DC-DC device soldering detecting apparatus and method using the same

Patent metadata

Field	Value
Publication number	US-9874599-B2
Application number	US-201414444472-A
Country	US
Kind code	B2
Filing date	Jul 28, 2014
Priority date	Mar 6, 2014
Publication date	Jan 23, 2018
Grant date	Jan 23, 2018

Abstract

Embodiments of present invention provide a DC-DC device soldering detecting apparatus. The apparatus may include a power module adapted to input a preset voltage into the DC-DC device on a circuit board, a frequency generating module adapted to input a preset clock frequency signal into the DC-DC device, and a voltage detecting and determining module adapted to detect soldering quality of the DC-DC device on the circuit board based on an output voltage of the DC-DC device.

First claim

What is claimed is:

1. A direct current to direct current (DC-DC) device soldering detecting apparatus, comprising:
a power module adapted to input a preset voltage into a DC-DC device on a circuit board;
a frequency generating module adapted to input a preset clock frequency signal into the DC-DC device; and
a voltage detecting and determining module adapted to compare an output voltage of the DC-DC device with a reference voltage, and to determine that the DC-DC device is soldered normally if the output voltage is greater than the reference voltage and determine that the DC-DC device is soldered abnormally if the output voltage is not greater than the reference voltage,
wherein:
the power module includes a docking station detecting circuit and a voltage converting circuit,
the docking station detecting circuit is adapted to determine whether the soldering and positioning of the DC-DC device on the circuit board is correct based on a common ground signal of the circuit board, and send an ON-signal to the voltage converting circuit if the soldering and positioning of the DC-DC device on the circuit board is correct, and
the voltage converting circuit is adapted to input the preset voltage into the DC-DC device upon reception of the ON-signal, and control the frequency generating module and the voltage detecting and determining module to turn on.

2. The apparatus according to claim 1 , wherein:
the docking station detecting circuit includes a first resistor, a second resistor, a third resistor, a fourth resistor, a first transistor, and a second transistor;
an end of the first resistor is connected to a first end of the first transistor;
the other end of the first resistor is connected respectively to an end of the second resistor and an end of the fourth resistor;
the other end of the second resistor is connected to a gate electrode of the first transistor;
a second end of the second transistor is connected to the other end of the fourth resistor;
a first end of the second transistor is connected to an end of the third resistor;
a gate electrode of the second transistor is connected to a second end of the first transistor; and
the other end of the third resistor is grounded.

3. The apparatus according to claim 1 , wherein:
the frequency generating module includes a timer, a fifth resistor, a sixth resistor, a first diode, a second diode, a first capacitor, and a second capacitor;
a grounding pin of the timer is connected respectively to an end of the first capacitor and an end of the second capacitor, and then grounded;
a triggering pin of the timer is connected respectively to a threshold pin of the timer, a second end of the first diode, the other end of the second capacitor, and a first end of the second diode;
a resetting pin of the timer is connected respectively to a powering pin of the timer, an end of the fifth resistor;
a controlling pin of the timer is connected to the other end of the first capacitor;
a discharging pin of the timer is connected respectively to the other end of the fifth resistor and an end of the sixth resistor; and
the other end of the sixth resistor is connected to a second end of the second diode.

4. The apparatus according to claim 1 , wherein the voltage detecting and determining module includes a seventh resistor, an eighth resistor, and an operational amplifier;
an end of the seventh resistor is connected respectively to an end of the eighth resistor and an inverted inputting end of the operational amplifier;
the other end of the seventh resistor is connected to a positive power end of the operational amplifier; and
the other end of the eighth resistor is grounded.

5. The apparatus according to claim 1 , wherein:
the power module further includes a delay circuit and a discharging circuit; and
the delay circuit is adapted to provide a time delay when the docking station detecting circuit determines that the soldering and positioning of the DC-DC device on the circuit board is correct, and cause the circuit board and the DC-DC device to discharge with respect to ground if the discharging circuit is controlled to turn on after the time delay is ended.

6. The apparatus according to claim 5 , wherein:
the discharging circuit includes a ninth resistor, a tenth resistor, and a metal-oxide-semiconductor field-effect, transistor (MOSFET);
an end of the ninth resistor is connected to a gate electrode of the MOSFET;
the other end of the ninth resistor is connected to a source electrode of the MOSFET and then grounded; and
a drain electrode of the MOSFET is connected to an end of the tenth resistor.

7. The apparatus according to claim 1 , further comprising a first alarming module,
wherein the first alarming module includes a first light-emitting diode (LED) light, which is turned on when the soldering and positioning of the DC-DC device on the circuit board is correct.

8. The apparatus according to claim 1 , further comprising a second alarming module,
wherein the second alarming module includes a second LED light and a third LED light, with the second LED light being turned on when the voltage detecting and determining module determines that the DC-DC device is soldered normally, and the third LED light being turned on when the voltage detecting and determining module determines that the DC-DC device is soldered abnormally.

9. A method of using a direct current to direct current (DC-DC) device soldering detecting apparatus according to claim 1 , the method comprising:
a voltage providing step adapted to input the preset voltage into the DC-DC device by using the power module;
a frequency signal providing step adapted to input the preset clock frequency signal into the DC-DC device by using the frequency generating module; and
a voltage detecting and determining step adapted to compare the output voltage of the DC-DC device with the reference voltage, and to determine that the DC-DC device is soldered normally if the output voltage is greater than the reference voltage and determine that the DC-DC device is soldered abnormally if the output voltage is not greater than the reference voltage,
wherein:
the voltage providing step includes a docking station detecting step and a voltage converting step,
the docking station detecting step includes (i) determining whether the soldering and positioning of the DC-DC device on the circuit board is correct based on a common ground signal of the circuit board and (ii) if the soldering and positioning of the DC-DC device on the circuit board is determined to be correct, initializing the voltage converting step by using the docking station detecting circuit, and
the voltage converting step includes (i) inputting the preset voltage into the DC-DC device upon reception of the ON-signal from the docking station detecting circuit and (ii) by using the voltage converting circuit, initializing the frequency signal providing step and the voltage detecting and determining step.

10. The method according to claim 9 , wherein:
the docking station detecting circuit includes a first resistor, a second resistor, a third resistor, a fourth resistor, a first transistor, and a second transistor;
an end of the first resistor is connected to a first end of the first transistor;
the other end of the first resistor is connected respectively to an end of the second resistor and an end of the fourth resistor;
the other end of the second resistor is connected to a gate electrode of the first transistor;
a second end of the second transistor is connected to the other end of the fourth resistor;
a first end of the second transistor is connected to an end of the third resistor;
a gate electrode of the second transi

Assignees

• Boe Technology Group Co Ltd
• Boe (Hebei) Mobile Display Tech Co Ltd

Inventors

• Zhai Wenkai
• Fan Litao
• Zhao Tianxiao
• Yang Ruifeng

Classifications

• G01R31/00

  Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere ({measuring superconductive properties G01R33/1238;} testing line transmission systems H04B3/46; testing or measuring semiconductors or solid state devices during manufacture {H10P74/00}) · CPC title

• G01R31/40

  Testing power supplies (testing photovoltaic devices H02S50/10) · CPC title

• G01R31/71 Primary

  Testing of solder joints · CPC title

• G01R31/11

  using pulse reflection methods · CPC title

• G01R31/08

  Locating faults in cables, transmission lines, or networks · CPC title