Method for manufacturing display device and method for manufacturing electronic device

Patent metadata

Field	Value
Publication number	US-9887392-B2
Application number	US-201514628461-A
Country	US
Kind code	B2
Filing date	Feb 23, 2015
Priority date	Feb 28, 2014
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

A method for manufacturing a display device is provided. The method includes forming a display element interposed between a first substrate and a second substrate and peeling the second substrate from the first substrate so that an electrode, which is located between the first and second substrates and to be connected to an external electrode, is exposed simultaneously with the peeling of the second substrate.

First claim

What is claimed is:

1. A method for manufacturing a display device, the method comprising:
forming a display element and an electrode between a flexible substrate and a glass substrate, the electrode being in contact with and sandwiched between a first insulating layer and a second insulating layer;
peeling whole of the glass substrate from the flexible substrate so that one of the first insulating layer and the second insulating layer is partly and simultaneously removed to expose the electrode; and
connecting the exposed electrode with an external electrode through which a signal is input to the display element.

2. The method according to claim 1 ,
wherein the external electrode is a flexible printed circuit.

3. The method according to claim 1 , further comprising:
irradiating the electrode with light through the glass substrate before peeling the glass substrate.

4. The method according to claim 1 , further comprising:
bonding a second flexible substrate to the flexible substrate after peeling the glass substrate and before connecting the exposed electrode with the external electrode so that the display element and the electrode are sandwiched between the second flexible substrate and the flexible substrate.

5. The method according to claim 4 ,
wherein the second flexible substrate comprises an opening, and
wherein the second flexible substrate is bonded to the flexible substrate so that the opening overlaps with the exposed electrode.

6. The method according to claim 1 , further comprising:
forming, between the glass substrate and the flexible substrate, a peripheral circuit for controlling the display element,
wherein the signal is input to the peripheral circuit through the external electrode and the electrode.

7. A method for manufacturing a display device, the method comprising:
forming an electrode over a first substrate;
forming a first insulating layer over the electrode;
forming a display element over the first insulating layer;
bonding a second substrate to the first substrate with a bonding layer so that the electrode and the display element are sandwiched between the first substrate and the second substrate and the electrode and the display element are covered by the bonding layer;
peeling whole of the second substrate so that part of the first insulating layer and part of the bonding layer are simultaneously removed to expose the electrode, remaining the display element being covered by the bonding layer; and
connecting the exposed electrode with an external electrode through which a signal is input to the display element.

8. The method according to claim 7 ,
wherein the external electrode is a flexible printed circuit.

9. The method according to claim 7 ,
wherein the second substrate comprises a second insulating layer having an opening, and
wherein the second substrate is bonded to the first substrate so that the second insulating layer is sandwiched between the first substrate and the second substrate and the opening overlaps with the electrode.

10. The method according to claim 9 , further comprising:
irradiating the electrode with light through the opening after bonding the second substrate to the first substrate and before peeling the second substrate.

11. The method according to claim 7 , further comprising:
replacing the first substrate with a third substrate after bonding the second substrate to the first substrate and before peeling the second substrate,
wherein the third substrate is flexible.

12. The method according to claim 11 , further comprising:
bonding a fourth substrate to the third substrate after peeling the second substrate and before connecting the electrode with the external electrode so that the electrode and the display element are sandwiched between the third substrate and the fourth substrate,
wherein the fourth substrate is flexible.

13. The method according to claim 12 ,
wherein the fourth substrate comprises an opening, and
wherein the fourth substrate is bonded to the third substrate so that the opening of the fourth substrate overlaps with the electrode.

14. A method for manufacturing a display device, the method comprising:
forming a first insulating layer over a first substrate;
forming an electrode over the first insulating layer;
forming a second insulating layer over the electrode;
forming a display element over the second insulating layer;
bonding a second substrate to the first substrate so that the electrode and the display element are sandwiched between the first substrate and the second substrate;
peeling the first substrate so that part of the first insulating layer is selectively and simultaneously removed to expose the electrode, remaining other part of the first insulating layer underneath the display element; and
connecting the exposed electrode with an external electrode through which a signal is input to the display element.

15. The method according to claim 14 ,
wherein the external electrode is a flexible printed circuit.

16. The method according to claim 14 , further comprising:
forming a peeling layer over the first substrate before forming the first insulating layer, the peeling layer comprising an opening,
wherein the electrode is formed so as to overlap with the opening.

17. The method according to claim 16 ,
wherein the first insulating layer is formed so that the part of the first insulating layer is in contact with the first substrate in the opening.

18. The method according to claim 14 , further comprising:
irradiating the electrode with light through the first insulating layer before peeling the first substrate.

19. The method according to claim 14 , further comprising:
replacing the second substrate with a third substrate before peeling the first substrate,
wherein the third substrate is flexible.

20. The method according to claim 19 , further comprising:
bonding a fourth substrate to the third substrate after peeling the first substrate so that the display element is sandwiched between the third substrate and the fourth substrate,
wherein the fourth substrate is flexible.

21. A method for manufacturing a display device, the method comprising:
forming an electrode over a first substrate;
forming an insulating layer over the electrode;
forming a display element over the insulating layer;
bonding a second substrate to the first substrate with a bonding layer; and
peeling the second substrate from the first substrate,
wherein part of the insulating layer and part of the bonding layer are simultaneously removed to expose the electrode at the step of peeling the second substrate.

22. The method according to claim 21 , further comprising a step of connecting the exposed electrode with a flexible printed circuit.

Assignees

• Semiconductor Energy Lab

Inventors

• Sakuishi Tatsuya
• Nakamura Daiki
• Chida Akihiro
• Aoyama Tomoya

Classifications

• B32B38/105 Primary

  on edges · CPC title

• B32B2310/0843

  using laser · CPC title

• B32B2457/20

  Displays, e.g. liquid crystal displays, plasma displays · CPC title

• H01L27/1266

  Electricity · mapped topic

• H01L2227/323

  Electricity · mapped topic