Light emitting device package

Patent metadata

Field	Value
Publication number	US-9887324-B2
Application number	US-201414484637-A
Country	US
Kind code	B2
Filing date	Sep 12, 2014
Priority date	Sep 16, 2013
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer.

First claim

What is claimed is:

1. A light emitting device package comprising:
a package body having a first surface and a second surface opposite the first surface, a cavity being formed on the first surface such that a ledge is formed at the top of the cavity;
a submount provided in the cavity, wherein the submount is not used as an electrode;
a heat sink provided at the bottom of the cavity, including at least one surface exposed externally at the package body;
an inorganic paste layer provided to bond the submount onto the heat sink, the inorganic paste layer being thermally conductive and nonreactive with UV light;
a light emitting device eutectically bonded, using a metal, to the submount for emitting ultraviolet (UV) light, the light emitting device having a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer;
a cover provided over the ledge to cover the cavity;
at least one inorganic layer provided between the cover and the cavity;
at least one inorganic coating layer formed of only inorganic matter is provided on an upper surface of the cover away from the light emitting device or on a lower surface of the cover toward the light emitting device;
an electrode provided on a top surface of the light emitting device and connected to the first conductive type semiconductor layer;
a coating layer provided to cover an outer surface of the light emitting device; and
a passivation layer provided on lateral surfaces of the light emitting device,
wherein the light emitting device is a vertical type configured to emit light in a vertical direction, and
wherein the coating layer formed of inorganic material is provided adjacent first and second electrodes to expose the first and second electrodes.

2. The light emitting device package of claim 1 , wherein the at least one inorganic layer is formed of at least one of Au, Ag or Sn.

3. The light emitting device package of claim 1 , wherein the inorganic paste layer includes at least one of Au, Ag or Sn.

4. The light emitting device package of claim 3 , wherein the coating layer is provided to cover outer surfaces of the light emitting device, the submount, and the inorganic paste layer.

5. The light emitting device package of claim 4 , wherein the inorganic material for the coating layer is at least one of MgF 2 , SiO 2 or TiO 2 .

6. The light emitting device package of claim 5 , further including a bonding layer provided between the ledge on the package body and the cover, the bonding layer formed of an inorganic material.

7. The light emitting device package of claim 6 , wherein the inorganic material of the bonding layer is at least one of Au, Ag or Sn.

8. The light emitting device package of claim 1 , wherein widths of the inorganic paste layer and the submount are greater than a width of the light emitting device.

9. The light emitting device package of claim 4 , further including a plurality of electrodes provided on the light emitting device and the submount, wherein the coating layer is provided adjacent to the plurality of electrodes to expose the plurality of electrodes.

10. The light emitting device package of claim 1 , wherein the at least one inorganic layer provided on the cover includes a first inorganic layer provided on the upper surface of the cover and a second inorganic layer provided on the lower surface of the cover.

11. The light emitting device package of claim 1 , further including a coating layer provided to cover outer surfaces of the light emitting device, the submount, and the inorganic paste layer, wherein the coating layer is formed of inorganic material.

12. The light emitting device package of claim 11 , wherein the inorganic material for the coating layer is at least one of MgF 2 , SiO 2 or TiO 2 .

13. The light emitting device package of claim 1 , further including a bonding layer provided between the ledge on the package body and the cover, the bonding layer formed of an inorganic material.

14. The light emitting device package of claim 1 , wherein the at least one inorganic layer includes at least one of Au, Ag or Sn.

15. The light emitting device package of claim 1 , further comprising a lens disposed at an uppermost end of the package body, wherein the lens has a surface with at least one inflection point.

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Baek Jun
• Kodaira Hiroshi
• Kim Byung Mok
• Kim Ha Na
• Tanda Yuichiro
• Ozeki Satoshi

Classifications

• H10W90/752

  between stacked chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/547

  Dispositions of multiple bond wires · CPC title