Chipless radio frequency identification (RFID) made using photographic process

US9874815B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9874815-B2
Application numberUS-201615154712-A
CountryUS
Kind codeB2
Filing dateMay 13, 2016
Priority dateMay 13, 2016
Publication dateJan 23, 2018
Grant dateJan 23, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for forming a structure for a radio frequency identification device includes dispensing a photosensitive compound onto a substrate. Subsequently, first portions of the photosensitive compound are exposed to a light pattern from a light source, while second portions of the photosensitive compound remain unexposed to the light source. Exposing the photosensitive compound to light reduces the photosensitive compound to a metal layer. The unexposed second portions of the photosensitive compound may be rinsed away to leave the metal layer. Processing may continue to form an RFID circuit from the metal layer, and a completed RFID transponder comprising the RFID circuit.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for forming a radio frequency identification (RFID) device, comprising: coating a layer comprising a photosensitive compound on a substrate, wherein the layer comprising the photosensitive compound has a silver concentration of from 5.0 milligrams per square meter (mg/m 2 ) to 150 mg/m 2 ; exposing first portions of the layer comprising the photosensitive compound to a light pattern from a light source to convert the first portions of the layer comprising the photosensitive compound to a metal layer while second portions of the layer comprising the photosensitive compound remain unexposed to the light pattern; removing the second portions of the layer comprising the photosensitive compound and leaving the metal layer on the substrate; forming an RFID circuit from the metal layer, wherein the forming of the RFID circuit from the metal layer forms at least one antenna; and forming a completed RFID transponder wherein, subsequent to forming the completed RFID transponder, the at least one antenna is free from an additional electrically conductive structure that would augment or enhance an electrical conductivity of the antenna. 2. The method of claim 1 , further comprising forming the light pattern by transmitting light from the light source through a patterned mask or reticle. 3. The method of claim 1 , further comprising forming the light pattern by directly writing the light pattern onto the layer comprising the photosensitive compound using a laser beam from a laser. 4. The method of claim 1 , wherein the forming of the at least one antenna from the metal layer forms at least one of a transmit antenna and a receive antenna. 5. The method of claim 1 , wherein the forming of the RFID circuit from the metal layer further comprises forming a multiresonator from the metal layer. 6. The method of claim 1 , wherein the photosensitive compound is a silver halide. 7. The method of claim 1 wherein the metal layer is a silver layer having a thickness of from 100 nanometers to 800 nanometers. 8. The method of claim 1 , wherein the layer comprising the photosensitive compound has a silver concentration of from 50 mg/m 2 to 150 mg/m 2 . 9. The method of claim 1 , wherein the layer comprising the photosensitive compound has a silver concentration of from 100 mg/m 2 to 150 mg/m 2 . 10. A method for forming a radio frequency identification (RFID) device, comprising: coating a layer comprising silver halide on a substrate, wherein the layer comprising silver halide has a silver concentration of from 5.0 milligrams per square meter (mg/m 2 ) to 150 mg/m 2 ; exposing first portions of the layer comprising silver halide to a light pattern from a light source to convert the first portions of the layer comprising silver halide to a metal layer while second portions of the layer comprising silver halide remain unexposed to the light pattern; removing the second portions of the layer comprising silver halide and leaving the metal layer on the substrate; forming an RFID circuit, wherein the RFID circuit comprises at least one antenna formed from the metal layer; and forming a completed RFID transponder wherein, subsequent to forming the completed RFID transponder, the at least one antenna is free from an additional electrically conductive structure that would augment or enhance an electrical conductivity of the antenna. 11. The method of claim 10 , further comprising forming the light pattern by transmitting light from the light source through a patterned mask or reticle. 12. The method of claim 10 , further comprising forming the light pattern by directly writing the light pattern onto the layer comprising the silver halide using a laser beam from a laser. 13. The method of claim 10 wherein the metal layer is a silver layer having a thickness of from 100 nanometers to 800 nanometers. 14. The method of claim 10 , wherein the layer comprising silver halide has a silver concentration of from 50 mg/m 2 to 150 mg/m 2 . 15. The method of claim 10 , wherein the layer comprising silver halide has a silver concentration of from 100 mg/m 2 to 150 mg/m 2 . 16. The method of claim 10 , wherein the forming of the RFID circuit from the metal layer further forms a multiresonator.

Assignees

Inventors

Classifications

  • Using an artwork, i.e. a photomask for exposing photosensitive layers · CPC title

  • G03F7/2053Primary

    using a laser (ablative removal B41C) · CPC title

  • Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

  • Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

  • with resonating marks · CPC title

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What does patent US9874815B2 cover?
A method for forming a structure for a radio frequency identification device includes dispensing a photosensitive compound onto a substrate. Subsequently, first portions of the photosensitive compound are exposed to a light pattern from a light source, while second portions of the photosensitive compound remain unexposed to the light source. Exposing the photosensitive compound to light reduces…
Who is the assignee on this patent?
Xerox Corp
What technology area does this patent fall under?
Primary CPC classification G03F7/2053. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 23 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).