3D printed active electronic materials and devices

Patent metadata

Field	Value
Publication number	US-9887356-B2
Application number	US-201615003198-A
Country	US
Kind code	B2
Filing date	Jan 21, 2016
Priority date	Jan 23, 2015
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

Disclosed is a process whereby diverse classes of materials can be 3D printed and fully integrated into device components with active properties. An exemplary embodiment shows the seamless interweaving of five different materials, including (1) emissive semiconducting inorganic nanoparticles, (2) an elastomeric matrix, (3) organic polymers as charge transport layers, (4) solid and liquid metal leads, and (5) a UV-adhesive transparent substrate layer, demonstrating the integrated functionality of these materials. Further disclosed is a device for printing these fully integrated 3D devices.

First claim

What is claimed:

1. A method of making a device, comprising the steps of:
providing an ink comprising semiconductor particles;
extruding the ink comprising semiconductor particles to form at least one active electronic layer via 3D printing;
providing a conductive ink; and
extruding the conductive ink to form at least one conductive pattern via 3D printing,
wherein the at least one conductive pattern is adapted to allow an electric potential to be applied across the active electronic layer.

2. The method according to claim 1 , further comprising 3D printing at least one of an elastomeric matrix, organic polymers as charge transport layers, solid or liquid metal leads, nanoparticle semiconductors, or a UV-adhesive transparent substrate layer.

3. The method according to claim 1 , further comprising:
identifying at least one material of an electrode, semiconductor, or polymer that possesses desired functionalities and exists in a printable format; and
patterning of the at least one identified material via direct dispensing from a computer aided design (CAD)-designed construct onto a substrate.

4. The method according to claim 3 , further comprising:
scanning the topology of the surface of the substrate; and
providing information derived from the scanning step into the computer aided design (CAD) design of the device for conformal 3D printing.

5. The method according to claim 4 , wherein the substrate comprises a contact lens.

6. The method according to claim 5 , wherein electronics printed on the contact lenses provides a wearable display and/or a continuous on-eye glucose sensor.

7. The method according to claim 4 , wherein the substrate comprises at least one of a flat substrate, a non-flat substrate, a biological substrate, a glass substrate, a polyamide film, and a 3D printed substrate.

8. The method according to claim 3 , wherein the device is an active device from among quantum dot light-emitting diodes (QD-LEDs), MEMS devices, transistors, solar cells, piezoelectrics, batteries, fuel cells, and photodiodes.

9. The method according to claim 3 , incorporating other classes of nanoscale functional building blocks and devices, including metallic, semiconductor, plasmonic, biological, and ferroelectric materials.

10. The method according to claim 3 , wherein the active electronic layer is printed by a method comprising the steps of: providing a syringe with a predetermined nozzle tip size, loading the ink comprising the semiconducting particles into the syringe, placing the syringe under vacuum, turning off the vacuum, lowering the syringe until the ink at the nozzle tip touches the substrate, holding the syringe in place for a predetermined period of time, and raising the syringe and placing the syringe under vacuum.

11. The method according to claim 3 , further comprising printing a conductive pattern connecting the active electronic layer and a second active electronic layer.

12. The method according to claim 3 , further comprising dissolving or suspending the at least one material in a composition comprising an orthogonal solvent.

13. The method according to claim 12 , wherein the composition further comprises a second orthogonal solvent.

14. The method according to claim 12 , wherein the at least one material is present in the composition at between about 0.02 wt % and about 0.20 wt %.

15. A method of making a quantum dot light emitting diode (QD-LED) with a 3D printer, comprising:
printing circular rings connected to contact pads on a substrate using a conductive nanoparticle ink;
annealing the printed conductive nanoparticles;
dispensing a conductive polymer at approximately the center of the printed circular ring until a contact line defining the outer perimeter of the conductive polymer touches the printed circular ring;
heating the substrate;
dispensing and annealing a solution comprising between about 0.05 and about 0.20 wt % Poly(N,N′-bis-4-butylphenyl-N,N′-bisphenyl)benzidine (poly-TPD) in chlorobenzene;
dispensing CdSe/ZnS QDs in a co-solvent mixture onto the annealed poly-TPD;
drying the QDs;
printing a liquid metal at approximately the center of the printed circular ring;
printing an ultraviolet (UV) adhesive around the liquid metal to insulate it from the conductive nanoparticle ink;
curing the printed adhesive with a laser;
printing conductive silicone; and
printing and curing UV adhesive to encapsulate the printed QD-LED.

16. The method according to claim 15 , further comprising:
printing conductive silicone as vertical interconnects along with room temperature vulcanization (RTV) silicone to connect the exposed liquid metal to the contact pads and to connect the anode and cathode of different QD-LED layers so as to 3D print an array of QD-LEDs.

17. The method according to claim 15 , further comprising:
scanning the surface using a 3D scanner to generate a geometrically faithful computer model of the surface;
providing the computer model to the 3D printer, and adjusting the 3D printing process to enable conformal 3D printing on a substrate having a non-flat, 3D surface or a flat surface which has structural elements on the surface.

18. The method according to claim 15 , wherein the conductive nanoparticle is comprised of silver, the conductive polymer is poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS), and the liquid metal is EGaIn.

Assignees

• Mcalpine Michael C
• Kong Yong Lin
• Univ Princeton

Inventors

• Mcalpine Michael C
• Kong Yong Lin

Classifications

• B29K2025/06

  PS, i.e. polystyrene · CPC title

• B29K2995/0005

  Conductive · CPC title

• Y02E10/549

  Organic PV cells · CPC title

• G02C11/10

  Electronic devices other than hearing aids · CPC title

• B33Y50/02

  for controlling or regulating additive manufacturing processes · CPC title