Semiconductor device and power conversion device
US-2024355888-A1 · Oct 24, 2024 · US
US9887267B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9887267-B2 |
| Application number | US-201615234350-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 11, 2016 |
| Priority date | Aug 11, 2015 |
| Publication date | Feb 6, 2018 |
| Grant date | Feb 6, 2018 |
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A normally-off transistor with a high operating voltage is provided. The transistor can include a barrier above the channel and an additional barrier layer located below the channel. A source electrode and a drain electrode are connected to the channel and a gate electrode is connected to the additional barrier layer located below the channel. The bandgap for each of the barrier layers can be larger than the bandgap for the channel. A polarization charge induced at the interface between the additional barrier layer below the channel and the channel depletes the channel. A voltage can be applied to the bottom barrier to induce free carriers into the channel and turn the channel on.
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What is claimed is: 1. A field effect transistor comprising: a first barrier and a second barrier; a channel located between the first barrier and the second barrier, wherein a bandgap for each of the first barrier and the second barrier is larger than a bandgap for the channel, wherein a doping type for the first barrier is opposite to a doping type for the channel; a source electrode and a drain electrode connected to the channel; and a gate electrode connected to the first barrier. 2. The transistor of claim 1 , wherein the first barrier is doped with p-type dopants and the channel is doped with n-type dopants. 3. The transistor of claim 1 , wherein at least one of: the first barrier, the second barrier, or the channel are formed by short-period superlattices. 4. The transistor of claim 1 , wherein the source electrode and drain electrode form a multifinger pattern. 5. The transistor of claim 1 , further comprising a set of field-plate electrodes directly connected or capacitively coupled to at least one of: the source, drain, and gate electrodes. 6. The transistor of claim 1 , further comprising a passivation layer located above the second barrier. 7. The transistor of claim 6 , further comprising a charge control electrode connecting at least one of: the passivation layer or the second barrier to the channel. 8. The transistor of claim 6 , further comprising at least one additional gate electrode connected to at least one of: the passivation layer or the second barrier. 9. The transistor of claim 6 , further comprising a charge control electrode connecting the gate electrode to at least one of: the passivation layer or the second barrier. 10. The transistor of claim 9 , wherein the charge control electrode capacitively couples the gate electrode, the passivation layer, and the second barrier. 11. A field effect transistor comprising: a first barrier and a second barrier; a channel located between the first barrier and the second barrier, wherein a bandgap for each of the first barrier and the second barrier is larger than a bandgap for the channel, and wherein a doping type for the first barrier is opposite to a doping type for the channel and the doping type for the channel is a same doping type as a doping type for the second barrier; a source electrode and a drain electrode connected to the channel; and a gate electrode connected to the first barrier. 12. The transistor of claim 11 , wherein the first barrier is doped with p-type dopants and the channel is doped with n-type dopants. 13. The transistor of claim 11 , wherein the source electrode and the drain electrode form a multifinger pattern. 14. The transistor of claim 11 , at least one of: the first barrier, the second barrier, or the channel, is formed by a short-period superlattice. 15. The transistor of claim 11 , further comprising a passivation layer located above the second barrier. 16. The transistor of claim 15 , further comprising a charge control electrode connecting the gate electrode to at least one of: the passivation layer or the second barrier. 17. The transistor of claim 15 , further comprising a charge control electrode connecting at least one of: the passivation layer or the second barrier to the channel. 18. The transistor of claim 15 , further comprising at least one additional gate electrode connected to at least one of: the passivation layer or the second barrier. 19. A field effect transistor comprising: a first barrier and a second barrier; a channel located between the first barrier and the second barrier, wherein a bandgap for each of the first barrier and the second barrier is larger than a bandgap for the channel; a passivation layer located above the second barrier; a source electrode and a drain electrode connected to the channel; a gate electrode connected to the first barrier, wherein the gate electrode is located on a portion of the first barrier outside of a region defined by the source electrode and the drain electrode; and a charge control electrode connecting the gate electrode to at least one of: the passivation layer or the second barrier. 20. The transistor of claim 19 , wherein a doping type for the first barrier is opposite to a doping type for the channel.
for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies (source or drain electrodes of TFTs H10D30/673) · CPC title
for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes (source or drain electrodes of TFTs H10D30/673) · CPC title
Nitride Group III-V materials, e.g. AlN or GaN · CPC title
Electricity · mapped topic
Electricity · mapped topic
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