Dynamically scanned x-ray detector panel

Patent metadata

Field	Value
Publication number	US-9883840-B2
Application number	US-201514611509-A
Country	US
Kind code	B2
Filing date	Feb 2, 2015
Priority date	Nov 3, 2011
Publication date	Feb 6, 2018
Grant date	Feb 6, 2018

Abstract

An x-ray imaging system for imaging a subject includes an x-ray source configured to project an x-ray radiation toward a portion of the subject and a panel detector positioned opposite the x-ray source relative to the subject and configured to receive x-ray radiation passing through the subject. The panel detector includes a scintillation layer converting x-ray radiation to light rays of a selected spectrum and a plurality of microelectromechanical scanners. Each microelectromechanical scanner includes a photodetector mounted on a corresponding movable platform and configured to detect light in the selected light spectrum. The panel detector includes a scanning control module configured to move each platform in a selected scan pattern.

First claim

What is claimed is:

1. A system comprising:
a scintillation layer configured to (i) receive x-rays emitted from an x-ray source, and (ii) convert the x-rays to light;
a plurality of microelectromechanical scanners configured to (i) detect corresponding portions of the light, and (ii) generate respective signals;
a scanning module configured to actuate each of the plurality of microelectromechanical scanners, wherein each of the signals is generated based on actuation of the corresponding one of the plurality of microelectromechanical scanners; and
a processor configured to generate an image based on the signals, wherein each of the signals contributes to a corresponding portion of the image.

2. The system of claim 1 , wherein the plurality of microelectromechanical scanners comprise a plurality of transistors.

3. The system of claim 1 , wherein:
the plurality of microelectromechanical scanners comprise respectively a plurality of photodetectors;
the plurality of photodetectors comprise a plurality of platforms; and
the scanning module is configured to move each of the plurality of platforms.

4. The system of claim 3 , wherein the scanning module is configured to:
select a plurality of patterns; and
move each of the plurality of platforms in a corresponding one of the plurality of patterns.

5. The system of claim 4 , wherein the plurality of patterns include a spiral pattern, a radial pattern, a circular pattern, or a rectangular pattern.

6. The system of claim 1 , wherein the scanning module is configured to move one of the plurality of microelectromechanical scanners at different sweep frequencies.

7. The system of claim 1 , wherein:
the plurality of microelectromechanical scanners comprise a first microelectromechanical scanner and a second microelectromechanical scanner; and
the scanning module is configured to move (i) the first microelectromechanical scanner at a first sweep frequency, and (ii) the second microelectromechanical scanner at a second sweep frequency.

8. The system of claim 1 , further comprising a plurality of mechanical actuators, wherein:
the plurality of microelectromechanical scanners comprise respectively a plurality of photodiodes; and
the scanning module is configured to move the plurality of microelectromechanical scanners, via the plurality of mechanical actuators, to pivot each of the plurality of photodiodes about two corresponding orthogonal axes.

9. The system of claim 1 , further comprising:
the x-ray source, wherein the x-ray source is configured to emit the x-rays toward an object; and
a panel detector that comprises the scintillation layer and the plurality of microelectromechanical scanners, wherein the panel detector is (i) positioned on an opposite side of the object than the x-ray source, and (ii) configured to receive the x-rays after the x-rays have passed through the object.

10. The system of claim 1 , further comprising a second layer disposed between the scintillation layer and the plurality of microelectromechanical scanners.

11. The system of claim 10 , wherein:
the second layer is configured to receive the light from the scintillation layer; and
the plurality of microelectromechanical scanners are configured to receive the light after the light has passed through the second layer.

12. The system of claim 11 , further comprising a mirror, wherein the plurality of microelectromechanical scanners are disposed between the second layer and the mirror such that the plurality of microelectromechanical scanners are configured to receive the light after the light has reflected off of the mirror.

13. The system of claim 1 , further comprising a second layer and a third layer, wherein:
the second layer comprises the plurality of microelectromechanical scanners, wherein the x-rays pass through the second layer and are then received at the scintillation layer;
the scintillation layer is disposed between the second layer and the third layer; and
the plurality of microelectromechanical scanners are configured to receive the light after the light has been emitted from the scintillation layer.

14. The system of claim 1 , wherein the plurality of microelectromechanical scanners are configured to detect corresponding portions of the light and generate the respective signals.

15. A system comprising:
a scintillation layer configured to (i) receive x-rays emitted from an x-ray source, and (ii) convert the x-rays to light;
a plurality of transistors configured to (i) detect corresponding portions of the light, and (ii) generate respective signals;
a scanning module configured to actuate each of the plurality of transistors, wherein each of the signals is generated based on actuation of the corresponding one of the plurality of transistors; and
a processor configured to generate an image based on the signals, wherein each of the signals contributes to a corresponding portion of the image.

16. The system of claim 15 , wherein the scanning module is configured to:
select a plurality of patterns; and
move each of the plurality of transistors in a corresponding one of the plurality of patterns.

17. The system of claim 16 , wherein the one or more patterns includes a spiral pattern, a radial pattern, a circular pattern or a rectangular pattern.

18. The system of claim 15 , wherein the scanning module is configured to move one of the plurality of transistors at different sweep frequencies.

19. The system of claim 15 , wherein:
the plurality of transistors comprise a first transistor and a second transistor; and
the scanning module is configured to move (i) the first transistor at a first sweep frequency, and (ii) the second transistor at a second sweep frequency.

20. The system of claim 15 , further comprising a plurality of mechanical actuators, wherein
the scanning module is configured to move the plurality of transistors, via the plurality of mechanical actuators, to pivot each of the plurality of transistors about two corresponding orthogonal axes.

21. The system of claim 15 , further comprising:
the x-ray source configured to emit the x-rays toward an object; and
a panel detector that comprises the scintillation layer and the plurality of transistors, wherein the panel detector is (i) positioned on an opposite side of the object than the x-ray source, and (ii) configured to receive the x-rays after the x-rays have passed through the object.

22. The system of claim 15 , further comprising a glass layer disposed between the scintillation layer and the plurality of transistors.

23. The system of claim 22 , wherein:
the glass layer is configured to receive the light from the scintillation layer; and
the plurality of transistors are configured to receive the light after the light has passed through the glass layer.

24. The system of claim 23 , further comprising a mirror, wherein the plurality of transistors are disposed between the glass layer and the mirror such that the plurality of transistors are configured to receive the light after the light has reflected off of the mirror.

25. The system of claim 15 , further comprising a silicon layer and a glass layer, wherein:
the silicon layer comprises the plurality of transistors, wherein the x-rays pass through the silicon layer and are then received at the scintillation layer;
the scintillation layer is disposed between the silicon layer and the glass layer; and
the plurality of transistors

Assignees

• Medtronic Navigation Inc

Inventors

• Barbato Louis J
• Helm Patrick A
• Shah Jigney

Classifications

• A61B6/032

  Transmission computed tomography [CT] · CPC title

• G01T1/2964 Primary

  Scanners (using scintigraphy G01T1/166) · CPC title

• G01N23/04

  and forming images of the material · CPC title

• A61B6/4233

  using matrix detectors · CPC title

• A61B6/4208 Primary

  characterised by using a particular type of detector · CPC title