MIM capacitor and method of making the same

Patent metadata

Field	Value
Publication number	US-9875848-B2
Application number	US-201514976973-A
Country	US
Kind code	B2
Filing date	Dec 21, 2015
Priority date	Dec 21, 2015
Publication date	Jan 23, 2018
Grant date	Jan 23, 2018

Abstract

An exemplary MIM capacitor may include a first metal plate, a dielectric layer on the first metal plate, a second metal plate on the dielectric layer, a via layer on the second metal plate, and a third metal plate on the via layer where the second metal plate has a tapered outline with a first side and a second side longer than the first side such that the second side provides a lower resistance path for a current flow.

First claim

What is claimed is:

1. A metal-insulator-metal capacitor comprising:
a first metal plate;
a first dielectric layer on the first metal plate;
a second metal plate on the first dielectric layer, the second metal plate with a tapered outline between a first side and a second side opposite the first side, and the second side being longer than the first side; and
a third metal plate on the second metal plate.

2. The metal-insulator-metal capacitor of claim 1 , wherein the second metal plate has a trapezoidal outline.

3. The metal-insulator-metal capacitor of claim 1 , wherein the first metal plate and the second metal plate have a trapezoidal outline.

4. The metal-insulator-metal capacitor of claim 1 , wherein the second metal plate has a curved trapezoidal outline.

5. The metal-insulator-metal capacitor of claim 1 , wherein the first metal plate and the second metal plate have a curved trapezoidal outline.

6. The metal-insulator-metal capacitor of claim 1 , wherein the first metal plate, the second metal plate, and the first dielectric layer form a capacitor, and the third metal plate comprises a passive device.

7. The metal-insulator-metal capacitor of claim 1 , wherein the first metal plate has a thickness of approximately 2-3 μm, the second metal plate has a thickness of approximately 1 μm, and the third metal plate has a thickness of approximately 10-20 μm.

8. The metal-insulator-metal capacitor of claim 1 , wherein the metal-insulator-metal capacitor is incorporated into a device selected from a group comprising of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, and an automotive device in an automotive vehicle, and further includes the device.

9. The metal-insulator-metal capacitor of claim 1 , further comprising:
an input port configured for a first external connection and coupled to the third metal plate; and
an output port configured for a second external connection and coupled to first metal plate.

10. The metal-insulator-metal capacitor of claim 1 , further comprising:
a fifth metal plate on the first metal plate proximate to and spaced from the third metal plate;
an input port configured for a first external connection and coupled to the third metal plate; and
an output port configured for a second external connection and coupled to fifth metal plate.

11. The metal-insulator-metal capacitor of claim 1 , further comprising:
a second dielectric layer on the first metal plate proximate to and spaced from the first dielectric layer;
a fourth metal plate on the second dielectric layer, the fourth metal plate with a tapered outline between a third side and a fourth side opposite the first side, and the third side being longer than the fourth side; and
a fifth metal plate on the fourth metal plate.

12. The metal-insulator-metal capacitor of claim 11 , wherein the second metal plate and the fourth metal plate have a trapezoidal outline.

13. The metal-insulator-metal capacitor of claim 11 , wherein the first metal plate, the second metal plate, and the fourth metal plate have a trapezoidal outline.

14. The metal-insulator-metal capacitor of claim 11 , wherein the second metal plate and the fourth metal plate have a curved trapezoidal outline.

15. The metal-insulator-metal capacitor of claim 11 , wherein the first metal plate, the second metal plate, and the fourth metal plate have a curved trapezoidal outline.

16. The metal-insulator-metal capacitor of claim 11 , wherein the first metal plate, the second metal plate, and the first dielectric layer form a first capacitor; the third metal plate comprises a passive device; the first metal plate, the fourth metal plate, and the second dielectric layer form a second capacitor; and the fifth metal plate comprises a passive device.

17. The metal-insulator-metal capacitor of claim 11 , wherein the first metal plate has a thickness of approximately 2-3 μm, the second metal plate and the fourth metal plate each have a thickness of approximately 1 μm, and the third metal plate and the fifth metal plate each have a thickness of approximately 10-20 μm.

18. The metal-insulator-metal capacitor of claim 11 , wherein the metal-insulator-metal capacitor is incorporated into a device selected from a group comprising of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, and an automotive device in an automotive vehicle, and further includes the device.

19. The metal-insulator-metal capacitor of claim 11 , further comprising:
an input port configured for a first external connection and coupled to the third metal plate; and
an output port configured for a second external connection and coupled to fifth metal plate.

20. The metal-insulator-metal capacitor of claim 11 , further comprising:
a sixth metal plate;
a third dielectric layer on the sixth metal plate;
a seventh metal plate on the third dielectric layer, the seventh metal plate with a tapered outline between a fifth side and a sixth side opposite the fifth side, and the sixth side being longer than the fifth side and the fifth metal plate extending on to the seventh metal plate;
a fourth dielectric layer on the sixth metal plate;
an eighth metal plate on the fourth dielectric layer, the eighth metal plate with a tapered outline between a seventh side and an eighth side opposite the seventh side, and the seventh side being longer than the eighth side; and
a ninth metal plate on the eighth metal plate.

21. The metal-insulator-metal capacitor of claim 20 , wherein the second metal plate, the fourth metal plate, the seventh metal plate, and the eighth metal plate have a trapezoidal outline.

22. The metal-insulator-metal capacitor of claim 20 , wherein the first metal plate, the second metal plate, the fourth metal plate, the sixth metal plate, the seventh metal plate, and the eighth metal plate have a trapezoidal outline.

23. The metal-insulator-metal capacitor of claim 20 , wherein the second metal plate, the fourth metal plate, the seventh metal plate, and the eighth metal plate have a curved trapezoidal outline.

24. The metal-insulator-metal capacitor of claim 20 , wherein the first metal plate, the second metal plate, the fourth metal plate, the sixth metal plate, the seventh metal plate, and the eighth metal plate have a curved trapezoidal outline.

25. The metal-insulator-metal capacitor of claim 20 , wherein the first metal plate, the second metal plate, and the first dielectric layer form a first capacitor; the third metal plate comprises a passive device; the first metal plate, the fourth metal plate, and the second dielectric layer form a second capacitor; the fifth metal plate comprises a passive device; the sixth metal plate, the third dielectric layer, and the seventh metal plate form a third capacitor; the sixth metal plate, the fourth dielectric layer, and the eighth metal plate form a fourth capacitor; and the ninth metal plate comprises a passive device.

26. The metal-insulator-metal capacitor of claim 20 , further comp

Assignees

• Qualcomm Inc

Inventors

• Berdy David Francis
• Kim Daeik Daniel
• Mudakatte Niranjan Sunil
• Lan Je-Hsiung Jeffrey
• Zuo Chengjie
• Yun Changhan Hobie
• Velez Mario Francisco
• Kim Jonghae

Classifications

• H10W20/496

  Capacitor integral with wiring layers · CPC title

• H01G4/33

  Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H01G4/38

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title