Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules

Patent metadata

Field	Value
Publication number	US-9887221-B2
Application number	US-201515119182-A
Country	US
Kind code	B2
Filing date	Feb 18, 2015
Priority date	Feb 18, 2014
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.

First claim

What is claimed is:

1. An optical module comprising:
a substrate;
an image sensor on the substrate;
a transparent plate disposed over the image sensor;
a beam shaping system disposed over the transparent plate;
a spacer disposed between a surface of the image sensor and the transparent plate, wherein the spacer includes an alignment edge in direct contact with the surface of the image sensor; and
material laterally encircling the transparent plate and including an adhesion edge attached to a surface of the substrate by adhesive.

2. The module of claim 1 wherein the adhesion edge is at an outer side surface of the material laterally encircling the transparent plate.

3. The module of claim 2 wherein the outer side surface is substantially perpendicular to the surface of the substrate.

4. The module of claim 1 wherein the alignment edge rests on an inactive surface of the image sensor.

5. The module of claim 1 wherein the adhesive, the alignment edge and the adhesion edge define a cavity, the module further including one or more wires connecting the image sensor to the substrate, wherein the one or more wires are disposed within the cavity.

Assignees

• Heptagon Micro Optics Pte Ltd

Inventors

• Rudmann Hartmut
• Alasirnioe Jukka
• Tesanovic Bojan
• Senn Tobias
• Kupusamy Devanraj
• Bietsch Alexander

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title