Laser processing of superconductor layers

US9887342B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9887342-B2
Application numberUS-201715415071-A
CountryUS
Kind codeB2
Filing dateJan 25, 2017
Priority dateNov 27, 2013
Publication dateFeb 6, 2018
Grant dateFeb 6, 2018

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  1. Title

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  2. Abstract

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Abstract

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A method of forming a superconductor includes exposing a layer disposed on a substrate to an oxygen ambient, and selectively annealing a portion of the layer to form a superconducting region within the layer.

First claim

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What is claimed is: 1. An integrated superconductor device, comprising: a substrate base; a buffer layer disposed on the substrate base and comprising a preferred crystallographic orientation; and a superconductor layer disposed on the buffer layer, the superconductor layer comprising a superconducting region, and a first region outside the superconducting region, wherein the first region and superconducting region have at least three elements in common, wherein the superconducting region comprises a superconductor material having a preferred crystallographic orientation in which the c-axis of crystallites are arranged perpendicularly to the plane of the substrate in preference over other possible orientations, and wherein the first region comprises an amorphous material, a poorly crystalline material, randomly oriented crystallites, or an a-axis orientation. 2. The integrated superconductor device of claim 1 , wherein the superconducting region comprises a copper oxide-based superconductor material having a c-axis texture in which the crystallites of the superconducting region have their c-axes oriented perpendicularly to a plane of the substrate. 3. The integrated superconductor device of claim 1 , wherein the superconducting region has a critical current greater than 2 MA/cm 2 . 4. An integrated superconductor device, comprising: a substrate comprising a substrate base, the substrate defining a plane of the substrate; a buffer layer disposed on the substrate base; and a superconductor layer disposed on the buffer layer, the superconductor layer comprising a superconducting region, and a first region, disposed outside the superconducting region, wherein the superconducting region comprises superconductor material having a preferred crystallographic orientation in which the c-axis of crystallites are arranged perpendicularly to the plane of the substrate in preference over other possible orientations, and wherein the first region does not comprise a superconductor material having the preferred crystallographic orientation in which the c-axis of crystallites are arranged perpendicularly to the plane of the substrate in preference over other possible orientations. 5. The integrated superconductor device of claim 4 , wherein the superconducting region has higher critical current than the first region. 6. The integrated superconductor device of claim 4 , wherein the superconducting region and the first region have at least three elements in common. 7. The integrated superconductor device of claim 4 , wherein the superconducting region and the first region have different crystalline orientations. 8. The integrated superconductor device of claim 4 , wherein the superconducting region comprises a serpentine shape, a spiral shape, or a plurality of lines. 9. The integrated superconductor device of claim 4 , wherein the first region comprises amorphous material or randomly oriented polycrystalline superconductor crystallites. 10. The integrated superconductor device of claim 4 , wherein the superconductor layer comprises ReBa 2 Cu 3 O 7−x where Re is a rare earth element, wherein the first region comprises a set of regions in which crystallites of the superconductor layer have their c-axes oriented parallel to the plane of the substrate. 11. The integrated superconductor device of claim 4 , wherein the substrate comprises a set of raised features having sidewalls, and wherein the superconductor layer comprises superconductor material disposed on the sidewalls. 12. The integrated superconductor device of claim 4 , wherein the buffer layer comprising a preferred crystallographic orientation that is operative to generate, in the superconductor layer, superconductor material having the preferred crystallographic orientation in which the c-axis of crystallites are arranged perpendicularly to the plane of the substrate in preference over other possible orientations. 13. The integrated superconductor device of claim 4 , wherein the substrate base comprises a silicon-on-insulator (SOI) substrate, wherein a silicon layer of the SOI substrate comprises a thickness less than 10 micrometers. 14. An integrated superconductor substrate, comprising: a substrate defining a plane of the substrate, the substrate further comprising a substrate base, wherein the substrate base comprises a set of raised features having sidewalls; a buffer layer disposed on the substrate base; and a superconductor layer disposed on the buffer layer, the superconductor layer comprising: a superconducting region including superconductor material disposed on the sidewalls; and a first region, disposed outside the superconducting region, wherein the superconducting region comprises superconductor material having a c-axis orientation in which the c-axes of the crystallites are aligned perpendicularly to the plane of the substrate, and wherein the first region does not comprise a superconductor material having the c-axis orientation. 15. The integrated superconductor substrate of claim 14 , further comprising: a metal disposed on a portion of the superconductor layer, including the superconductor material disposed on the sidewalls. 16. The integrated superconductor substrate of claim 14 , wherein the superconductor layer comprises a material in a family of ReBa 2 Cu 3 O 7−x material, wherein Re is a rare earth element, and wherein the first region comprises a set of regions in which crystallites of the layer have their c-axes oriented parallel to the plane of the substrate. 17. The integrated superconductor substrate of claim 14 , the first region comprising a poorly crystalline or amorphous region having a thickness greater than two micrometers. 18. The integrated superconductor device of claim 14 , wherein the buffer layer comprising a preferred crystallographic orientation that is operative to generate, in the superconductor layer, superconductor material having the c-axis orientation in which the c-axes of the crystallites are aligned perpendicularly to the plane of the substrate.

Assignees

Inventors

Classifications

  • including sheet or component perpendicular to plane of web or sheet · CPC title

  • H01L39/128Primary

    Electricity · mapped topic

  • Electricity · mapped topic

  • Electricity · mapped topic

  • Treatment of superconductor layers by irradiation, e.g. ion-beam, electron-beam, laser beam or X-rays · CPC title

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What does patent US9887342B2 cover?
A method of forming a superconductor includes exposing a layer disposed on a substrate to an oxygen ambient, and selectively annealing a portion of the layer to form a superconducting region within the layer.
Who is the assignee on this patent?
Varian Semiconductor Equipment Ass Inc
What technology area does this patent fall under?
Primary CPC classification H01L39/128. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).