Fabric signal path structures for flexible devices

Patent metadata

Field	Value
Publication number	US-9883583-B2
Application number	US-201514843617-A
Country	US
Kind code	B2
Filing date	Sep 2, 2015
Priority date	Sep 2, 2015
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

An electronic device such as a cover for a portable device may be provided with a body having hinge portions. The hinge portions may allow the body to bend about one or more bend axes. The cover may have electrical components such as a keyboard. A keyboard may be mounted at one end of the cover and a connector may be mounted at an opposing end of the cover. A flexible fabric signal path structure may be formed from metal traces on a flexible fabric substrate. At one end of the cover, the flexible fabric signal path structure may be coupled to a printed circuit in the keyboard using conductive adhesive. At the opposing end of the cover, the metal traces on the flexible fabric substrate may be coupled to the connector.

First claim

What is claimed is:

1. A flexible fabric signal path structure for conveying signals in an electronic device, comprising:
a fabric substrate; and
a layer of metal on the fabric substrate that is patterned to form a plurality of parallel metal traces, wherein the layer of metal penetrates through openings in the fabric substrate.

2. The flexible fabric signal path structure defined in claim 1 wherein the fabric substrate comprises a woven fabric layer.

3. The flexible fabric signal path structure defined in claim 2 wherein the woven fabric layer comprises polymer strands of material.

4. The flexible fabric signal path structure defined in claim 3 wherein the polymer strands of material comprise nylon.

5. The flexible fabric signal path structure defined in claim 3 wherein the layer of metal includes multiple metal layers of different metals.

6. The flexible fabric signal path structure defined in claim 3 wherein the layer of metal includes at a first metal layer and a second metal layer on the first metal layer.

7. The flexible fabric signal path structure defined in claim 6 wherein the first metal layer comprises a metal selected from the group consisting of: copper and nickel.

8. The flexible fabric signal path structure defined in claim 7 wherein the second layer comprises a material selected from the group consisting of silver, copper, and tin.

9. The flexible fabric signal path structure defined in claim 3 wherein the layer of metal comprises multiple layers of metal selected from the group consisting of: electroless metal and electrolytic plated metal.

10. The flexible fabric signal path structure defined in claim 1 wherein the metal traces have widths of greater than 0.5 cm.

11. A cover for an electronic device, comprising:
a body having hinge portions that allow the body to bend about at least one bend axis;
electrical contacts formed on an outer surface of the body; and
a flexible fabric signal path structure within the body that overlaps the bend axis and that has signal paths that carry signals across the bend axis, wherein the signal paths are electrically coupled to the electrical contacts.

12. The cover defined in claim 11 further comprising:
a printed circuit having metal pads; and
conductive adhesive interposed between the signal paths on the flexible fabric signal path structure and the printed circuit to electrically couple the signal paths to the metal pads on the printed circuit.

13. The cover defined in claim 12 further comprising insulating adhesive that surrounds the conductive adhesive.

14. The cover defined in claim 13 further comprising key switches mounted on the printed circuit that form part of a keyboard.

15. The cover defined in claim 14 wherein the flexible fabric signal path structure has first and second opposing ends, wherein the conductive adhesive is formed at the first end, wherein the cover further comprises a connector that is coupled to the flexible fabric signal path structure at the second end, and wherein the electrical contacts form part of the connector.

16. The cover defined in claim 15 wherein the signal paths comprise conductive strands of material and wherein the flexible fabric signal path structure comprises a layer of fabric that includes the strands material.

17. The cover defined in claim 15 wherein the flexible fabric signal path structure has a fabric substrate and wherein the signal paths comprise metal traces on the fabric substrate.

18. The cover defined in claim 17 wherein the metal traces comprise electroplated metal.

19. The cover defined in claim 18 wherein the metal traces run perpendicular to the bend axis and wherein the fabric substrate comprises strands of material that are oriented at a non-zero angle of 1-10° from the bend axis.

20. A cover for a tablet computer, comprising:
a body having opposing first and second ends and having a hinge portion that allows the body to bend about a bend axis at a location between the first and second ends;
a keyboard having a printed circuit;
a connector; and
a flexible fabric signal path structure in the body that has metal traces that are coupled to the keyboard at the first and that are coupled to the connector at the second end.

21. The cover defined in claim 20 wherein the flexible fabric signal path structure comprises a woven fabric coated with electroplated metal traces that carry signals between the keyboard and the connector.

22. The cover defined in claim 21 wherein the metal traces have widths that are greater than 0.5 cm.

Assignees

• Apple Inc

Inventors

• Cousins Benjamin A
• Stiehl Kurt R
• Smith Samuel G
• Mayer Kirk M
• Hegde Siddhartha
• Kuna Melody

Classifications

• H05K3/108

  by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241) · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title