Fabrication of tungsten MEMS structures

Patent metadata

Field	Value
Publication number	US-9878901-B2
Application number	US-201514670829-A
Country	US
Kind code	B2
Filing date	Mar 27, 2015
Priority date	Apr 4, 2014
Publication date	Jan 30, 2018
Grant date	Jan 30, 2018

Abstract

Thick (i.e., greater than two microns), fine-grained, low-stress tungsten MEMS structures are fabricated at low temperatures, particularly for so-called “MEMS last” fabrication processes (e.g., when MEMS structures are fabricated after electronic circuitry is fabricated). Means for very accurately etching structural details from the deposited tungsten layer and for strongly and stably anchoring the tungsten layer to an underlying substrate are disclosed. Also, means for removing a sacrificial layer underlying the mobile tungsten layer without damaging the tungsten or allowing it to be drawn down and stuck by surface tension is disclosed.

First claim

What is claimed is:

1. A method for fabricating a microelectromechanical systems (MEMS) device having a tungsten-based MEMS structure, the method comprising:
depositing a tungsten-based material using a grain growth inhibitor material to form a tungsten-based material layer at least two microns thick above an underlying oxide layer without first densifying the oxide layer; and
etching the tungsten-based material layer to form the tungsten-based MEMS structure.

2. A method according to claim 1 , wherein the tungsten-based MEMS structure is a releasable tungsten-based movable mass, and wherein the method further comprises removing oxide underlying the releasable tungsten-based movable mass to release the tungsten-based movable mass.

3. A method according to claim 1 , wherein the MEMS device includes electronic circuitry prior to depositing the tungsten-based material, and wherein the depositing of the tungsten-based material does not raise the temperature of the electronic circuitry above about 450° C.

4. A method according to claim 1 , wherein depositing the tungsten-based material comprises at least one of:
depositing the tungsten-based material on a target doped with the grain growth inhibitor material; or
alternately depositing a tungsten-based material layer and introducing the grain growth inhibitor material to stop vertical grain growth to a subsequently deposited tungsten-based material layer.

5. A method according to claim 4 , wherein the grain growth inhibitor material includes at least one of:
boron; or
a rare-earth metal.

6. A method according to claim 1 , wherein etching the tungsten-based material layer comprises:
etching the tungsten-based material layer using an etchant that is essentially fluorine generated from sulfur hexafluoride (SF 6 ) gas.

7. A method according to claim 1 , wherein depositing the tungsten-based material comprises:
controlling oxygen levels during the deposition of the tungsten-based material.

8. A method according to claim 1 , further comprising:
forming at least one tungsten-based anchor through the oxide layer to an underlying substrate prior to depositing the tungsten-based material to form the tungsten-based material layer, wherein the MEMS structure is anchored to the underlying substrate by the at least one tungsten-based anchor.

9. A method according to claim 8 , wherein the at least one tungsten-based anchor is a composite anchor comprising a matrix of tungsten-based anchors around 1 micron in diameter each, and wherein forming the matrix of tungsten-based anchors comprises:
patterning the oxide layer to form a patterned oxide layer including a matrix of holes of around 1 micron in diameter each through the oxide layer to the underlying substrate; and
filling the holes with tungsten-based plugs to form the matrix of tungsten-based anchors.

10. A method according to claim 8 , wherein the at least one tungsten-based anchor includes a first tungsten-based anchor, and wherein forming the first tungsten-based anchor comprises:
patterning the oxide layer by etching a cavity in the oxide layer using a plurality of etching steps that incrementally increase a width and depth of the cavity such that the cavity extends through the oxide layer to the underlying substrate and is substantially wider at the top than at the bottom; and
filling the cavity uniformly with a tungsten-based material to form the first tungsten-based anchor.

11. A method according to claim 8 , wherein the underlying substrate is a ground plane structure of the MEMS device, and wherein the at least one tungsten-based anchor is formed of substantially pure tungsten and the ground plane structure is formed of titanium-tungsten.

12. A method according to claim 8 , wherein the at least one tungsten-based anchor is filled uniformly without voids or cracks.

13. A method according to claim 8 , wherein the at least one tungsten-based anchor and the tungsten-based material layer are formed of the same tungsten-based material.

14. A method according to claim 1 , wherein the tungsten-based material is deposited at a temperature under about 500° C.

15. A method according to claim 1 , wherein the tungsten-based material is deposited at a temperature between about 400° C. and about 500° C.

16. A method for fabricating a microelectromechanical systems (MEMS) device having a tungsten-based MEMS structure, the method comprising:
a step for depositing a tungsten-based material using a grain growth inhibitor material to form a tungsten-based material layer at least two microns thick above an underlying oxide layer without first densifying the oxide layer; and
a step for etching the tungsten-based material layer to form the tungsten-based MEMS structure.

17. A method according to claim 16 , wherein the tungsten-based MEMS structure is a releasable tungsten-based movable mass, and wherein the method further comprises a step for releasing the tungsten-based movable mass.

18. A method according to claim 16 , wherein the MEMS device includes electronic circuitry prior to depositing the tungsten-based material, and wherein the step for depositing of the tungsten-based material does not raise the temperature of the electronic circuitry above about 450° C.

19. A method according to claim 16 , further comprising:
a step for forming at least one tungsten-based anchor through the oxide layer to an underlying substrate prior to depositing the tungsten-based material to form the tungsten-based material layer, wherein the MEMS structure is anchored to the underlying substrate by the at least one tungsten-based anchor.

Assignees

• Analog Devices Inc

Inventors

• Geen John A
• Molnar George M
• Davis Gregory S
• Ma Bruce
• Cole Kenneth J
• Timony James
• Flanders Kenneth

Classifications

• B81B2203/0307

  Anchors · CPC title

• B81C1/00492

  Processes for surface micromachining not provided for in groups B81C1/0046 - B81C1/00484 · CPC title

• B81C1/00325

  for reducing stress inside of the package structure · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• B81B3/0072 Primary

  For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers · CPC title