Method for holding brazing material during a brazing operation

US9873171B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9873171-B2
Application numberUS-201615348997-A
CountryUS
Kind codeB2
Filing dateNov 11, 2016
Priority dateDec 19, 2013
Publication dateJan 23, 2018
Grant dateJan 23, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for holding a sintering filler material during a brazing/sintering operation for repairing a damaged area of a component wherein the component is in either a bonding face down position, bonding face vertical position or bonding face up position. The method includes providing a wire mesh and attaching the wire mesh to the component in a location corresponding to the damaged area. Further, the method includes forming a gap between the wire mesh and the component. Moreover, the sintering filler material may be inside the wire mesh or both inside and outside the wire mesh in order to secure the sintering filler material to the damaged area.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for holding a sintering filler material during a sintering operation for repairing a damaged area of a component wherein the component is in either a bonding face down position, bonding face vertical position or bonding face up position, comprising: attaching a first quantity of sintering filler material to the damaged area; positioning a wire mesh over the first quantity of sintering filler material; attaching the wire mesh to a non-damaged surface of the component such that a gap portion of the wire mesh forms a gap between both the damaged and non-damaged areas of the component wherein the sintering filler material fills the gap and the wire mesh hinders creep of the sintering filler material; and attaching a second quantity of sintering filler material onto the wire mesh. 2. The method according to claim 1 further including cleaning the damaged area by performing a fluoride ion cleaning procedure for the component or localized grinding on the damaged area. 3. The method according to claim 1 wherein the sintering filler material includes a multi-layer filler structure. 4. The method according to claim 3 wherein the multi-layer filler structure includes a putty/putty two layer configuration. 5. The method according to claim 3 wherein the multi-layer filler structure includes a plural layer putty-powder/slurry configuration. 6. The method according to claim 1 wherein the wire mesh is attached to the component by a fusion welding method. 7. The method according to claim 1 wherein the wire mesh is fabricated from a material which is metallurgically compatible with sintering filler material.

Assignees

Inventors

Classifications

  • Soldering or brazing jigs, fixtures or clamping means · CPC title

  • Repairing fractures or cracked metal parts or products, e.g. castings · CPC title

  • Cleaning · CPC title

  • for positioning the molten material, e.g. confining it to a desired area · CPC title

  • Nozzles; Nozzle boxes; Stator blades; Guide conduits {, e.g. individual nozzles (nozzle boxes F01D9/047)} · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9873171B2 cover?
A method for holding a sintering filler material during a brazing/sintering operation for repairing a damaged area of a component wherein the component is in either a bonding face down position, bonding face vertical position or bonding face up position. The method includes providing a wire mesh and attaching the wire mesh to the component in a location corresponding to the damaged area. Furthe…
Who is the assignee on this patent?
Siemens Energy Inc
What technology area does this patent fall under?
Primary CPC classification B23P6/045. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 23 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).