Chemical mechanical polishing pad with polishing layer and window
US-9259820-B2 · Feb 16, 2016 · US
CMP pad construction with composite material properties using additive manufacturing processes
US9873180B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9873180-B2 |
| Application number | US-201514695299-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 24, 2015 |
| Priority date | Oct 17, 2014 |
| Publication date | Jan 23, 2018 |
| Grant date | Jan 23, 2018 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
First claim
Opening claim text (preview).
The invention claimed is: 1. A polishing pad, comprising: a composite polishing pad body comprising: one or more first features formed from a first material, wherein the first material comprises a first material composition formed by depositing droplets of a second material and a third material within a plurality of layers that form at least a portion of each of the one or more first features; and a base material layer formed from a fourth material, wherein the fourth material…
Assignees
Inventors
Classifications
Operations & Transport · mapped topic
Operations & Transport · mapped topic
- B24B37/205Primary
Operations & Transport · mapped topic
Operations & Transport · mapped topic
- B24B37/26Primary
Operations & Transport · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9873180B2 cover?
- Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material o…
- Who is the assignee on this patent?
- Applied Materials Inc
- What technology area does this patent fall under?
- Primary CPC classification B24B37/205. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jan 23 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).