Method for producing a receptacle for a sensor element

Patent metadata

Field	Value
Publication number	US-9877396-B2
Application number	US-201414151907-A
Country	US
Kind code	B2
Filing date	Jan 10, 2014
Priority date	Jan 11, 2013
Publication date	Jan 23, 2018
Grant date	Jan 23, 2018

Abstract

A method for producing a receptacle for a sensor element, such as a combustion chamber pressure sensor, includes introducing a first amount of a pre-ceramic substance into an injection mold, forming a base layer of the receptacle by molding the pre-ceramic substance in the mold, and applying at least one conductor track to the base layer. A further amount of a pre-ceramic substance is introduced into the mold onto at least a partial region of the conductor track. A top region of the receptacle is formed directly on the base layer while at least partially covering over the conductor track by molding the further pre-ceramic substance in the injection mold. The method also includes debinding and sintering the molded body. The method forms a receptacle for a sensor element that has conductor tracks lying on the inside and incorporated in a gas-tight manner in a ceramic body.

First claim

What is claimed is:

1. A method for producing a receptacle for a sensor element, comprising:
introducing a first amount of a pre-ceramic substance into an injection mold;
forming a base layer of the receptacle by molding the pre-ceramic substance in the injection mold;
applying at least one conductor track to the base layer;
introducing a further amount of the pre-ceramic substance into the same injection mold onto at least a partial region of the base layer and of the at least one conductor track;
forming a top region of the receptacle directly on the base layer while at least partially covering over the at least one conductor track by molding the further pre-ceramic substance in the injection mold, to form a molded body; and
debinding and sintering the molded body.

2. The method according to claim 1 , wherein the pre-ceramic substance comprises zirconium dioxide, silicon dioxide, and cordierite.

3. The method according to claim 1 , wherein the at least one conductor track is applied by inmold labeling, direct screen printing, an adhesive imaging technique, doctor blading, dispensing, or tampon printing.

4. The method according to claim 1 , wherein the base layer is formed with a surface on which a serration structure is arranged.

5. The method according to claim 1 , wherein the pre-ceramic substance is introduced into an injection-molding device for the injection mold from an end face thereof.

6. The method according to claim 1 , wherein the pre-ceramic substance comprises a binder system that is a thermoplastic binder system.

7. The method according to claim 6 , wherein the binder system includes polyvinyl butyral.

8. The method according to claim 1 , wherein the pre-ceramic substance comprises a polyacrylate.

9. The method according to claim 1 , wherein the pre-ceramic substance comprises polyethylene glycol.

10. The method according to claim 1 , wherein the pre-ceramic substance comprises a solids fraction of less than or equal to 55%.

11. The method according to claim 1 , wherein the receptacle is configured for a combustion chamber pressure sensor.

12. The method according to claim 1 , wherein at least the steps of introducing a first amount, forming a base layer, applying at least one conductor track, and introducing a further amount occur in sequence.

13. A method for producing a sensor arrangement, comprising:
introducing a first amount of a pre-ceramic substance into an injection mold;
forming a base layer of a receptacle for a sensor element by molding the pre-ceramic substance in the injection mold;
applying at least one conductor track to the base layer;
introducing a further amount of the pre-ceramic substance into the same injection mold onto at least a partial region of the base layer and of the at least one conductor track;
forming a top region of the receptacle directly on the base layer while at least partially covering over the at least one conductor track by molding the further pre-ceramic substance in the injection mold, to form a molded body;
debinding and sintering the molded body; and
applying a sensor element to a receiving region of the receptacle.

14. The method according to claim 13 , wherein at least the steps of introducing a first amount, forming a base layer, applying at least one conductor track, and introducing a further amount occur in sequence.

Assignees

• Bosch Gmbh Robert

Inventors

• Loibl Thomas
• Heeren Imke

Classifications

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K3/0014 Primary

  Shaping of the substrate, e.g. by moulding · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title

• G01R1/04

  Housings; Supporting members; Arrangements of terminals · CPC title