Fiber-optic feedthroughs for superconducting systems

Patent metadata

Field	Value
Publication number	US-9880365-B2
Application number	US-201514932739-A
Country	US
Kind code	B2
Filing date	Nov 4, 2015
Priority date	Nov 4, 2015
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

Interconnect systems for coupling a first system operating in a first type of environment (e.g., a cryogenic environment) to a second system operating in a second type of environment (e.g., a non-cryogenic environment) are provided. An interconnect system includes a first connector coupled to optical fibers that are coupled to the first system operating in the first type of environment. The interconnect system further includes a second connector coupled to optical fibers that are coupled to the second system operating in the second type of environment. The interconnect system may include an optical window configured to couple optical signals between the optical fibers, and the optical window is configured to maintain a vacuum seal between the first type of environment and the second type of environment such that the first type of environment is substantially thermally isolated from the second type of environment.

First claim

What is claimed is:

1. An interconnect system for coupling at least a first system operating in a cryogenic environment to at least a second system operating in a non-cryogenic environment, the interconnect system comprising:
at least a first interface portion coupled to at least a first set of optical fibers, wherein the at least the first set of the optical fibers is coupled to the at least the first system operating in the cryogenic environment, wherein the first interface portion comprises at least a first alignment hole;
at least a second interface portion coupled to at least a second set of optical fibers, wherein the at least the second set of the optical fibers is coupled to the at least the second system operating in the non-cryogenic environment, wherein the second interface portion comprises at least a second alignment hole; and
at least one structure comprising: (1) at least one wall portion for separating the cryogenic environment from the non-cryogenic environment, and wherein the wall portion comprises at least a first alignment pin corresponding to the at least the first alignment hole associated with the first interface portion and at least a second alignment pin corresponding to the at last the second alignment hole associated with the second interface portion, and (2) at least one optical window, wherein the at least one optical window comprises a plurality of lenses configured to couple optical signals between the at least the first set of the optical fibers and the at least the second set of the optical fibers to permit bi-directional transfer of signals between the at least the first system operating in the cryogenic environment and the at least the second system operating in the non-cryogenic environment, and wherein the at least one optical window is configured to maintain a vacuum seal between the cryogenic environment and the non-cryogenic environment such that the cryogenic environment is substantially thermally isolated from the non-cryogenic environment.

2. The interconnect system of claim 1 , wherein the at least the first system is based on superconducting logic devices.

3. The interconnect system of claim 1 , wherein the at least second system is at least based on complimentary metal-oxide semiconductor (CMOS) logic devices.

4. The interconnect system of claim 1 , wherein the cryogenic environment corresponds to a temperature in a range of 4 Kelvin to 77 Kelvin.

5. The interconnect system of claim 1 , wherein the non-cryogenic environment corresponds to a temperature in a range of 200 Kelvin to 400 Kelvin.

6. The interconnect system of claim 1 , wherein the plurality of lenses is configured as an array of lenses.

7. The interconnect system of claim 6 , wherein each of the at least the first set of the optical fibers comprises a first lensed end and wherein each of the at least the second set of the optical fibers comprises a second lensed end, and wherein each of the plurality of lenses is positioned to process light rays traveling between the at least one of the first lensed and the second lensed end.

8. An interconnect system for coupling at least a first system operating in a cryogenic environment to at least a second system operating in a non-cryogenic environment, the interconnect system comprising:
at least a first connector coupled via a first connector boot to at least a first set of optical fibers, wherein the at least the first set of the optical fibers is coupled to the at least the first system operating in the cryogenic environment;
at least a second connector coupled via a second connector boot to at least a second set of optical fibers, wherein the at least the second set of the optical fibers is coupled to the at least the second system operating in the non-cryogenic environment;
at least a first port for coupling to the at least the first connector, and at least a second port for coupling to the at least the second connector, wherein each of the at least the first connector, the at least the second connector, the at least the first port, and the at least the second port is formed using a polymer;
a first optical sub-system comprising a first plurality of lenses and a second optical sub-system comprising a second plurality of lenses; and
at least one optical window, wherein the first optical sub-system is arranged on a first side of the at least one optical window and the second optical sub-system is arranged on a second side of the at least one optical window, wherein the first side is opposite of the second side, and wherein each of the first optical sub-system and the second optical sub-system is configured to couple optical signals between the at least the first set of the optical fibers and the at least the second set of the optical fibers to permit bi-directional transfer of signals between the at least the first system operating in the cryogenic environment and the at least the second system operating in the non-cryogenic environment, and wherein the at least one optical window is configured to maintain a vacuum seal between the cryogenic environment and the non-cryogenic environment such that the cryogenic environment is substantially thermally isolated from the non-cryogenic environment.

9. The interconnect system of claim 8 , wherein the at least the first system is based on superconducting logic devices.

10. The interconnect system of claim 8 , wherein the at least second system is at least based on complimentary metal-oxide semiconductor (CMOS) logic devices.

11. The interconnect system of claim 8 , wherein the cryogenic environment corresponds to a temperature in a range of 4 Kelvin to 77 Kelvin.

12. The interconnect system of claim 8 , wherein the non-cryogenic environment corresponds to a temperature in a range of 200 Kelvin to 400 Kelvin.

13. The interconnect system of claim 8 , wherein each of the at least the first set of the optical fibers comprises a first lensed end and wherein each of the at least the second set of the optical fibers comprises a second lensed end.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Goutzoulis Anastasios P
• Chorosinski Leonard
• Venetos Mario J

Classifications

• H03K19/195

  using superconductive devices · CPC title

• G02B6/4248 Primary

  Feed-through connections for the hermetical passage of fibres through a package wall (see provisionally also G02B6/4428) · CPC title

• H03K19/0948

  using CMOS {or complementary insulated gate field-effect transistors} · CPC title

• G02B6/3825

  with an intermediate part, e.g. adapter, receptacle, linking two plugs · CPC title

• G02B6/3897

  Connectors fixed to housings, casing, frames or circuit boards (G02B6/44528 takes precedence) · CPC title