Solid state deposition methods, apparatuses, and products

Patent metadata

Field	Value
Publication number	US-9884369-B2
Application number	US-201414577723-A
Country	US
Kind code	B2
Filing date	Dec 19, 2014
Priority date	Mar 3, 2014
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

The described embodiments relate generally to methods for forming structures by solid state deposition processes. More specifically a method for depositing cold spray over a removable body is disclosed. Methods are also disclosed for affixing operational and structural components to a surface of a device housing with cold spray.

First claim

What is claimed is:

1. A method for forming a metallic structure on a substrate having protruding members, the method comprising:
forming a metallic layer by using a solid-state deposition process to spray metallic particles over the protruding members and over a sacrificial body having a volume that is positioned between the protruding members;
forming the metallic structure by shaping an outer surface of the metallic layer using a machining process; and
forming a void defined by the metallic structure, the protruding members, and the substrate by reducing the volume of the sacrificial body.

2. The method as recited in claim 1 , wherein the volume of the sacrificial body is generally unchanged during the shaping of the outer surface of the metallic layer.

3. The method of claim 1 , wherein top and side surfaces of the protruding members are covered by the metallic structure.

4. The method of claim 1 , wherein the volume of the sacrificial body is reduced by using at least one of dissolving the sacrificial body or melting the sacrificial body.

5. The method of claim 3 , wherein the top and side surfaces of the protruding members are unaltered during the shaping of the outer surface.

6. The method of claim 1 , wherein a void volume corresponds to at least an amount of reduction of the volume of the sacrificial body.

7. The method of claim 1 , wherein the sacrificial body has a higher melting point than a temperature at which the metallic particles are sprayed.

8. The method of claim 1 , wherein, during spraying the metallic particles, the sacrificial body includes an indentation characterized as having a rib structure that is at least partially filled with the metallic particles such that upon altering the sacrificial body, the metallic particles within the indentation form a corresponding rib structure.

9. The method of claim 1 , wherein at least a portion of the sacrificial body includes material having a lower melting point than a melting point of the metallic layer.

10. A method of electrically isolating an electrical component within a metallic structure, the method comprising:
forming the metallic structure by using a solid-state deposition process to deposit metallic particles over protruding members that are included on a substrate and over a sacrificial body positioned between the protruding members, wherein an electrical component is secured to the substrate and embedded within the sacrificial body, and the metallic particles act as a conductive shield that inhibits electromagnetic energy from passing through the metallic structure to interfere with the electrical component;
shaping an outer surface of the metallic structure by using a machining process; and
forming a void defined by the metallic structure, the protruding members, and the substrate by altering the sacrificial body such as to reduce a volume of the sacrificial body, wherein the electrical component remains secured to the substrate and within the void subsequent to forming the void.

11. The method of claim 10 , wherein the metallic structure is a structural rib.

12. The method of claim 10 , wherein altering of the sacrificial body comprises heating the sacrificial body to a first melting temperature that is less than a second melting temperature associated with the metallic structure.

13. The method of claim 10 , wherein the metallic structure includes at least one opening configured to allow passage of RF energy through the metallic structure.

14. The method of claim 10 , wherein the metallic structure covers top and side surfaces of the protruding members.

Assignees

• Apple Inc

Inventors

• Lancaster Larocque Simon Regis Louis
• Miller Ari P
• Deforest Laura M
• Goldberg Michelle R
• Leggett William F
• Garelli Adam T

Classifications

• B22F3/24 Primary

  After-treatment of workpieces or articles {(B22F3/1146 takes precedence)} · CPC title

• C23C28/02

  only coatings {only including layers} of metallic material · CPC title

• B05D1/12

  Applying particulate materials (B05D1/06, B05D1/10 take precedence) · CPC title

• H04R1/2811 Primary

  for loudspeaker transducers · CPC title

• B05D1/10

  Applying particulate materials · CPC title