Multi-stepped boat assembly for receiving semiconductor packages

Patent metadata

Field	Value
Publication number	US-9881822-B2
Application number	US-201514856048-A
Country	US
Kind code	B2
Filing date	Sep 16, 2015
Priority date	Sep 19, 2014
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

A multi-stepped boat assembly includes a stack boat having at least one stack hole configured to receive a first semiconductor package and a second semiconductor package vertically stacked on the first semiconductor package in the stack hole. A guide boat has at least one guide hole vertically aligned with the at least one stack hole. The guide boat is removably attachable to the stack boat. An inner sidewall of the stack hole includes a first step configured to receive the first semiconductor package, and a second step provided on the first step and configured to receive the second semiconductor package. The guide hole extends toward the stack hole to guide movement of the first semiconductor package to the first step.

First claim

What is claimed is:

1. A multi-stepped boat assembly for receiving a semiconductor package, the multi-stepped boat assembly comprising:
a stack boat having at least one stack hole configured to receive a first semiconductor package and a second semiconductor package that is configured to be vertically stacked on the first semiconductor package in the at least one stack hole; and
a guide boat having at least one guide hole vertically aligned with the at least one stack hole, the guide boat being removably attachable to the stack boat,
wherein an inner sidewall of the at least one stack hole comprises:
a first step configured to receive the first semiconductor package; and
a second step provided on the first step and configured to receive the second semiconductor package,
wherein the first step comprises: a first support surface configured to support the first semiconductor package; and a first inner sidewall extending from the first support surface toward the second step,
wherein the guide boat further comprises:
a vertical portion forming an outer wall of the at least one guide hole and configured to be inserted into the at least one stack hole such that the vertical portion is supported by the second step; and
a horizontal portion connected to the vertical portion and configured to be supported by a top end of the stack boat, and
wherein the vertical portion of the outer wall of the at least one guide hole extends toward the at least one stack hole to guide movement of the first semiconductor package to the first step.

2. The multi-stepped boat assembly of claim 1 ,
wherein the second step comprises: a second support surface configured to support the second semiconductor package; and a second inner sidewall extending from the second support surface, and
wherein the first support surface and the second support surface are horizontal.

3. The multi-stepped boat assembly of claim 2 , wherein the first inner sidewall and the second inner sidewall extend vertically.

4. The multi-stepped boat assembly of claim 3 , wherein the first inner sidewall further comprises a top end portion inclined upward such that a width of the at least one stack hole increases as a distance from the first support surface increases.

5. The multi-stepped boat assembly of claim 2 , wherein the first inner sidewall is inclined upward such that a width of the at least one stack hole increases as a distance from the first support surface increases, and
wherein the second inner sidewall is vertical.

6. The multi-stepped boat assembly of claim 2 , wherein the inner sidewall of the at least one stack hole further comprises: an upper inner sidewall extending from the second step, and
wherein the upper inner sidewall is inclined upward such that a width of the at least one stack hole increases as a distance from the second step increases.

7. The multi-stepped boat assembly of claim 1 ,
wherein the first support surface is horizontal and the first inner sidewall is inclined, and
wherein the second step comprises: a second inner sidewall extending from the first inner sidewall positioned between the first support surface and the second inner sidewall, the second inner sidewall is perpendicular to the first support surface.

8. The multi-stepped boat assembly of claim 7 , wherein the first inner sidewall comprises vertical portions, and the vertical portions have a bottom end portion that corresponds to the first inner sidewall.

9. The multi-stepped boat assembly of claim 1 , wherein the at least one guide hole includes a vertical lower inner sidewall and an inclined upper inner sidewall, and
wherein the inclined upper inner sidewall of the at least one guide hole is inclined upward such that a width of the at least one guide hole increases as a distance from the vertical lower inner sidewall increases.

10. A multi-stepped boat assembly for receiving a semiconductor package, the multi-stepped boat assembly comprising:
a stack boat having a plurality of stack holes, each of the stack holes configured to receive a first semiconductor package and a second semiconductor package vertically stacked on the first semiconductor package in each of the plurality of the stack holes; and
a guide boat having a plurality of guide holes vertically aligned with the plurality of stack holes, the guide boat being removably attachable to the stack boat,
wherein each of the plurality of stack holes has an inner sidewall having a multi-step configuration, and
wherein each of the plurality of guide holes has a vertical lower inner sidewall and an inclined upper inner sidewall;
wherein the inner sidewall of each of the plurality of stack holes comprises a first portion defining a first hole width that is configured to receive the first semiconductor package and a second portion defining a second hole width that is different from the first hole width and is configured to receive the second semiconductor package on the first semiconductor package; and
wherein each of the plurality of guide holes of the guide boat comprise vertical portions that are configured to extend into the second portion of respective ones of the plurality of stack holes of the stack boat when the guide boat is attached to the stack boat to thereby guide the first semiconductor package to the first portion of a respective one of the plurality of stack holes.

11. The multi-stepped boat assembly of claim 10 , wherein the multi-step configuration comprises:
a first step comprising: a first support surface supporting the first semiconductor package; and a first inner sidewall vertically extending from the first support surface; and
a second step provided on the first step, the second step comprising: a second support surface supporting the second semiconductor package; and
a second inner sidewall vertically extending from the second support surface,
wherein the first support surface and the second support surface are horizontal.

12. The multi-stepped boat assembly of claim 11 , wherein the first inner sidewall further comprises: an inclined top end portion extending in a direction away from the first support surface so as to be connected to the second support surface.

13. The multi-stepped boat assembly of claim 10 , wherein the multi-step configuration comprises:
a first step comprising: a first support surface supporting the first semiconductor package; and a first inner sidewall extending from the first support surface; and
a second step provided on the first step, the second step comprising: a second support surface supporting the second semiconductor package; and a second inner sidewall vertically extending from the second support surface,
wherein the first support surface and the second support surface are horizontal, and
wherein the first inner sidewall is inclined.

14. The multi-stepped boat assembly of claim 10 , wherein the multi-step configuration comprises:
a first step comprising: a first support surface supporting the first semiconductor package; and a first inner sidewall extending from the first support surface; and
a second step provided on the first step, the second step comprising: a second inner sidewall extending from the first inner sidewall positioned between the first support surface and the second inner sidewall,
wherein the first support surface is horizontal,
wherein the first inner sidewall is inclined, and
wherein the second inner sidewall is perpendicular to the first support surface.

15. The multi-stepped boat assembly of claim 10 , wherein the inner sidewall of each of the plurality of stack holes further comprises an inclined surfac

Assignees

• Kim Sunrak
• Im Hohyeuk
• Samsung Electronics Co Ltd

Inventors

• Kim Sunrak
• Im Hohyeuk

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10P72/16 Primary

  Trays for chips · CPC title

• H01L21/67333 Primary

  Electricity · mapped topic