherein the dielectric layer of the electrical layer structure is designed as a thin-film encapsulation and/or comprises a dielectric metal oxide.

7. The method as claimed in claim 1 ,
wherein the magnitude of the voltage of the electrical voltage profile is temporally modulated.

8. The method as claimed in claim 7 ,
wherein the maximum magnitude of the electrical voltage profile has a magnitude of greater than approximately 1 V.

9. The method as claimed in claim 1 ,
wherein removing a part of the dielectric layer comprises ballistically removing the dielectric layer.

10. The method as claimed in claim 1 ,
wherein the electrical connection to the electrical layer structure is formed in the region of the removed dielectric layer.

11. The method as claimed in claim 1 ,
wherein the dielectric layer is at least partly removed from at least two regions of the electrical layer structure.

12. The method as claimed in claim 1 ,
wherein the apparatus is formed as a component which provides electromagnetic radiation; or
wherein the apparatus is formed as a component which takes up electromagnetic radiation.

13. A component arrangement for working an apparatus having at least one electrical layer structure having a first electrical conductivity, the component arrangement comprising:
an apparatus having at least one electrical layer structure, wherein the electrical layer structure comprises a dielectric layer in physical contact with an electrically conductive layer and the electrical layer structure has a first electrical conductivity, and wherein in at least one region of the electrical layer structure a part of the dielectric layer of the electrical layer structure is removed;
a voltage source designed for providing a modulatable voltage profile, wherein the voltage source is electrically connected to the electrical layer structure in such a way that the electrical circuit is closed by the electrical layer structure and that the electrical connection with the electrical layer structure is formed in the region of the removed dielectric layer;
a control unit designed for controlling the voltage profile of the voltage source; and
a measuring device for measuring the electrical conductivity of the electrical layer structure, wherein the measuring device is designed in such a way that the measured electrical conductivity is communicated to the control unit;
wherein the control unit is designed in such a way that the voltage profile is controlled depending on the measured electrical conductivity.

14. The component arrangement as claimed in claim 13 , wherein the measuring device is designed for measuring the electrical resistance of the electrical layer structure.

15. The component arrangement as claimed in claim 13 , wherein the measuring device is designed for measuring the electrical voltage drop across the electrical layer structure.

16. The component arrangement as claimed in claim 13 , wherein the measuring device is designed for measuring the electric current through the electrical layer structure.

17. The component arrangement as claimed in claim 13 , wherein the control unit is designed as a phase dimmer, wherein the control signal for phase chopping control or phase gating control is a function of the measured conductivity.

18. The component arrangement as claimed claim 13 , wherein the control unit is designed as a pulse modulator, wherein the control signal for pulse modulation is a function of the measured conductivity.

Assignees

• Osram Oled Gmbh

Inventors

• Lang Erwin
• Schwamb Philipp

Classifications

• H05K3/0044

  Mechanical working of the substrate, e.g. drilling or punching (H05K3/0008 takes precedence) · CPC title

• H01L51/5203

  Electricity · mapped topic

• Y10T29/49124

  On flat or curved insulated base, e.g., printed circuit, etc. · CPC title

• H05K1/18 Primary

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• Y10T29/4913

  Assembling to base an electrical component, e.g., capacitor, etc. · CPC title