Thermal flow meter

Patent metadata

Field	Value
Publication number	US-9887168-B2
Application number	US-201715621053-A
Country	US
Kind code	B2
Filing date	Jun 13, 2017
Priority date	Jun 15, 2012
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

Provided is a thermal flow meter that can be prevented from being eroded due to adhesion of water or like to a cut end portion of the lead exposed from the mold resin of the circuit package. A thermal flow meter 300 of the present invention is a thermal flow meter having a circuit package 400 formed by mounting a detection element 518 on leads 544 and 545 supported by a support frame 512 , sealing with a mold resin, and cutting off the support frame 512 , wherein cut end portions 544 a and 545 a of the leads 544 and 545 exposed from the mold resin of the circuit package 400 by cutting off the support frame 512 is covered by a covering portion 371.

First claim

The invention claimed is:

1. A thermal flow meter comprising:
a circuit package comprising a lead frame, a control circuit connected to a detection element electrically, and a mold resin sealing the control circuit; and
a housing to which the circuit package is fixed, wherein
the circuit package is sealed with a first mold resin through a first resin molding process, the housing is formed of a second mold resin through a second resin molding process,
a cut end portion of the lead exposed from the mold resin of the circuit package by cutting the support frame is covered by a covering portion, and
the covering portion is formed of the second mold resin in the second resin molding process.

2. The thermal flow meter according to claim 1 , further comprising:
an external connector connecting electrically to external devices,
wherein the covering portion is formed by a resin forming the external connector.

3. The thermal flow meter according to claim 2 , further comprising:
a fixed portion fixing the circuit package,
wherein the fixing portion is formed by a resin forming the external connector.

4. The thermal flow meter according to claim 2 ,
wherein the mold resin sealing the control circuit is thermosetting resin and the resin forming the external connector is thermoplastic resin.

5. The thermal flow meter according to claim 3 ,
wherein the mold resin sealing the control circuit is thermosetting resin and the resin forming the external connector is thermoplastic resin.

6. The thermal flow meter according to claim 1 ,
wherein the lead frame has a plural of cut end portions of the lead frame covered with the covering portion and a voltage difference between the plural of cut end portions are caused.

7. A method of manufacturing the thermal flow meter according to claim 1 , comprising:
supporting leads by a support frame and sealing the control circuit mounted on the lead frame by the mold resin,
cutting off the leads so as to separate the circuit package from the support frame,
covering the cut end portion of the leads exposed from the mold resin sealing the control circuit of the circuit package.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Tashiro Shinobu
• Hanzawa Keiji
• Tokuyasu Noboru
• Morino Takeshi
• Doi Ryosuke
• Uenodan Akira

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W76/60

  Seals · CPC title

• H10W42/00 Primary

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title