Method for manufacturing master mold, master mold manufactured thereby, method for manufacturing transparent photomask, transparent photomask manufactured thereby, and method for forming conductive mesh pattern using transparent photomask

Patent metadata

Field	Value
Publication number	US-9880461-B2
Application number	US-201515112586-A
Country	US
Kind code	B2
Filing date	Feb 13, 2015
Priority date	Feb 13, 2014
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

The present invention relates to a method for manufacturing a master mold, a master mold manufactured by the method, a method for manufacturing a transparent photomask, a transparent photomask manufactured by the method, and a method for manufacturing a conductive mesh pattern by using the transparent photomask.

First claim

The invention claimed is:

1. A method for manufacturing a master mold, comprising:
a) forming a first photosensitive material layer on a base substrate;
b) forming a first photosensitive material pattern layer by making a transparent photomask, in which linear patterns are carved, be in contact with an upper surface of the first photosensitive material layer;
c) forming a second photosensitive material layer on the base substrate provided with the first photosensitive material pattern layer;
d) making the transparent photomask, in which the linear patterns are carved, be in contact with an upper surface of the second photosensitive material layer, so that the linear pattern of the first photosensitive material pattern layer crosses the linear pattern of the transparent photomask to form a second photosensitive material pattern layer on the base substrate;
e) etching portions of the base substrate on which the first photosensitive material pattern layer and the second photosensitive material pattern layer are not formed; and
f) removing the first photosensitive material pattern layer and the second photosensitive material pattern layer.

2. The method of claim 1 , wherein the base substrate in step a) includes a conductive layer provided on one surface thereof, and
step e) is a step of manufacturing conductive mesh patterns by etching portions of the conductive layer on which the first photosensitive material pattern layer and the second photosensitive material pattern layer are not formed, and
the method further comprises:
g) etching a portion of the base substrate on which the conductive mesh patterns are not formed after step f), and
h) removing the conductive mesh patterns.

3. A master mold manufactured according to claim 1 , and having convex mesh patterns having a line width of 100 nm or more and 900 nm or less,
wherein the master mold is a master mold having integrated convex mesh patterns or a master mold having convex conductive mesh patterns on the base substrate.

4. A method for manufacturing a transparent photomask, comprising:
1) forming a first photosensitive material layer on a base substrate;
2) forming a first photosensitive material pattern layer by making a transparent photomask, in which linear patterns are carved, be in contact with an upper surface of the first photosensitive material layer;
3) forming a second photosensitive material layer on the base substrate provided with the first photosensitive material pattern layer;
4) making the transparent photomask, in which the linear patterns are carved, be in contact with an upper surface of the second photosensitive material layer, so that the linear pattern of the first photosensitive material pattern layer crosses the linear pattern of the transparent photomask to form a second photosensitive material pattern layer on the base substrate;
5) etching portions of the base substrate on which the first photosensitive material pattern layer and the second photosensitive material pattern layer are not formed;
6) manufacturing a master mold having convex mesh patterns by removing the first photosensitive material pattern layer and the second photosensitive material pattern layer;
7) forming a transparent resin layer on the master mold; and
8) removing the transparent resin layer from the master mold.

5. The method of claim 4 , wherein the base substrate in step 1) includes a conductive layer provided on one surface thereof, and
step 5) is a step of manufacturing conductive mesh patterns by etching portions of the conductive layer on which the first photosensitive material pattern layer and the second photosensitive material pattern layer are not formed.

6. The method of claim 5 , further comprising:
etching a portion of the base substrate on which the conductive mesh patterns are not formed after step 6); and
removing the conductive mesh patterns.

7. The method of claim 4 , further comprising:
forming a third photosensitive material layer on the base substrate provided with the first photosensitive material pattern layer and the second photosensitive material pattern layer after step 4); and
forming a third photosensitive material pattern layer on the base substrate.

8. A transparent photomask manufactured according to claim 4 , and having concave mesh patterns having a line width of 100 nm or more and 900 nm or less.

9. The transparent photomask of claim 8 , wherein a depth of the concave mesh pattern is 50 nm or more and 10 μm or less.

10. The transparent photomask of claim 8 , wherein a pitch of the concave mesh pattern is 2 μm or more and 500 μm or less.

11. The transparent photomask of claim 8 , wherein the transparent photomask includes at least one of polydimethylsiloxane (PDMS)-based polymer, polymethyl methacrylate (PMMA), polyurethane acrylate (PUA), polystyrene (PS), polycarbonate (PC), polyvinyl alcohol (PVA), cyclicolefin copolymer (COP), polyethylene terephthalate (PET), and polyvinyl butadiene (PVB), or a copolymer thereof.

12. The transparent photomask of claim 8 , further comprising:
an opaque pattern layer provided on a surface of the transparent photomask in which the concave mesh patterns are carved.

13. The transparent photomask of claim 12 , wherein a pattern of the opaque pattern layer is a router pattern.

14. The transparent photomask of claim 12 , wherein the opaque pattern layer includes a metal or carbon-based material.

15. The transparent photomask of claim 8 , comprising:
a hollow cylindrical base substrate;
a blanket provided on an external peripheral surface of the base substrate, and having concave mesh patterns having a line width of 100 nm or more and 900 nm or less; and
an ultraviolet lamp provided inside the cylindrical base substrate.

16. A method of manufacturing a conductive mesh pattern, comprising:
{circle around (a)} forming a photosensitive material layer on a conductive layer of a base substrate including the conductive layer;
{circle around (b)} forming a photosensitive material mesh pattern layer by making the transparent photomask of claim 15 be in contact with an upper surface of the photosensitive material layer;
{circle around (c)} etching a portion of the conductive layer on which the photosensitive material mesh pattern layer is not formed; and
{circle around (d)} removing the photosensitive material mesh pattern layer to manufacture conductive mesh patterns.

17. The method of claim 16 , wherein step {circle around (b)} includes a step of irradiating ultraviolet rays onto the transparent photomask one time after the transparent photomask is in contact with the upper surface of the photosensitive material layer.

18. The method of claim 17 , wherein intensity of the ultraviolet rays is 10 mJ/cm2 or more and 200 mJ/cm2 or less.

19. The method of claim 16 , wherein a line width of the conductive mesh pattern is 100 nm or more and 900 nm or less.

20. The method of claim 16 , wherein the conductive layer includes at least one metal of silver (Ag), copper (Cu), aluminum (Al), gold (Au), nickel (Ni), titanium (Ti), molybdenum (Mo), tungsten (W), chrome (Cr), and platinum (Pt), or an alloy of two or more metals thereof.

Assignees

• Lg Chemical Ltd

Inventors

• Park Jeongho
• Jung Jinmi
• Jeong Yujin
• Shin Bu Gon

Classifications

• G06F2203/04112

  Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material · CPC title

• G06F2203/04102

  Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper · CPC title

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• G03F1/68

  Preparation processes not covered by groups G03F1/20 - G03F1/50 · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title