Wiring board, and electronic device

Patent metadata

Field	Value
Publication number	US-9883589-B2
Application number	US-201414764795-A
Country	US
Kind code	B2
Filing date	Jul 30, 2014
Priority date	Jul 30, 2013
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

A wiring board has an insulation base plate, and a plurality of electrodes provided adjacent to each other in plan view on the insulation base plate, the electrodes have an opening in the outer periphery and a slit oriented from the outer periphery to the interior, and, among two electrodes adjacent to each other, the slit in one electrode has a central line intersecting the outer periphery of the other electrode.

First claim

The invention claimed is:

1. A wiring board, comprising:
an insulation base plate; and
a plurality of electrodes provided adjacent to each other on the insulation base plate;
the electrodes each comprising a respective slit that includes an opening on an outer peripheral edge of the electrode and is oriented towards an interior portion of the electrode, wherein a first central line drawn from a first slit in a first electrode of a pair of adjacent electrodes intersects with the outer peripheral edge of a second electrode of the pair, a second central line drawn from a second slit in the second electrode in with the outer peripheral edge of the first electrode, and the first central line and the second central line irrtersect with each other, and
wherein a gap between the first electrode and the second electrode is greater at an electrode top surface side than at an insulation base plate side of the first electrode and the second electrode.

2. The wiring board according to claim 1 , wherein the first slit comprises the opening at a first end, and is closed at a second end.

3. The wiring board according to claim 2 , wherein the first slit extends towards a center of the first electrode.

4. The wiring board according to claim 3 , wherein the first electrode has a rectangular shape, and the first end of the first slit is in a corner of the first electrode.

5. The wiring board according to claim 3 , wherein the second end of the first slit is situated in a central portion of the first electrode.

6. The wiring board according to claim 2 , wherein a width of the first slit at the opening is greater than the width of the first slit at the second end.

7. The wiring board according to claim 6 , wherein the width of the first slit gradually increases from the second end of the first slit towards the opening of the firs slit.

8. The wiring board according to claim 1 , wherein the first electrode comprises a plurality of slits, each slit in the plurality starting at a periphery of the first electrode and extending towards an interior portion of the first electrode.

9. The wiring board according to claim 1 , wherein a width of the first slit is greater at the electrode top surface side than at the insulation base plate side.

10. An electronic device, comprising:
the wiring board described in claim 1 ; and
a plurality of electronic components mounted on each of the electrodes of the wiring board.

11. The electronic device according to claim 10 , wherein the first slit overlaps with at least one of the electronic components.

Assignees

• Kyocera Corp

Inventors

• Kawasaki Kouichi

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/931

  Shapes of bond pads · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W76/47

  Solid or gel fillings · CPC title