Semiaromatic polyamide resin composition and molded body formed by molding same

Patent metadata

Field	Value
Publication number	US-9879127-B2
Application number	US-201414769206-A
Country	US
Kind code	B2
Filing date	Mar 19, 2014
Priority date	Mar 21, 2013
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

Disclosed is a semiaromatic polyamide resin composition including a semiaromatic polyamide (A), a phosphorus-based flame retardant (B) and an inorganic aluminum compound (C), wherein the mass ratio (A/B) between (A) and (B) is 50/50 to 95/5; the amount of the inorganic aluminum compound (C) is 0.1 to 20 parts by mass in relation to 100 parts by mass of the total amount of (A) and (B); (A) is constituted with an aromatic dicarboxylic acid component, an aliphatic diamine component and a monocarboxylic acid component; and the content of the monocarboxylic acid component is 0.3 to 4.0 mol % in relation to the whole monomer components constituting (A).

First claim

The invention claimed is:

1. A semiaromatic polyamide resin composition comprising: a semiaromatic polyamide (A), a phosphorus-based flame retardant (B), an inorganic aluminum compound (C), and a phosphazene compound,
wherein a mass ratio (A/B) between the semiaromatic polyamide (A) and the phosphorus-based flame retardant (B) is 50/50 to 95/5;
an amount of the inorganic aluminum compound (C) is 0.1 to 20 parts by mass in relation to 100 parts by mass of a total amount of the semiaromatic polyamide (A) and the phosphorus-based flame retardant (B);
the semiaromatic polyamide (A) consists of an aromatic dicarboxylic acid component, an aliphatic diamine component and a monocarboxylic acid component;
the aliphatic diamine component is 1,10-decanediamine;
the monocarboxylic acid component includes a monocarboxylic acid having a molecular weight of 140 or more; and
a content of the monocarboxylic acid component is 0.3 to 4.0 mol % in relation to whole monomer components constituting the semiaromatic polyamide (A).

2. The semiaromatic polyamide resin composition according to claim 1 , wherein the monocarboxylic acid component includes an aliphatic monocarboxylic acid.

3. The semiaromatic polyamide resin composition according to claim 2 , wherein the aliphatic monocarboxylic acid is stearic acid.

4. The semiaromatic polyamide resin composition according to claim 1 , wherein the aromatic dicarboxylic acid component includes terephthalic acid.

5. The semiaromatic polyamide resin composition according to claim 1 , wherein the phosphorus-based flame retardant (B) is a phosphinic acid salt and/or a diphosphinic acid salt.

6. The semiaromatic polyamide resin composition according to claim 5 , wherein the phosphinic acid salt is a compound represented by the following general formula (I), and the diphosphinic acid salt is a compound represented by the following general formula (II):

wherein in the formulas, R 1 , R 2 , R 4 and R 5 each independently represent a linear or branched alkyl group having 1 to 16 carbon atoms and/or a phenyl group; R 3 represents a linear or branched alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 10 carbon atoms, an arylalkylene group or an alkylarylene group; M represents a calcium ion, an aluminum ion, a magnesium ion or a zinc ion; m is 2 or 3; and n, a and b are integers satisfying a relation, 2×b=n×a.

7. The semiaromatic polyamide resin composition according to claim 1 , wherein the inorganic aluminum compound (C) is one or more selected from the group consisting of aluminum oxide, boehmite and aluminum silicate.

8. The semiaromatic polyamide resin composition according to claim 1 , further comprising a fibrous reinforcing material (D) in an amount of 5 to 200 parts by mass in relation to 100 parts by mass of a total amount of the semiaromatic polyamide (A) and the phosphorus-based flame retardant (B).

9. The semiaromatic polyamide resin composition according to claim 8 , wherein the fibrous reinforcing material (D) is one or more selected from the group consisting of glass fiber, carbon fiber and metal fiber.

10. A molded body formed by molding the semiaromatic polyamide resin composition according to claim 1 .

Assignees

• Unitika Ltd

Inventors

• MII Junichi
• Taketani Yutaka
• AMARI Taiyo
• Kamikawa Hiroo
• Kabashima Yohei

Classifications

• C08K5/521

  Esters of phosphoric acids, e.g. of H3PO4 · CPC title

• C08L77/06

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• C08K3/34

  Silicon-containing compounds · CPC title

• C08K3/22

  of metals · CPC title

• C08K7/14 Primary

  Glass · CPC title