Wiring substrate and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9888558-B2
Application number	US-201113152419-A
Country	US
Kind code	B2
Filing date	Jun 3, 2011
Priority date	Jun 3, 2010
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

A wiring substrate 11 A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21 a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21 ; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.

First claim

What is claimed is:

1. A wiring substrate, comprising:
a substrate comprising a metal core, insulation layers on a front side and a rear side of the metal core, and a front layer and a rear layer configured as a mounting surface for components and provided on the insulation layers, the front layer and the rear layer being formed of material different from a material forming the insulation layers;
a concave section formed in a side edge part of the substrate and exposed to both the front layer and the rear layer of the substrate; and
a connection terminal disposed in the same layer as a layer of the metal core, extended from a side surface portion of the concave section and bent in a direction perpendicular to a surface of the substrate, the side surface portion being substantially perpendicular to the front and rear layers of the substrate,
wherein a portion of the connection terminal is disposed to penetrate inside the side surface portion to thereby fix the connection terminal to the substrate,
wherein a section of the connection terminal only contacts the substrate at the side surface portion,
wherein a plurality of the connection terminals are installed in the side surface portion of the concave section in a longitudinal direction, and two adjacent connection terminals of the plurality of the connection terminals are configured such that respective portions of the two adjacent connection terminals which penetrate inside the side surface portion are unitary in the substrate to thereby electrically connect the two adjacent connection terminals, and
wherein the wiring substrate further comprises:
another concave section formed in another side edge part of the substrate, the other concave section being opposite the concave section such that sides of the concave section and sides of the other concave section are aligned; and
another connection terminal extended from a side surface portion of the other concave section.

2. The wiring substrate according to claim 1 , wherein a bending portion of one of the plurality of the connection terminals is a curved section which bends in an arc shape when seen from a side surface thereof.

3. The wiring substrate according to claim 1 , wherein the substrate includes a high thermal conductive layer, and the high thermal conductive layer and one of the plurality of the connection terminals are formed in the same layer.

4. The wiring substrate according to claim 1 , wherein one of the plurality of the connection terminals is connected to another wiring substrate which is installed in parallel at an interval to the substrate.

5. The wiring substrate according to claim 4 , wherein a support piece, which supports another wiring substrate in a position at an interval to the substrate, is provided in the connection terminal so as to protrude in a side direction thereon.

6. The wiring substrate according to claim 1 , wherein a housing which forms a connector is disposed in the concave section, and the connection terminal is accommodated in the housing.

7. The wiring substrate according to claim 1 , wherein the concave section is a notch.

8. The wiring substrate according to claim 1 , wherein the connection terminal is made by processing an exposed part of the metal core.

Assignees

• Harao Akira
• Matsunaga Mototatsu
• Sugiura Yasuhiro
• Kubota Minoru
• Yazaki Corp

Inventors

• Harao Akira
• Matsunaga Mototatsu
• Sugiura Yasuhiro
• Kubota Minoru

Classifications

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W70/479

  on or in insulating or insulated package substrates, interposers, or redistribution layers · CPC title

• H05K2201/10787

  Leads having protrusions, e.g. for retention or insert stop · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title