Helical spring backplane circuit board connector

US9887475B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9887475-B2
Application numberUS-201615373693-A
CountryUS
Kind codeB2
Filing dateDec 9, 2016
Priority dateDec 9, 2015
Publication dateFeb 6, 2018
Grant dateFeb 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A low-cost electrical connector that is capable of providing a single or a multiplicity of continuous electrical connections between two individual printed circuit boards, and method of making thereof.

First claim

Opening claim text (preview).

What is claimed: 1. An electrical assembly comprising: a circuit board containing a top surface, an opposed bottom surface, a front edge, and a plurality of holes that extend from the top surface through to the bottom surface and are disposed in a row along and parallel to the front edge; and at least a portion of a helical spring disposed within the plurality of holes and configured to contact one or more conductive pads on a surface of an other circuit board, thereby placing the circuit board in electrical communication with the other circuit board. 2. The electrical assembly of claim 1 , wherein the at least the portion of the helical spring further comprises a plurality of helical spring segments. 3. The electrical assembly of claim 1 , wherein the helical spring comprises phosphor bronze. 4. The electrical assembly of claim 1 , wherein the helical spring comprises beryllium copper. 5. The electrical assembly of claim 2 , wherein at least a portion of the plurality of helical spring segments is plated with a material to improve electrical conductivity. 6. The electrical assembly of claim 5 , wherein the plating material is selected from a group including gold, tin, tin-lead alloys, copper, and nickel. 7. The electrical assembly of claim 1 , wherein the circuit board comprises at least one notch configured to retain the circuit board in a housing. 8. The electrical assembly of claim 1 , wherein the plurality of holes are evenly spaced. 9. The electrical assembly of claim 1 , wherein the plurality of holes further comprises a first group of holes with a first spacing and a second group of holes with a second spacing that is different than the first spacing. 10. A method for creating an electrical connector, the method comprising: threading a helical spring comprising a first end, a second end, and a plurality of coils into a plurality of holes disposed in a row parallel to an edge of a circuit board, wherein at least one of the plurality of holes is plated with an electrically conductive material; and soldering the helical spring to the circuit board where the helical spring passes through the at least one plated hole. 11. The method of claim 10 , further comprising removing a section from each coil in the helical spring. 12. The method of claim 10 , wherein the plurality of holes are evenly spaced. 13. The method of claim 10 , wherein the plurality of holes further comprises a first group of holes with a first spacing and a second group of holes with a second spacing that is different than the first spacing. 14. The method of claim 10 , further comprising plating at least a portion of the helical spring with a plating material to improve electrical conductivity prior to threading the helical spring into the plurality of holes. 15. The method of claim 14 , wherein plating the at least a portion of the helical spring further comprises controlling a depth that the plurality of coils of the helical spring are immersed in a bath of the plating material to improve electrical conductivity. 16. The method of claim 10 , wherein the plating material is selected from a group including gold, tin, tin-lead alloys, copper, and nickel. 17. The method of claim 14 , wherein threading further comprises aligning non-plated portions of the helical spring within the plurality of holes. 18. The method of claim 10 , wherein soldering comprises one of wave soldering, solder paste and reflow, or a solder fountain.

Assignees

Inventors

Classifications

  • H01R12/728Primary

    Coupling devices without an insulating housing provided on the edge of the PCB · CPC title

  • with a panel or printed circuit board · CPC title

  • Contact members made of resilient wire · CPC title

  • with a single cantilevered beam · CPC title

Patent family

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External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9887475B2 cover?
A low-cost electrical connector that is capable of providing a single or a multiplicity of continuous electrical connections between two individual printed circuit boards, and method of making thereof.
Who is the assignee on this patent?
Honeywell Int Inc
What technology area does this patent fall under?
Primary CPC classification H01R12/728. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).