Audio speakers with integrated sealing and assembly features for “caseless” installation

US9888306B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9888306-B2
Application numberUS-201715605946-A
CountryUS
Kind codeB2
Filing dateMay 25, 2017
Priority dateSep 26, 2015
Publication dateFeb 6, 2018
Grant dateFeb 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.

First claim

Opening claim text (preview).

We claim: 1. A system, comprising: a parent device having a speaker placement on a parent-device wall; an uncased audio speaker positioned at the speaker placement; a signal line coupling the uncased audio speaker to a source of an electrical signal; a speaker cover coupled to the parent-device wall; a first seal between a front surface of the uncased audio speaker and an acoustic output aperture in the parent-device wall or in the speaker cover; a second seal around the signal line in an opening by which the signal line exits the parent-device wall or the speaker cover; and a third seal between the parent-device wall and the speaker cover; wherein the speaker cover and the parent-device wall define a single-walled enclosure of the uncased audio speaker; and wherein the single-walled enclosure comprises a back volume of the uncased audio speaker. 2. The system of claim 1 , wherein the back volume is airtight. 3. The system of claim 1 , wherein the back volume is ported. 4. The system of claim 1 , wherein the first seal, the second seal, or the third seal is resilient to compression. 5. The system of claim 1 , wherein the first seal, the second seal, or the third seal comprises an elastomer. 6. The system of claim 1 , wherein the first seal, the second seal, or the third seal is applied as a liquid and cured. 7. The system of claim 1 , wherein the parent-device wall forms only one side of the single-walled enclosure. 8. The system of claim 1 , wherein the parent-device wall forms all but one side of the single-walled enclosure. 9. The system of claim 1 , wherein the parent-device wall and the speaker cover each form a plurality of sides of the single-walled enclosure. 10. The system of claim 1 , further comprising a bracket having a notch in an edge; wherein the second seal is positioned in the notch with the signal line held inside the second seal. 11. The system of claim 1 , wherein the speaker cover is retrofitted to a speaker placement arranged to fit a cased audio speaker.

Assignees

Inventors

Classifications

  • Loudspeakers · CPC title

  • Screens for loudspeakers · CPC title

  • Transducers or their casings adapted for mounting in or to a wall or ceiling · CPC title

  • Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's · CPC title

  • for loudspeaker transducers · CPC title

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What does patent US9888306B2 cover?
Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a par…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H04R1/026. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).