Packaging of LED chips and driver circuit on the same substrate

Patent metadata

Field	Value
Publication number	US-9887185-B2
Application number	US-201615339758-A
Country	US
Kind code	B2
Filing date	Oct 31, 2016
Priority date	Dec 20, 2011
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

The purpose of the present invention is to reduce the size and thickness of an LED module. The LED module includes a circuit substrate, at least two supply terminals, a plurality of LED dies, a plurality of FET die, a constant current circuit, a dam member, a fluorescent resin, a resistor network, and a bypass circuit, wherein the constant current circuit includes one of the plurality of FET die and the bypass circuit includes other of the plurality of FET die, a portion of the dam enclosing the LED block region forms a portion of the dam enclosing the circuit block region, and the dam member enclosing the LED block region has a annular shape and the dam member enclosing the circuit block region has a rectangular shape except for said portion of the dam member.

First claim

The invention claimed is:

1. An LED module comprising:
a circuit substrate;
at least two supply terminals for supplying to said circuit substrate a rectified waveform voltage derived from a commercial AC power supply and arranged in the corners of said circuit substrate;
a plurality of LED dies mounted directly in bare chip form on one surface of said circuit substrate and arranged so as to form a series circuit;
a plurality of FET dies, mounted directly in bare chip form on said one surface of said circuit substrate, for limiting current flowing through said plurality of LED dies;
a constant current circuit mounted on said one surface of said circuit substrate and connected in series with said series circuit;
a dam member formed on said circuit substrate so as to enclose an LED block region where said plurality of LED dies are mounted and a circuit block region where at least one of said plurality of FET dies is mounted and so as to separate said LED block region from said circuit block region;
a fluorescent resin for covering said LED block region and said circuit block region, the fluorescent resin being a single material;
a resistor network mounted directly in bare chip form on said one surface of said circuit substrate; and
a bypass circuit connected to an intermediate terminal provided on said series circuit, wherein
said constant current circuit includes one of said plurality of FET dies and said bypass circuit includes other of said plurality of FET dies,
a portion of said dam enclosing said LED block region forms a portion of said dam enclosing said circuit block region, and
said dam member enclosing said LED block region has a annular shape and said dam member enclosing said circuit block region has a rectangular shape except for said portion of said dam member.

2. The LED module according to claim 1 , wherein at least one of said plurality of FET dies is a depletion-mode device.

3. The LED module according to claim 1 , further comprising a dimmer circuit, mounted on said one surface of said circuit substrate, for controlling the amount of light to be emitted from said plurality of LED dies.

4. The LED module according to claim 1 , wherein said resistor network contains a protective resistor for at least one of said plurality of FET dies and a current sensing resistor for said bypass circuit.

5. An LED module comprising:
a rectangular circuit substrate;
at least two supply terminals for supplying to said circuit substrate a rectified waveform voltage derived from a commercial AC power supply and arranged in the corners of said circuit substrate;
a plurality of LED dies mounted directly in bare chip form on one surface of said circuit substrate and arranged so as to form a series circuit;
an FET die, mounted directly in bare chip form on said one surface of said circuit substrate, for limiting current flowing through said plurality of LED dies;
a dimmer circuit, mounted on said one surface of said circuit substrate, for controlling the amount of light to be emitted from said plurality of LED dies;
a dam formed on said circuit substrate so as to enclose an LED block region where said plurality of LED dies are mounted and a circuit block region where said FET die is mounted and so as to separate said LED block region from said circuit block region;
a fluorescent resin for covering said LED block region and said circuit block region, the fluorescent resin being a single material; and
a resistor network mounted directly in bare chip form on said one surface of said circuit substrate, wherein
a portion of said dam enclosing said LED block region forms a portion of said dam enclosing said circuit block region, and
said dam member enclosing said LED block region has a annular shape and said dam member enclosing said circuit block region has a rectangular shape except for said portion of said dam member.

6. The LED module according to claim 5 , further comprising a bypass circuit connected to an intermediate terminal provided on said series circuit, and wherein said bypass circuit includes said FET die.

7. The LED module according to claim 6 , wherein said resistor network contains a protective resistor for said FET die and a current sensing resistor for said bypass circuit.

8. An LED module comprising:
a rectangular circuit substrate;
at least two supply terminals for supplying to said circuit substrate a rectified waveform voltage derived from a commercial AC power supply and arranged in the corners of said circuit substrate;
a plurality of LED dies mounted directly in bare chip form on one surface of said circuit substrate and arranged so as to form a series circuit;
an FET die, mounted directly in bare chip form on said one surface of said circuit substrate, for limiting current flowing through said plurality of LED dies;
a dam formed on said circuit substrate so as to enclose an LED block region where said plurality of LED dies are mounted and a circuit block region where said FET die is mounted and so as to separate said LED block region from said circuit block region;
a fluorescent resin for covering said LED block region and said circuit block region, the fluorescent resin being a single material; and
a resistor network mounted directly in bare chip form on said one surface of said circuit substrate, wherein
a portion of said dam enclosing said LED block region forms a portion of said dam enclosing said circuit block region, and
said dam member enclosing said LED block region has a annular shape and said dam member enclosing said circuit block region has a rectangular shape except for said portion of said dam member.

9. The LED module according to claim 8 , further comprising a bypass circuit connected to an intermediate terminal provided on said series circuit, and wherein said bypass circuit includes said FET die.

10. The LED module according to claim 9 , wherein said resistor network contains a protective resistor for said FET die and a current sensing resistor for said bypass circuit.

11. The LED module according to claim 10 , wherein said current sensing resistor is provided with a bonding option pad.

12. The LED module according to claim 11 , wherein said bonding option pad including a pad connecting to an intermediate portion of a band-like resistive element and a pad connecting to an end portion of said band-like resistive element.

13. An LED module comprising;
a rectangular circuit substrate;
at least two supply terminals for supplying to said circuit substrate a rectified waveform voltage derived from a commercial AC power supply and arranged in the corners of said circuit substrate;
a plurality of LED dies mounted directly in bare chip form on one surface of said circuit substrate and arranged so as to form a series circuit;
an FET die, mounted directly in bare chip form on said one surface of said circuit substrate, for limiting current flowing through said plurality of LED dies;
a dam member formed on said circuit substrate so as to enclose an LED block region where said plurality of LED dies are mounted and a circuit block region where said FET die is mounted and so as to separate said LED block region from said circuit block region; and
a fluorescent resin for covering said LED block region and said circuit block region, the fluorescent resin being a single material, wherein
a portion of said dam enclosing said LED block region forms a portion of said dam enclosing said circuit block region, and
said dam member enclosing said LED block region has a annular shape and said dam member enclosing said circuit block region has a rectangular shape except for said portion of said dam member.

Assignees

• Citizen Watch Co Ltd
• Citizen Electronics

Inventors

• Akiyama Takashi
• Watanabe Shigehisa
• Arai Hidekazu
• Ochiai Yuki

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W76/47

  Solid or gel fillings · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H05B45/48

  having LEDs organised in strings and incorporating parallel shunting devices · CPC title

• H05B45/50

  responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits · CPC title